ATE40157T1 - Selektive plattierung. - Google Patents
Selektive plattierung.Info
- Publication number
- ATE40157T1 ATE40157T1 AT83305977T AT83305977T ATE40157T1 AT E40157 T1 ATE40157 T1 AT E40157T1 AT 83305977 T AT83305977 T AT 83305977T AT 83305977 T AT83305977 T AT 83305977T AT E40157 T1 ATE40157 T1 AT E40157T1
- Authority
- AT
- Austria
- Prior art keywords
- header
- cap
- plating
- selective plating
- jig
- Prior art date
Links
- 238000007747 plating Methods 0.000 title abstract 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229920002379 silicone rubber Polymers 0.000 abstract 1
- 239000004945 silicone rubber Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Glass Compositions (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8228376 | 1982-10-05 | ||
| EP83305977A EP0107931B1 (de) | 1982-10-05 | 1983-09-30 | Selektive Plattierung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE40157T1 true ATE40157T1 (de) | 1989-02-15 |
Family
ID=10533382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT83305977T ATE40157T1 (de) | 1982-10-05 | 1983-09-30 | Selektive plattierung. |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0107931B1 (de) |
| JP (1) | JPS5985886A (de) |
| AT (1) | ATE40157T1 (de) |
| DE (1) | DE3378982D1 (de) |
| GB (1) | GB2127855B (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2152854A (en) * | 1983-12-27 | 1985-08-14 | Champion Spark Plug Co | Coating portions of articles |
| US4561954A (en) * | 1985-01-22 | 1985-12-31 | Avx Corporation | Method of applying terminations to ceramic bodies |
| JPS62191871U (de) * | 1986-05-27 | 1987-12-05 | ||
| JPH0680605B2 (ja) * | 1987-11-28 | 1994-10-12 | 株式会社村田製作所 | 電子部品チップ保持治具および電子部品チップのメタライズ面への金属コーティング方法 |
| GB2270527A (en) * | 1992-09-11 | 1994-03-16 | Rolls Royce Plc | Coating a face of a component using apertured mask of same size as the face; turbine tip blades |
| GB9326082D0 (en) * | 1993-12-21 | 1994-02-23 | Baj Coatings Ltd | Rotor blades |
| CA2572499A1 (en) * | 1997-04-04 | 1998-10-15 | University Of Southern California | Method for electrochemical fabrication including use of multiple structural and/or sacrificial materials |
| WO2003049514A2 (en) | 2001-12-03 | 2003-06-12 | Memgen Corporation | Miniature rf and microwave components and methods for fabricating such components |
| US9614266B2 (en) | 2001-12-03 | 2017-04-04 | Microfabrica Inc. | Miniature RF and microwave components and methods for fabricating such components |
| US10297421B1 (en) | 2003-05-07 | 2019-05-21 | Microfabrica Inc. | Plasma etching of dielectric sacrificial material from reentrant multi-layer metal structures |
| KR100770667B1 (ko) * | 2007-06-05 | 2007-10-29 | 이정걸 | 너트 나사부 표면처리용 지그 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3257308A (en) * | 1961-07-11 | 1966-06-21 | Western Electric Co | Article holder for electroplating articles |
| JPS4831456B1 (de) * | 1970-03-03 | 1973-09-29 | ||
| GB1447027A (en) * | 1972-05-25 | 1976-08-25 | Owen S G Ltd | Plating |
| US3835017A (en) * | 1972-12-22 | 1974-09-10 | Buckbee Mears Co | Reusable shields for selective electrodeposition |
| US3897323A (en) * | 1974-08-05 | 1975-07-29 | Motorola Inc | Apparatus for selective plating |
| JPS52915U (de) * | 1975-06-21 | 1977-01-06 | ||
| GB1544951A (en) * | 1976-03-23 | 1979-04-25 | Electroplating Engs Of Ja Ltd | Device for plating a selected portion of opposite side surfaces of a sheet-like article |
| GB1549862A (en) * | 1976-04-20 | 1979-08-08 | Owens Ltd S | Electroplating |
| GB2067597B (en) * | 1980-01-17 | 1982-11-17 | Owen S G Ltd | Plating |
| GB2088411B (en) * | 1980-12-02 | 1983-11-30 | Ferranti Ltd | Positioning electrical contacts for electroplating |
| GB2094344B (en) * | 1980-12-23 | 1983-09-07 | Owen S G Ltd | Improvements in or relating to selective plating |
| EP0055130B1 (de) * | 1980-12-23 | 1984-07-25 | S.G. Owen Limited | Verfahren zum selektiven Galvanisieren |
| US4405410A (en) * | 1982-01-15 | 1983-09-20 | Northern Telecom Limited | Masking of elongate three dimensional objects for the exposure of preselected areas for surface treatment |
-
1983
- 1983-09-30 AT AT83305977T patent/ATE40157T1/de not_active IP Right Cessation
- 1983-09-30 EP EP83305977A patent/EP0107931B1/de not_active Expired
- 1983-09-30 DE DE8383305977T patent/DE3378982D1/de not_active Expired
- 1983-09-30 GB GB08326303A patent/GB2127855B/en not_active Expired
- 1983-10-05 JP JP58186676A patent/JPS5985886A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| GB2127855A (en) | 1984-04-18 |
| GB8326303D0 (en) | 1983-11-02 |
| JPS5985886A (ja) | 1984-05-17 |
| EP0107931B1 (de) | 1989-01-18 |
| DE3378982D1 (en) | 1989-02-23 |
| GB2127855B (en) | 1986-03-26 |
| EP0107931A3 (en) | 1984-08-08 |
| EP0107931A2 (de) | 1984-05-09 |
| JPH0411633B2 (de) | 1992-03-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification | ||
| REN | Ceased due to non-payment of the annual fee |