ATE466119T1 - Metallisierung von substrat(en) durch ein flüssigkeit/ - dampfabscheidungsverfahren - Google Patents

Metallisierung von substrat(en) durch ein flüssigkeit/ - dampfabscheidungsverfahren

Info

Publication number
ATE466119T1
ATE466119T1 AT04784286T AT04784286T ATE466119T1 AT E466119 T1 ATE466119 T1 AT E466119T1 AT 04784286 T AT04784286 T AT 04784286T AT 04784286 T AT04784286 T AT 04784286T AT E466119 T1 ATE466119 T1 AT E466119T1
Authority
AT
Austria
Prior art keywords
precursor
metal
substrate
temperature
deposition process
Prior art date
Application number
AT04784286T
Other languages
English (en)
Inventor
Dennis Deavenport
John Thornton
Nam Tran
Samuel Newberg
Original Assignee
Akzo Nobel Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo Nobel Nv filed Critical Akzo Nobel Nv
Application granted granted Critical
Publication of ATE466119T1 publication Critical patent/ATE466119T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/045—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
    • C23C16/20—Deposition of aluminium only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by producing an aerosol and subsequent evaporation of the droplets or particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
AT04784286T 2003-09-19 2004-09-16 Metallisierung von substrat(en) durch ein flüssigkeit/ - dampfabscheidungsverfahren ATE466119T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50464103P 2003-09-19 2003-09-19
PCT/US2004/030376 WO2005028704A1 (en) 2003-09-19 2004-09-16 Metallization of substrate (s) by a liquid/vapor deposition process

Publications (1)

Publication Number Publication Date
ATE466119T1 true ATE466119T1 (de) 2010-05-15

Family

ID=34375529

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04784286T ATE466119T1 (de) 2003-09-19 2004-09-16 Metallisierung von substrat(en) durch ein flüssigkeit/ - dampfabscheidungsverfahren

Country Status (16)

Country Link
US (1) US7387815B2 (de)
EP (1) EP1664379B1 (de)
JP (2) JP5193466B2 (de)
KR (1) KR101162077B1 (de)
CN (1) CN1853003B (de)
AT (1) ATE466119T1 (de)
BR (1) BRPI0414547A (de)
CA (1) CA2538897C (de)
DE (1) DE602004026889D1 (de)
ES (1) ES2345109T3 (de)
MX (1) MXPA06003060A (de)
PL (1) PL1664379T3 (de)
RU (1) RU2330122C2 (de)
TW (1) TWI349953B (de)
WO (1) WO2005028704A1 (de)
ZA (1) ZA200603081B (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007004570A1 (de) 2007-01-30 2008-07-31 Daimler Ag Glänzende Beschichtungen für Aluminium- oder Stahloberflächen und deren Herstellung
WO2010049024A1 (en) * 2008-10-31 2010-05-06 Oerlikon Solar Ip Ag, Truebbach Precursor recycling
DE102008055147A1 (de) 2008-12-23 2010-07-01 Eisenwerk Erla Gmbh Verfahren zur Beschichtung von temperatur- und/oder heißmedienbeaufschlagten Bauteilen sowie heißmedien- und/oder temperaturbeaufschlagtes Bauteil
US9528182B2 (en) * 2009-06-22 2016-12-27 Arkema Inc. Chemical vapor deposition using N,O polydentate ligand complexes of metals
DE102009037116A1 (de) 2009-07-31 2011-02-03 Elringklinger Ag Metallische Dichtungslage für eine Dichtungsplatte einer Flachdichtung
WO2011012636A1 (en) 2009-07-31 2011-02-03 Akzo Nobel Chemicals International B.V. Process for the preparation of a coated substrate, coated substrate, and use thereof
US20110206844A1 (en) * 2010-02-24 2011-08-25 Jacob Grant Wiles Chromium-free passivation of vapor deposited aluminum surfaces
WO2013106006A1 (en) * 2011-03-15 2013-07-18 Directed Vapor Technologies International Method for applying aluminum alloy coatings for corrosion protection of steel
WO2012160040A1 (en) 2011-05-25 2012-11-29 Akzo Nobel Chemicals International B.V. Process for depositing metal on one or more substrates, coated substrate, and use thereof
US8728240B2 (en) * 2012-05-02 2014-05-20 Msp Corporation Apparatus for vapor condensation and recovery
KR102194821B1 (ko) * 2013-10-17 2020-12-24 삼성디스플레이 주식회사 유기물 증착 장치 및 유기물 증착 방법
EP3114250B1 (de) * 2014-03-03 2024-05-01 Picosun Oy Schutz des inneren eines gasbehälters mit einer ald-beschichtung
US9797042B2 (en) 2014-05-15 2017-10-24 Lam Research Corporation Single ALD cycle thickness control in multi-station substrate deposition systems
FR3045673B1 (fr) 2015-12-18 2020-02-28 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de depot d'un revetement par dli-mocvd avec recyclage du compose precurseur
US20170314129A1 (en) * 2016-04-29 2017-11-02 Lam Research Corporation Variable cycle and time rf activation method for film thickness matching in a multi-station deposition system
RU2618278C1 (ru) * 2016-05-04 2017-05-03 Федеральное государственное бюджетное учреждение науки Институт металлоорганической химии им. Г.А. Разуваева Российской академии наук (ИМХ РАН) Способ получения гибридного материала на основе многостенных углеродных нанотрубок, декорированных дистанционно разделенными кристаллическими наночастицами алюминия
US10697059B2 (en) 2017-09-15 2020-06-30 Lam Research Corporation Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching
JP2023501371A (ja) 2019-11-08 2023-01-18 ラム リサーチ コーポレーション 高周波電力増加によるプラズマ強化原子層堆積

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2599978A (en) 1949-04-15 1952-06-10 Ohio Commw Eng Co Process of plating carrier particles with a catalytic metal
US2671739A (en) 1949-06-22 1954-03-09 Bell Telephone Labor Inc Plating with sulfides, selenides, and tellurides of chromium, molybdenum, and tungsten
US2700365A (en) 1951-10-08 1955-01-25 Ohio Commw Eng Co Apparatus for plating surfaces with carbonyls and other volatile metal bearing compounds
US2824828A (en) 1955-05-12 1958-02-25 Ohio Commw Eng Co Colored glass fibers and method of producing the same
US3041197A (en) 1959-06-01 1962-06-26 Berger Carl Coating surfaces with aluminum
GB1025897A (en) 1962-02-09 1966-04-14 Ethyl Corp Process of metal plating
US3251712A (en) 1962-09-21 1966-05-17 Berger Carl Metal plating with a heated hydrocarbon solution of a group via metal carbonyl
US3449150A (en) 1965-03-31 1969-06-10 Continental Oil Co Coating surfaces with aluminum
US3449144A (en) 1965-09-29 1969-06-10 Continental Oil Co Method of aluminum plating with diethylaluminum hydride
US3464844A (en) 1967-03-02 1969-09-02 Continental Oil Co Aluminum plating of surfaces
US3700477A (en) 1967-04-13 1972-10-24 Hidehisa Yamagishi Method of coating steel electrostatically with aluminum powder coated with a higher fatty-acid salt
US3702780A (en) 1969-02-11 1972-11-14 Gen Technologies Corp Process of plating by pyrolytic deposition
US3578494A (en) 1969-04-09 1971-05-11 Continental Oil Co Zinc plating by chemical reduction
US3707136A (en) 1970-12-02 1972-12-26 Continental Oil Co Apparatus for plating heat-resistant articles
JPS5948952B2 (ja) 1981-03-23 1984-11-29 富士通株式会社 金属薄膜の形成方法
JPS61136681A (ja) * 1984-12-04 1986-06-24 Nec Corp 熱ｃｖｄ方法
JPH0645891B2 (ja) * 1985-12-18 1994-06-15 キヤノン株式会社 堆積膜形成法
CH671407A5 (de) * 1986-06-13 1989-08-31 Balzers Hochvakuum
GB2195663B (en) * 1986-08-15 1990-08-22 Nippon Telegraph & Telephone Chemical vapour deposition method and apparatus therefor
FR2633642B1 (fr) * 1988-07-01 1992-06-19 Cepromag Ct Rech Promo Magnes Procede de realisation d'un film protecteur sur un substrat a base de magnesium, application a la protection des alliages de magnesium, substrats obtenus
US4924701A (en) * 1988-09-06 1990-05-15 Panex Corporation Pressure measurement system
US4923717A (en) 1989-03-17 1990-05-08 Regents Of The University Of Minnesota Process for the chemical vapor deposition of aluminum
SU1680800A1 (ru) * 1989-04-11 1991-09-30 Куйбышевский политехнический институт им.В.В.Куйбышева Устройство дл нанесени покрытий из газовой фазы
DE4108731A1 (de) * 1991-03-18 1992-09-24 Solvay Barium Strontium Gmbh Neuartige erdalkalimetall-heptandionat-verbindungen
US5314727A (en) * 1992-07-28 1994-05-24 Minnesota Mining & Mfg. Co./Regents Of The University Of Minnesota Chemical vapor deposition of iron, ruthenium, and osmium
US5290602A (en) * 1992-10-19 1994-03-01 Union Carbide Chemicals & Plastics Technology Corporation Hindered-hydroxyl functional (meth) acrylate-containing copolymers particularly suitable for use in coating compositions which are sprayed with compressed fluids as viscosity reducing diluents
CA2152969A1 (en) * 1994-07-26 1996-01-27 Ping Chang Method for vacuum plasma protective treatment of metal substrates
FR2733254B1 (fr) * 1995-04-18 1997-07-18 Europ Propulsion Procede d'infiltration chimique en phase vapeur pour la densification de substrats poreux disposes en piles annulaires
US6244575B1 (en) * 1996-10-02 2001-06-12 Micron Technology, Inc. Method and apparatus for vaporizing liquid precursors and system for using same
US5951791A (en) * 1997-12-01 1999-09-14 Inco Limited Method of preparing porous nickel-aluminum structures
KR20010034781A (ko) * 1998-04-14 2001-04-25 잭 피. 샐러노 박막 증착 시스템
US6136725A (en) * 1998-04-14 2000-10-24 Cvd Systems, Inc. Method for chemical vapor deposition of a material on a substrate
US6099903A (en) * 1999-05-19 2000-08-08 Research Foundation Of State University Of New York MOCVD processes using precursors based on organometalloid ligands
US6184403B1 (en) * 1999-05-19 2001-02-06 Research Foundation Of State University Of New York MOCVD precursors based on organometalloid ligands
WO2001029282A2 (en) 1999-10-20 2001-04-26 Cvd Systems, Inc. Fluid processing system
DE10003758A1 (de) * 2000-01-28 2001-08-02 Aixtron Gmbh Vorrichtung und Verfahren zum Abscheiden wenigstens eines in flüssiger oder gelöster Form vorliegenden Prekursors
US6451375B1 (en) * 2001-01-05 2002-09-17 International Business Machines Corporation Process for depositing a film on a nanometer structure
US7267727B2 (en) * 2002-09-24 2007-09-11 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids and ultrasonic energy
US7217398B2 (en) * 2002-12-23 2007-05-15 Novellus Systems Deposition reactor with precursor recycle

Also Published As

Publication number Publication date
ZA200603081B (en) 2007-07-25
CA2538897A1 (en) 2005-03-31
JP5193466B2 (ja) 2013-05-08
CA2538897C (en) 2011-08-09
DE602004026889D1 (de) 2010-06-10
KR101162077B1 (ko) 2012-07-03
MXPA06003060A (es) 2006-05-31
US20050064211A1 (en) 2005-03-24
JP2011236507A (ja) 2011-11-24
CN1853003A (zh) 2006-10-25
WO2005028704A1 (en) 2005-03-31
JP5548168B2 (ja) 2014-07-16
ES2345109T3 (es) 2010-09-15
RU2330122C2 (ru) 2008-07-27
TW200514146A (en) 2005-04-16
JP2007505994A (ja) 2007-03-15
KR20060090978A (ko) 2006-08-17
PL1664379T3 (pl) 2010-10-29
BRPI0414547A (pt) 2006-11-07
HK1096129A1 (zh) 2007-05-25
RU2006113115A (ru) 2007-11-20
EP1664379A1 (de) 2006-06-07
TWI349953B (en) 2011-10-01
CN1853003B (zh) 2010-04-28
EP1664379B1 (de) 2010-04-28
US7387815B2 (en) 2008-06-17

Similar Documents

Publication Publication Date Title
ATE466119T1 (de) Metallisierung von substrat(en) durch ein flüssigkeit/ - dampfabscheidungsverfahren
TW200606168A (en) Copper (I) compounds useful as deposition precursors of copper thin films
WO2006057709A3 (en) Method for deposition of metal layers from metal carbonyl precursors
WO2005121397A3 (en) Controlled vapor deposition of multilayered coatings adhered by an oxide layer
WO2007140424A3 (en) Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen
DE60230741D1 (de) Substrat mit photokatalytischer beschichtung
TW200622022A (en) A method and system for forming a passivated metal layer
WO2006057706A3 (en) Method for deposition of metal layers from metal carbonyl precursors
WO2005081933A3 (en) Chemical vapor deposition of high conductivity, adherent thin films of ruthenium
TW200506107A (en) Multiple-step electrodeposition process for direct copper plating on barrier metals
TW200626748A (en) Methods for depositing tungsten layers employing atomic layer deposition techniques
TW200618066A (en) Deposition of ruthenium metal layers in a thermal chemical vapor deposition process
TW200617197A (en) Deposition of ruthenium and/or ruthenium oxide films
TW200513549A (en) Electroplating composite substrates
TW200739743A (en) A fabrication method of thin film for active layer by metal chalcogenide precursor solution
MY159272A (en) Silicon thin film solar cell having improved haze and methods of making the same
TW200609377A (en) Method for depositing thin film and thin film deposition system having separate jet orifices for spraying purge gas
JP2014502038A5 (de)
CN106170583A (zh) 气相沉积方法
TW200723369A (en) Method for enhancing growth of semi-polar (Al,In,Ga,B)N via metalorganic chemical vapor deposition
Kaiya et al. Atmospheric pressure atomic layer epitaxy of ZnO using a chloride source
FR2852971B1 (fr) Procede pour le depot par cvd d'un film d'argent sur un substrat
KR20060058099A (ko) 다이아몬드 전극의 성막방법
WO2006053362A3 (de) Verfahren zur abscheidung von schichten aus ionischen flüssigkeiten
TW200622024A (en) Copper(I) complexes for deposition of copper films by atomic layer deposition

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1664379

Country of ref document: EP