ATE516615T1 - Herstellungsverfahren für ein system zum kontaktieren von elektronischen vorrichtungen - Google Patents

Herstellungsverfahren für ein system zum kontaktieren von elektronischen vorrichtungen

Info

Publication number
ATE516615T1
ATE516615T1 AT04804971T AT04804971T ATE516615T1 AT E516615 T1 ATE516615 T1 AT E516615T1 AT 04804971 T AT04804971 T AT 04804971T AT 04804971 T AT04804971 T AT 04804971T AT E516615 T1 ATE516615 T1 AT E516615T1
Authority
AT
Austria
Prior art keywords
main surface
production method
electronic devices
covering
core
Prior art date
Application number
AT04804971T
Other languages
English (en)
Inventor
Marco Balucani
Original Assignee
Eles Semiconductor Equipment S P A
Rise Technology S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eles Semiconductor Equipment S P A, Rise Technology S R L filed Critical Eles Semiconductor Equipment S P A
Application granted granted Critical
Publication of ATE516615T1 publication Critical patent/ATE516615T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AT04804971T 2004-12-21 2004-12-21 Herstellungsverfahren für ein system zum kontaktieren von elektronischen vorrichtungen ATE516615T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2004/053637 WO2006066620A1 (en) 2004-12-21 2004-12-21 A system for contacting electronic devices and production processes thereof

Publications (1)

Publication Number Publication Date
ATE516615T1 true ATE516615T1 (de) 2011-07-15

Family

ID=34959885

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04804971T ATE516615T1 (de) 2004-12-21 2004-12-21 Herstellungsverfahren für ein system zum kontaktieren von elektronischen vorrichtungen

Country Status (6)

Country Link
US (1) US7713871B2 (de)
EP (1) EP1839372B1 (de)
JP (1) JP4971181B2 (de)
CN (1) CN101156284B (de)
AT (1) ATE516615T1 (de)
WO (1) WO2006066620A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7718231B2 (en) * 2003-09-30 2010-05-18 International Business Machines Corporation Thin buried oxides by low-dose oxygen implantation into modified silicon
MY152599A (en) 2007-02-14 2014-10-31 Eles Semiconductor Equipment S P A Test of electronic devices at package level using test boards without sockets
EP1959265A1 (de) 2007-02-16 2008-08-20 Eles Semiconductor Equipment S.P.A. Testen von integrierten Schaltungen auf einem Wafer mit einer die Oberfläche freiliegen lassenden Kassette
US20090093113A1 (en) * 2007-10-03 2009-04-09 John Flake Electrochemical etching of through silicon vias
ITMI20081023A1 (it) * 2008-06-04 2009-12-05 Eles Semiconductor Equipment Spa Test di dispositivi elettronici con schede senza zoccoli basate su bloccaggio magnetico
IT1395336B1 (it) 2009-01-20 2012-09-14 Rise Technology S R L Dispositivo di contatto elastico per componenti elettronici a colonne collassanti
US8294265B1 (en) * 2010-03-31 2012-10-23 Amkor Technology, Inc. Semiconductor device for improving electrical and mechanical connectivity of conductive pillers and method therefor
CN102244087A (zh) * 2011-07-29 2011-11-16 贵州大学 可控功率倒装阵列led芯片及其制造方法
ITUA20162508A1 (it) * 2016-04-12 2017-10-12 Safecertifiedstructure Ingegneria S R L Metodo e dispositivo d’indagine per la misurazione di tensioni in una struttura di agglomerato
KR101845652B1 (ko) * 2017-01-17 2018-04-04 주식회사 텝스 부품 실장된 웨이퍼 테스트를 위한 하이브리드 프로브 카드

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4813129A (en) * 1987-06-19 1989-03-21 Hewlett-Packard Company Interconnect structure for PC boards and integrated circuits
US5393697A (en) * 1994-05-06 1995-02-28 Industrial Technology Research Institute Composite bump structure and methods of fabrication
EP0827190A3 (de) * 1994-06-24 1998-09-02 Industrial Technology Research Institute Höckerstruktur und Verfahren zu deren Herstellung
US5949029A (en) * 1994-08-23 1999-09-07 Thomas & Betts International, Inc. Conductive elastomers and methods for fabricating the same
US6271482B1 (en) * 1994-08-23 2001-08-07 Thomas & Betts International, Inc. Conductive elastomer interconnect
US6007349A (en) * 1996-01-04 1999-12-28 Tessera, Inc. Flexible contact post and post socket and associated methods therefor
JP4514855B2 (ja) * 1999-08-19 2010-07-28 東京エレクトロン株式会社 プロービングカードの製造方法
JP4288783B2 (ja) * 1999-09-24 2009-07-01 Ｊｓｒ株式会社 異方導電性シートおよび回路装置の電気的検査装置
US6250933B1 (en) * 2000-01-20 2001-06-26 Advantest Corp. Contact structure and production method thereof
JP2003157918A (ja) * 2001-11-19 2003-05-30 Taiko Denki Co Ltd 弾性電気接点
DE10161202C1 (de) * 2001-12-13 2003-05-08 Bosch Gmbh Robert Verfahren zur Reduktion der Dicke eines Silizium-Substrates
JP2003273314A (ja) * 2002-03-18 2003-09-26 Toyota Motor Corp マルチチップモジュールの接合方法
JP4601892B2 (ja) * 2002-07-04 2010-12-22 ラムバス・インコーポレーテッド 半導体装置および半導体チップのバンプ製造方法
JP2004053409A (ja) * 2002-07-19 2004-02-19 Matsushita Electric Ind Co Ltd プローブカード

Also Published As

Publication number Publication date
JP4971181B2 (ja) 2012-07-11
CN101156284B (zh) 2011-02-02
CN101156284A (zh) 2008-04-02
JP2008524611A (ja) 2008-07-10
WO2006066620A1 (en) 2006-06-29
EP1839372B1 (de) 2011-07-13
US7713871B2 (en) 2010-05-11
EP1839372A1 (de) 2007-10-03
US20080012114A1 (en) 2008-01-17

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Legal Events

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