ATE489843T1 - Aufklappbares gehäuse für elektronische schaltungsanordnungen - Google Patents
Aufklappbares gehäuse für elektronische schaltungsanordnungenInfo
- Publication number
- ATE489843T1 ATE489843T1 AT08100775T AT08100775T ATE489843T1 AT E489843 T1 ATE489843 T1 AT E489843T1 AT 08100775 T AT08100775 T AT 08100775T AT 08100775 T AT08100775 T AT 08100775T AT E489843 T1 ATE489843 T1 AT E489843T1
- Authority
- AT
- Austria
- Prior art keywords
- electronic circuit
- clamshell
- duct
- enclosure
- casing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
Landscapes
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
- Transmitters (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US88605707P | 2007-01-22 | 2007-01-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE489843T1 true ATE489843T1 (de) | 2010-12-15 |
Family
ID=39493898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT08100775T ATE489843T1 (de) | 2007-01-22 | 2008-01-22 | Aufklappbares gehäuse für elektronische schaltungsanordnungen |
Country Status (4)
Country | Link |
---|---|
US (1) | US20080174960A1 (de) |
EP (1) | EP1971196B1 (de) |
AT (1) | ATE489843T1 (de) |
DE (1) | DE602008003599D1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8427828B2 (en) * | 2010-07-20 | 2013-04-23 | Themis Computer | Printed circuit board module enclosure and apparatus using same |
US10408684B2 (en) * | 2017-11-10 | 2019-09-10 | Seagate Technolgy Llc | Integrated thermal management of storage drives |
GB2622384A (en) * | 2022-09-14 | 2024-03-20 | Bae Systems Plc | Ruggedisation apparatus |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US697450A (en) * | 1901-02-21 | 1902-04-15 | Corbin Cabinet Lock Company | Mail-box. |
US4888663A (en) * | 1986-03-25 | 1989-12-19 | Hughes Aircraft Company | Cooling system for electronic assembly |
US5282114A (en) * | 1991-11-05 | 1994-01-25 | Codar Technology Inc. | Ruggedized computer assembly providing accessibility and adaptability to, and effective cooling of, electronic components |
US5267611A (en) * | 1993-01-08 | 1993-12-07 | Thermacore, Inc. | Single phase porous layer heat exchanger |
DE69434917T2 (de) * | 1993-05-04 | 2007-11-08 | Foster-Miller, Inc., Waltham | Gittergestützte verbundplatte mit schaumkern |
US5829516A (en) * | 1993-12-15 | 1998-11-03 | Aavid Thermal Products, Inc. | Liquid cooled heat sink for cooling electronic components |
US6027798A (en) * | 1995-11-01 | 2000-02-22 | The Boeing Company | Pin-reinforced sandwich structure |
US5761037A (en) * | 1996-02-12 | 1998-06-02 | International Business Machines Corporation | Orientation independent evaporator |
DE69630677T2 (de) * | 1996-05-14 | 2004-09-30 | Hewlett-Packard Co. (N.D.Ges.D.Staates Delaware), Palo Alto | Einrichtung zur Kühlung von Komponenten in einem elektrischen Gerät mit interner Stromversorgungseinheit |
US5808866A (en) * | 1996-09-09 | 1998-09-15 | Gde Systems, Inc. | Ruggedized container system and method |
US5812374A (en) * | 1996-10-28 | 1998-09-22 | Shuff; Gregg Douglas | Electrical circuit cooling device |
US5790376A (en) * | 1996-11-06 | 1998-08-04 | Compaq Computer Corporation | Heat dissipating pad structure for an electronic component |
US6005772A (en) * | 1997-05-20 | 1999-12-21 | Denso Corporation | Cooling apparatus for high-temperature medium by boiling and condensing refrigerant |
US20020053421A1 (en) * | 1997-09-10 | 2002-05-09 | Kabushiki Kaisha Toshiba | Heat dissipating structure for electronic apparatus |
US5940266A (en) * | 1997-10-14 | 1999-08-17 | International Business Machines Corporation | Bi-directional cooling arrangement for use with an electronic component enclosure |
US6088225A (en) * | 1998-03-17 | 2000-07-11 | Northern Telecom Limited | Cabinet with enhanced convection cooling |
EP0992430A3 (de) * | 1998-10-07 | 2000-09-13 | Negesat Di Boer Fabrizio & C. SNC | Gehäuse mit Kühlung für Einrichtungen an Bord eines Luft- oder Raumfahrzeuges |
US6532152B1 (en) * | 1998-11-16 | 2003-03-11 | Intermec Ip Corp. | Ruggedized hand held computer |
US6242691B1 (en) * | 1999-02-03 | 2001-06-05 | Lockheed Martin Corporation | Electronic packaging and method of packaging |
US6310772B1 (en) * | 1999-09-02 | 2001-10-30 | Special Product Company | Enclosure for telecommunications equipment |
US6624432B1 (en) * | 1999-10-12 | 2003-09-23 | Shielding For Electronics, Inc. | EMI containment apparatus |
US6648063B1 (en) * | 2000-04-12 | 2003-11-18 | Sandia Corporation | Heat pipe wick with structural enhancement |
SE519476C2 (sv) * | 2000-10-30 | 2003-03-04 | Emerson Energy Systems Ab | Klimatreglering i ett utomhusskåp |
US6367543B1 (en) * | 2000-12-11 | 2002-04-09 | Thermal Corp. | Liquid-cooled heat sink with thermal jacket |
US7556086B2 (en) * | 2001-04-06 | 2009-07-07 | University Of Maryland, College Park | Orientation-independent thermosyphon heat spreader |
US20030056940A1 (en) * | 2001-09-27 | 2003-03-27 | International Business Machines Corporation | Transpiration cooled heat sink and a self contained coolant supply for same |
US6460612B1 (en) * | 2002-02-12 | 2002-10-08 | Motorola, Inc. | Heat transfer device with a self adjusting wick and method of manufacturing same |
KR20040088554A (ko) * | 2002-02-26 | 2004-10-16 | 미크로스 매뉴팩처링 인코포레이티드 | 모세관 증발기 |
US7161802B2 (en) * | 2002-08-02 | 2007-01-09 | Raytheon Company | Thermal management system having porous fluid transfer element |
US6785145B1 (en) * | 2003-07-07 | 2004-08-31 | Sidney S. Wong | Cooling duct for computer |
TWM270404U (en) * | 2004-07-13 | 2005-07-11 | Liang-Hua Wang | Heat dissipating device |
JP4265505B2 (ja) * | 2004-08-09 | 2009-05-20 | オムロン株式会社 | 電子機器の放熱構造 |
US7436661B2 (en) * | 2005-05-11 | 2008-10-14 | Microsoft Corporation | Two-compartment AC adaptor |
US7505269B1 (en) * | 2007-10-11 | 2009-03-17 | Valere Power Inc. | Thermal energy storage transfer system |
-
2008
- 2008-01-17 US US12/016,091 patent/US20080174960A1/en not_active Abandoned
- 2008-01-22 DE DE602008003599T patent/DE602008003599D1/de active Active
- 2008-01-22 EP EP08100775A patent/EP1971196B1/de not_active Not-in-force
- 2008-01-22 AT AT08100775T patent/ATE489843T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20080174960A1 (en) | 2008-07-24 |
DE602008003599D1 (de) | 2011-01-05 |
EP1971196B1 (de) | 2010-11-24 |
EP1971196A3 (de) | 2008-09-24 |
EP1971196A2 (de) | 2008-09-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |