ATE414274T1 - Verfahren und gerät zur schnellen on-line und elektro-optischen defekterkennung an wafern - Google Patents
Verfahren und gerät zur schnellen on-line und elektro-optischen defekterkennung an wafernInfo
- Publication number
- ATE414274T1 ATE414274T1 AT03250255T AT03250255T ATE414274T1 AT E414274 T1 ATE414274 T1 AT E414274T1 AT 03250255 T AT03250255 T AT 03250255T AT 03250255 T AT03250255 T AT 03250255T AT E414274 T1 ATE414274 T1 AT E414274T1
- Authority
- AT
- Austria
- Prior art keywords
- wafer
- view
- ccd matrix
- image
- electro
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03250255A EP1439385B1 (de) | 2003-01-15 | 2003-01-15 | Verfahren und Gerät zur schnellen on-line und elektro-optischen Defekterkennung an Wafern |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE414274T1 true ATE414274T1 (de) | 2008-11-15 |
Family
ID=32524244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03250255T ATE414274T1 (de) | 2003-01-15 | 2003-01-15 | Verfahren und gerät zur schnellen on-line und elektro-optischen defekterkennung an wafern |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1439385B1 (de) |
AT (1) | ATE414274T1 (de) |
DE (1) | DE60324656D1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8038897B2 (en) * | 2007-02-06 | 2011-10-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for wafer inspection |
DE102008025062B4 (de) * | 2008-05-26 | 2016-07-28 | Airbus Defence and Space GmbH | Stroboskopisches Messvorrichtung und Verfahren hierzu |
CN102053093A (zh) * | 2010-11-08 | 2011-05-11 | 北京大学深圳研究生院 | 一种晶圆表面切割芯片的表面缺陷检测方法 |
JP6134249B2 (ja) | 2013-11-01 | 2017-05-24 | 浜松ホトニクス株式会社 | 画像取得装置及び画像取得装置の画像取得方法 |
JP6154291B2 (ja) * | 2013-11-01 | 2017-06-28 | 浜松ホトニクス株式会社 | 画像取得装置及び画像取得装置の画像取得方法 |
CN111855663B (zh) * | 2019-04-30 | 2023-06-27 | 芯恩(青岛)集成电路有限公司 | 一种检测晶圆缺陷的设备和方法 |
AU2021374575A1 (en) * | 2020-11-06 | 2023-02-02 | Illumina Cambridge Limited | Apparatus and method of obtaining an image of a sample in motion |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4760265A (en) * | 1986-01-18 | 1988-07-26 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Method and device for detecting defects of patterns in microelectronic devices |
US4734923A (en) * | 1986-05-19 | 1988-03-29 | Hampshire Instruments, Inc | Lithographic system mask inspection device |
JP2908099B2 (ja) * | 1992-01-17 | 1999-06-21 | キヤノン株式会社 | 基板の位置合わせ方法 |
US5298963A (en) * | 1992-02-26 | 1994-03-29 | Mitsui Mining & Smelting Co., Ltd. | Apparatus for inspecting the surface of materials |
JPH08154210A (ja) * | 1994-11-28 | 1996-06-11 | Kubota Corp | 撮像装置 |
JPH08292361A (ja) * | 1995-04-24 | 1996-11-05 | Olympus Optical Co Ltd | プリズム固定装置 |
JP3647608B2 (ja) * | 1997-06-20 | 2005-05-18 | 株式会社ソキア | 測量機の自動追尾装置 |
KR20020011416A (ko) * | 1999-05-18 | 2002-02-08 | 조셉 제이. 스위니 | 마스트와 비교함으로써 물체의 검사를 수행하는 방법 및장치 |
US6369888B1 (en) * | 1999-11-17 | 2002-04-09 | Applied Materials, Inc. | Method and apparatus for article inspection including speckle reduction |
JP4131899B2 (ja) * | 2000-09-28 | 2008-08-13 | 株式会社東芝 | パターン検査装置 |
-
2003
- 2003-01-15 EP EP03250255A patent/EP1439385B1/de not_active Expired - Lifetime
- 2003-01-15 DE DE60324656T patent/DE60324656D1/de not_active Expired - Fee Related
- 2003-01-15 AT AT03250255T patent/ATE414274T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1439385A1 (de) | 2004-07-21 |
DE60324656D1 (de) | 2008-12-24 |
EP1439385B1 (de) | 2008-11-12 |
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Legal Events
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