ATE397289T1 - Schichtübertragungsverfahren - Google Patents

Schichtübertragungsverfahren

Info

Publication number
ATE397289T1
ATE397289T1 AT04704241T AT04704241T ATE397289T1 AT E397289 T1 ATE397289 T1 AT E397289T1 AT 04704241 T AT04704241 T AT 04704241T AT 04704241 T AT04704241 T AT 04704241T AT E397289 T1 ATE397289 T1 AT E397289T1
Authority
AT
Austria
Prior art keywords
layer
adhesive
zone
transfer process
layer transfer
Prior art date
Application number
AT04704241T
Other languages
English (en)
Inventor
Severine Bressot
Olivier Rayssac
Bernard Aspar
Original Assignee
Soitec Silicon On Insulator
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR0300764A external-priority patent/FR2850390B1/fr
Application filed by Soitec Silicon On Insulator, Commissariat Energie Atomique filed Critical Soitec Silicon On Insulator
Application granted granted Critical
Publication of ATE397289T1 publication Critical patent/ATE397289T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1924—Preparing SOI wafers with separation/delamination along a porous layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • H10P90/1916—Preparing SOI wafers using bonding with separation or delamination along an ion implanted layer, e.g. Smart-cut
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Ropes Or Cables (AREA)
  • Materials For Medical Uses (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
AT04704241T 2003-01-24 2004-01-22 Schichtübertragungsverfahren ATE397289T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0300764A FR2850390B1 (fr) 2003-01-24 2003-01-24 Procede d'elimination d'une zone peripherique de colle lors de la fabrication d'un substrat composite
US47243703P 2003-05-22 2003-05-22

Publications (1)

Publication Number Publication Date
ATE397289T1 true ATE397289T1 (de) 2008-06-15

Family

ID=32773879

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04704241T ATE397289T1 (de) 2003-01-24 2004-01-22 Schichtübertragungsverfahren

Country Status (5)

Country Link
EP (1) EP1586115B1 (de)
JP (1) JP4586156B2 (de)
AT (1) ATE397289T1 (de)
DE (1) DE602004014099D1 (de)
WO (1) WO2004066380A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4670276B2 (ja) * 2004-08-12 2011-04-13 富士電機システムズ株式会社 半導体装置の製造方法
KR101324291B1 (ko) 2007-04-30 2013-11-01 주성엔지니어링(주) 태양전지의 제조방법
EP2324488B1 (de) 2008-08-27 2013-02-13 Soitec Verfahren zum herstellen von halbleiterstrukturen oder bauelementen unter verwendung von schichten aus halbleitermaterial mit gewählten oder kontrollierten gitterparametern
US8114754B2 (en) 2009-11-18 2012-02-14 S.O.I.Tec Silicon On Insulator Technologies Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods
JP5671265B2 (ja) * 2010-06-10 2015-02-18 東京応化工業株式会社 基板の加工方法
JP5406257B2 (ja) 2011-09-07 2014-02-05 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体及び接合システム
JP5552466B2 (ja) * 2011-09-07 2014-07-16 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体及び接合システム
JP6295066B2 (ja) * 2013-11-20 2018-03-14 東京応化工業株式会社 処理方法
JP6297924B2 (ja) * 2014-05-29 2018-03-20 リンテック株式会社 接着剤層除去装置および接着剤層除去方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62229849A (ja) * 1986-03-28 1987-10-08 Mitsubishi Electric Corp 樹脂封止型半導体装置の製造方法
JP2844362B2 (ja) * 1989-09-20 1999-01-06 株式会社日立製作所 半導体チップの製造方法
JPH09148207A (ja) * 1995-11-22 1997-06-06 Mitsubishi Heavy Ind Ltd 三次元ｌｓｉ積層装置
JPH10320851A (ja) * 1997-05-23 1998-12-04 Toshiba Emi Ltd 光学式貼り合わせディスクの製造方法及びその製造装置
JP2000077287A (ja) * 1998-08-26 2000-03-14 Nissin Electric Co Ltd 結晶薄膜基板の製造方法
JP3520839B2 (ja) * 2000-01-21 2004-04-19 セイコーエプソン株式会社 圧電振動片の製造方法
FR2811807B1 (fr) * 2000-07-12 2003-07-04 Commissariat Energie Atomique Procede de decoupage d'un bloc de materiau et de formation d'un film mince
JP2002217391A (ja) * 2001-01-23 2002-08-02 Seiko Epson Corp 積層体の製造方法及び半導体装置
JP3994681B2 (ja) * 2001-04-11 2007-10-24 ソニー株式会社 素子の配列方法及び画像表示装置の製造方法
JP3890921B2 (ja) * 2001-06-05 2007-03-07 ソニー株式会社 素子の配列方法及び画像表示装置の製造方法

Also Published As

Publication number Publication date
JP2006518097A (ja) 2006-08-03
DE602004014099D1 (de) 2008-07-10
EP1586115A1 (de) 2005-10-19
WO2004066380A1 (en) 2004-08-05
JP4586156B2 (ja) 2010-11-24
EP1586115B1 (de) 2008-05-28

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Legal Events

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