ATE498907T1 - Mikrowellen-miniaturgehäuse und verfahren zur herstellung dieses gehäuses - Google Patents

Mikrowellen-miniaturgehäuse und verfahren zur herstellung dieses gehäuses

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Publication number
ATE498907T1
ATE498907T1 AT05815910T AT05815910T ATE498907T1 AT E498907 T1 ATE498907 T1 AT E498907T1 AT 05815910 T AT05815910 T AT 05815910T AT 05815910 T AT05815910 T AT 05815910T AT E498907 T1 ATE498907 T1 AT E498907T1
Authority
AT
Austria
Prior art keywords
enclosure
microwave
making
miniature
active face
Prior art date
Application number
AT05815910T
Other languages
English (en)
Inventor
Alexandre Bessemoulin
Original Assignee
United Monolithic Semiconduct
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Monolithic Semiconduct filed Critical United Monolithic Semiconduct
Application granted granted Critical
Publication of ATE498907T1 publication Critical patent/ATE498907T1/de

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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1616—Cavity shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Cookers (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Packages (AREA)
AT05815910T 2004-12-20 2005-12-07 Mikrowellen-miniaturgehäuse und verfahren zur herstellung dieses gehäuses ATE498907T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0413584A FR2879889B1 (fr) 2004-12-20 2004-12-20 Boitier miniature hyperfrequence et procede de fabrication du boitier
PCT/EP2005/056583 WO2006067045A1 (fr) 2004-12-20 2005-12-07 Boitier miniature hyperfrequence et procede de fabrication du boitier

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US (1) US20100038776A1 (de)
EP (1) EP1829105B1 (de)
JP (1) JP4794569B2 (de)
AT (1) ATE498907T1 (de)
DE (1) DE602005026448D1 (de)
ES (1) ES2363910T3 (de)
FR (1) FR2879889B1 (de)
WO (1) WO2006067045A1 (de)

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US8143654B1 (en) * 2008-01-16 2012-03-27 Triquint Semiconductor, Inc. Monolithic microwave integrated circuit with diamond layer
JP2009176930A (ja) 2008-01-24 2009-08-06 Toshiba Corp 半導体装置およびその製造方法
US8872333B2 (en) 2008-02-14 2014-10-28 Viasat, Inc. System and method for integrated waveguide packaging
US8901719B2 (en) 2009-05-08 2014-12-02 Optis Cellular Technology, Llc Transition from a chip to a waveguide port
JP2011035107A (ja) * 2009-07-31 2011-02-17 Elpida Memory Inc 半導体装置
JP5521862B2 (ja) 2010-07-29 2014-06-18 三菱電機株式会社 半導体装置の製造方法
US8592960B2 (en) * 2010-08-31 2013-11-26 Viasat, Inc. Leadframe package with integrated partial waveguide interface
GB2496835B (en) 2011-09-23 2015-12-30 Radio Physics Solutions Ltd Package for high frequency circuits
US20130119538A1 (en) * 2011-11-16 2013-05-16 Texas Instruments Incorporated Wafer level chip size package
JP2015056606A (ja) * 2013-09-13 2015-03-23 株式会社東芝 半導体装置
US20160240448A1 (en) * 2015-02-12 2016-08-18 Ampleon Netherlands B.V. RF Package
FR3077284B1 (fr) 2018-01-30 2020-03-06 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede d'encapsulation d'un dispositif microelectronique, par des substrats fins ou ultrafins, facilement manipulables
US20190311962A1 (en) * 2018-04-10 2019-10-10 Bae Systems Information And Electronic Systems Integration Inc. Heterogeneous integrated circuits with integrated covers
US10896861B2 (en) * 2019-04-22 2021-01-19 Raytheon Company Heterogeneous multi-layer MMIC assembly
US11881494B2 (en) * 2020-09-20 2024-01-23 UTAC Headquarters Pte. Ltd. Semiconductor package with dams
US11784103B2 (en) * 2020-12-09 2023-10-10 Texas Instruments Incorporated Covers for semiconductor package components
CN116495697B (zh) * 2023-06-26 2023-09-08 南京睿芯峰电子科技有限公司 含空气桥芯片的sip塑封件及其制作方法

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JPS6020538A (ja) * 1983-07-15 1985-02-01 Hitachi Ltd 半導体装置
US5323051A (en) * 1991-12-16 1994-06-21 Motorola, Inc. Semiconductor wafer level package
US5694300A (en) * 1996-04-01 1997-12-02 Northrop Grumman Corporation Electromagnetically channelized microwave integrated circuit
DE19700734B4 (de) * 1997-01-11 2006-06-01 Robert Bosch Gmbh Verfahren zur Herstellung von Sensoren sowie nicht-vereinzelter Waferstapel
JP2991168B2 (ja) * 1997-09-24 1999-12-20 日本電気株式会社 半導体装置およびその製造方法
US6946366B2 (en) * 2000-12-05 2005-09-20 Analog Devices, Inc. Method and device for protecting micro electromechanical systems structures during dicing of a wafer
AUPR245101A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd A method (WSM04)
JP3519720B2 (ja) * 2001-06-11 2004-04-19 松下電器産業株式会社 電子デバイス
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JP2004006816A (ja) * 2002-04-17 2004-01-08 Sanyo Electric Co Ltd 半導体スイッチ回路装置およびその製造方法
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JP2004312666A (ja) * 2003-03-25 2004-11-04 Fuji Photo Film Co Ltd 固体撮像装置及び固体撮像装置の製造方法

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JP2008524836A (ja) 2008-07-10
FR2879889A1 (fr) 2006-06-23
JP4794569B2 (ja) 2011-10-19
WO2006067045A1 (fr) 2006-06-29
DE602005026448D1 (de) 2011-03-31
EP1829105B1 (de) 2011-02-16
FR2879889B1 (fr) 2007-01-26
US20100038776A1 (en) 2010-02-18
EP1829105A1 (de) 2007-09-05
ES2363910T3 (es) 2011-08-19

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