ATE427477T1 - Verfahren zur herstellung einer messvorrichtung - Google Patents

Verfahren zur herstellung einer messvorrichtung

Info

Publication number
ATE427477T1
ATE427477T1 AT00440186T AT00440186T ATE427477T1 AT E427477 T1 ATE427477 T1 AT E427477T1 AT 00440186 T AT00440186 T AT 00440186T AT 00440186 T AT00440186 T AT 00440186T AT E427477 T1 ATE427477 T1 AT E427477T1
Authority
AT
Austria
Prior art keywords
producing
measuring device
monoblock
coating
resin
Prior art date
Application number
AT00440186T
Other languages
English (en)
Inventor
Remy Kirchdoerffer
Original Assignee
Remy Kirchdoerffer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Remy Kirchdoerffer filed Critical Remy Kirchdoerffer
Application granted granted Critical
Publication of ATE427477T1 publication Critical patent/ATE427477T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/003—Fluidic connecting means using a detachable interface or adapter between the process medium and the pressure gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Ropes Or Cables (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Valve-Gear Or Valve Arrangements (AREA)
AT00440186T 1999-06-24 2000-06-20 Verfahren zur herstellung einer messvorrichtung ATE427477T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9908203A FR2795520B1 (fr) 1999-06-24 1999-06-24 Procede de fabrication d'un dispositif du type instrument ou appareil de mesure ou de detection et dispositifs resultants

Publications (1)

Publication Number Publication Date
ATE427477T1 true ATE427477T1 (de) 2009-04-15

Family

ID=9547352

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00440186T ATE427477T1 (de) 1999-06-24 2000-06-20 Verfahren zur herstellung einer messvorrichtung

Country Status (6)

Country Link
US (1) US6532650B1 (de)
EP (1) EP1063504B1 (de)
AT (1) ATE427477T1 (de)
BR (1) BR0002864B1 (de)
DE (1) DE60041901D1 (de)
FR (1) FR2795520B1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7680796B2 (en) 2003-09-03 2010-03-16 Google, Inc. Determining and/or using location information in an ad system
US7170385B2 (en) * 2004-11-18 2007-01-30 Simmonds Precision Products, Inc. Inductive proximity sensor and method of assembling the same
US7285739B1 (en) * 2006-03-31 2007-10-23 Zippy Technology Corp. Waterproof structure for switch pins
BR102012004522B8 (pt) * 2012-02-29 2021-06-15 Emicol Eletro Eletronica S A sensor de pressão eletrônico encapsulado
JP6517709B2 (ja) * 2016-01-29 2019-05-22 株式会社鷺宮製作所 冷媒回路構成部品
US10345177B2 (en) * 2017-04-27 2019-07-09 Ford Global Technologies, Llc Sensor cartridge for mounting in a reservoir
DE102018212327A1 (de) * 2018-07-24 2020-01-30 Robert Bosch Gmbh Elektronische Vorrichtung mit einem in einen Schutzmantel eingebettetes Bauteil
DE102019104841A1 (de) 2019-02-26 2020-08-27 Endress+Hauser SE+Co. KG Messgerät mit einem Sensorelement und einer Mess- und Betriebsschaltung

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0654271B2 (ja) * 1985-04-01 1994-07-20 株式会社日立製作所 半導体圧力センサ
US4751029A (en) * 1985-04-15 1988-06-14 Nicholas Plastics, Inc. Method and means for molding plastic parts
US4847557A (en) * 1987-03-18 1989-07-11 Sumitomo Electric Industries, Ltd. Hermetically sealed magnetic sensor
US4874336A (en) * 1988-03-15 1989-10-17 Amp Incorporated Shielded electrical connector for printed circuit board mounting
EP0381775B1 (de) * 1988-07-26 1994-11-23 Hitachi Construction Machinery Co., Ltd. Drucksensor
JPH04258176A (ja) * 1991-02-12 1992-09-14 Mitsubishi Electric Corp 半導体圧力センサ
JPH0722722A (ja) * 1993-07-05 1995-01-24 Mitsubishi Electric Corp 樹脂成形タイプの電子回路装置
JP3056356B2 (ja) * 1993-08-31 2000-06-26 三菱電機株式会社 自動車用センサ
JPH0883866A (ja) * 1994-07-15 1996-03-26 Shinko Electric Ind Co Ltd 片面樹脂封止型半導体装置の製造方法及びこれに用いるキャリアフレーム
JPH08241802A (ja) * 1995-03-03 1996-09-17 Murata Mfg Co Ltd サーミスタ装置及びその製造方法

Also Published As

Publication number Publication date
FR2795520A1 (fr) 2000-12-29
EP1063504B1 (de) 2009-04-01
FR2795520B1 (fr) 2001-09-07
BR0002864B1 (pt) 2012-01-10
EP1063504A1 (de) 2000-12-27
DE60041901D1 (de) 2009-05-14
BR0002864A (pt) 2001-01-30
US6532650B1 (en) 2003-03-18

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