ATE370464T1 - Schutz für einen integrierten schaltungschip, der vertrauliche daten enthält - Google Patents
Schutz für einen integrierten schaltungschip, der vertrauliche daten enthältInfo
- Publication number
- ATE370464T1 ATE370464T1 AT04816603T AT04816603T ATE370464T1 AT E370464 T1 ATE370464 T1 AT E370464T1 AT 04816603 T AT04816603 T AT 04816603T AT 04816603 T AT04816603 T AT 04816603T AT E370464 T1 ATE370464 T1 AT E370464T1
- Authority
- AT
- Austria
- Prior art keywords
- integrated circuit
- circuit chip
- protection
- confidential data
- chip
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/576—Protection from inspection, reverse engineering or tampering using active circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6611—Wire connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01061—Promethium [Pm]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1433—Application-specific integrated circuit [ASIC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
- H01L2924/19104—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device on the semiconductor or solid-state device, i.e. passive-on-chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- General Engineering & Computer Science (AREA)
- Semiconductor Integrated Circuits (AREA)
- Storage Device Security (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0351221A FR2864667B1 (fr) | 2003-12-29 | 2003-12-29 | Protection d'une puce de circuit integre contenant des donnees confidentielles |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE370464T1 true ATE370464T1 (de) | 2007-09-15 |
Family
ID=34639768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04816603T ATE370464T1 (de) | 2003-12-29 | 2004-12-23 | Schutz für einen integrierten schaltungschip, der vertrauliche daten enthält |
Country Status (7)
Country | Link |
---|---|
US (1) | US8110894B2 (de) |
EP (1) | EP1700256B1 (de) |
JP (1) | JP4717011B2 (de) |
AT (1) | ATE370464T1 (de) |
DE (1) | DE602004008339T2 (de) |
FR (1) | FR2864667B1 (de) |
WO (1) | WO2005069210A1 (de) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1691413A1 (de) * | 2005-02-11 | 2006-08-16 | Axalto SA | Falschungssichere elektronische Komponente |
JP2007116215A (ja) * | 2005-10-18 | 2007-05-10 | Fuji Electric Holdings Co Ltd | 耐タンパーモジュール装置 |
FR2892544B1 (fr) * | 2005-10-25 | 2007-12-21 | Gemplus Sa | Detection de tentative d'effraction sur une puce a travers sa structure support |
EP2615641B1 (de) * | 2006-01-24 | 2015-07-01 | Nds Limited | Chip-Attacken-Schutz |
FR2910708A1 (fr) * | 2006-12-20 | 2008-06-27 | Commissariat Energie Atomique | Protection de donnees confidentielles dans les circuits integres |
JP4453741B2 (ja) | 2007-10-25 | 2010-04-21 | トヨタ自動車株式会社 | 電動車両および車両用給電装置 |
US8370644B2 (en) * | 2008-05-30 | 2013-02-05 | Spansion Llc | Instant hardware erase for content reset and pseudo-random number generation |
DE102008036422A1 (de) * | 2008-08-05 | 2010-02-11 | Infineon Technologies Ag | Halbleiter-Chip mit Prüfeinrichtung |
US20100123469A1 (en) * | 2008-11-19 | 2010-05-20 | Edward Craig Hyatt | System and method for protecting circuit boards |
FR2938953B1 (fr) * | 2008-11-21 | 2011-03-11 | Innova Card | Dispositif de protection d'un boitier de circuit integre electronique contre les intrusions par voie physique ou chimique. |
JP5484720B2 (ja) * | 2008-12-19 | 2014-05-07 | デクセリアルズ株式会社 | アンテナモジュール、及び、その製造方法 |
DE102009043617A1 (de) | 2009-09-29 | 2011-03-31 | Giesecke & Devrient Gmbh | Chipmodul und tragbarer Datenträger mit einem Chipmodul |
DE102010003450B4 (de) | 2010-03-30 | 2021-12-02 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Halbleiterbauelement mit E-Sicherung auf Metallbasis mit verbesserter Programmiereffizienz durch Erhöhen der Wärmeerzeugung |
CN102340358B (zh) * | 2010-07-16 | 2014-03-12 | 国民技术股份有限公司 | 一种用于低频信号检测及传输的装置 |
DE102010060354A1 (de) * | 2010-11-04 | 2012-05-10 | Wincor Nixdorf International Gmbh | Vorrichtung zur datentechnischen Verbindung von Datenverarbeitungsmodulen und Verfahren zum Schutz einer Datenübertragung vor Manipulation |
WO2012086048A1 (ja) | 2010-12-24 | 2012-06-28 | トヨタ自動車 株式会社 | 非接触充電システム、非接触充電方法、非接触充電型の車両、および非接触充電管理装置 |
US9582465B2 (en) | 2012-11-15 | 2017-02-28 | Elwha Llc | Flexible processors and flexible memory |
US9323499B2 (en) | 2012-11-15 | 2016-04-26 | Elwha Llc | Random number generator functions in memory |
US9026719B2 (en) | 2012-11-15 | 2015-05-05 | Elwha, Llc | Intelligent monitoring for computation in memory |
US8925098B2 (en) * | 2012-11-15 | 2014-12-30 | Elwha Llc | Data security and access tracking in memory |
US8996951B2 (en) | 2012-11-15 | 2015-03-31 | Elwha, Llc | Error correction with non-volatile memory on an integrated circuit |
US8966310B2 (en) | 2012-11-15 | 2015-02-24 | Elwha Llc | Redundancy for loss-tolerant data in non-volatile memory |
US9442854B2 (en) | 2012-11-15 | 2016-09-13 | Elwha Llc | Memory circuitry including computational circuitry for performing supplemental functions |
FR2998419B1 (fr) * | 2012-11-21 | 2015-01-16 | St Microelectronics Rousset | Protection d'un circuit integre contre des attaques |
DE102013205729A1 (de) * | 2013-03-28 | 2014-10-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren mit einem Träger mit Schaltungsstrukturen |
GB201311834D0 (en) | 2013-07-02 | 2013-08-14 | Qinetiq Ltd | Electronic hardware assembly |
FR3012237B1 (fr) | 2013-10-22 | 2017-03-03 | Commissariat Energie Atomique | Puce electronique comprenant des moyens de protection de sa face arriere |
JP6323643B2 (ja) * | 2013-11-07 | 2018-05-16 | セイコーエプソン株式会社 | 半導体回路装置、発振器、電子機器及び移動体 |
JP2017079336A (ja) * | 2014-01-31 | 2017-04-27 | 国立大学法人東北大学 | サイドチャネル攻撃の検知装置、サイドチャネル攻撃の検知装置によるサイドチャネル攻撃の検知方法 |
FR3035267B1 (fr) | 2015-04-20 | 2018-05-25 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Puce electronique comportant une face arriere protegee |
FR3041454B1 (fr) * | 2015-09-22 | 2018-03-16 | Thales | Dispositif de protection d'un circuit electronique avec detection d'un changement de reactance electrique |
EP3147830B1 (de) | 2015-09-23 | 2020-11-18 | Nxp B.V. | Schutz fuer eine integrierte schaltung |
EP3166139B1 (de) * | 2015-11-03 | 2019-07-24 | Nxp B.V. | Integrierte schaltung und verfahren zur herstellung einer integrierten schaltung |
FR3048102B1 (fr) | 2016-02-24 | 2018-03-09 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Methode d'execution confidentielle d'un programme operant sur des donnees chiffrees par un chiffrement homomorphe |
FR3048319B1 (fr) | 2016-02-25 | 2018-03-09 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Methode de gestion de certificats implicites au moyen d'une infrastructure a cles publiques distribuee |
US9773153B1 (en) | 2016-03-24 | 2017-09-26 | Fingerprint Cards Ab | Fingerprint sensor module |
FR3055471B1 (fr) * | 2016-08-31 | 2018-09-14 | Stmicroelectronics (Crolles 2) Sas | Puce protegee contre les attaques face arriere |
US10547461B2 (en) | 2017-03-07 | 2020-01-28 | Nxp B.V. | Method and apparatus for binding stacked die using a physically unclonable function |
US10568202B2 (en) * | 2017-07-25 | 2020-02-18 | International Business Machines Corporation | Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout |
FR3069703B1 (fr) | 2017-07-27 | 2020-01-24 | Stmicroelectronics (Crolles 2) Sas | Puce electronique |
FR3079623B1 (fr) | 2018-03-29 | 2022-04-08 | St Microelectronics Grenoble 2 | Capot pour dispositif electronique et procede de fabrication |
CN112005249A (zh) * | 2019-03-05 | 2020-11-27 | 华为技术有限公司 | 一种用于裸片保护的电路、裸片及集成电路 |
US11171095B1 (en) | 2020-04-22 | 2021-11-09 | Globalfoundries U.S. Inc. | Active attack prevention for secure integrated circuits using latchup sensitive diode circuit |
US11121097B1 (en) | 2020-05-22 | 2021-09-14 | Globalfoundries U.S. Inc. | Active x-ray attack prevention device |
US11748524B2 (en) | 2020-07-20 | 2023-09-05 | International Business Machines Corporation | Tamper resistant obfuscation circuit |
US11587890B2 (en) | 2020-07-20 | 2023-02-21 | International Business Machines Corporation | Tamper-resistant circuit, back-end of the line memory and physical unclonable function for supply chain protection |
US11437329B2 (en) | 2020-10-14 | 2022-09-06 | Globalfoundries U.S. Inc. | Anti-tamper x-ray blocking package |
US11815717B2 (en) | 2021-11-12 | 2023-11-14 | Globalfoundries U.S. Inc. | Photonic chip security structure |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4795898A (en) * | 1986-04-28 | 1989-01-03 | American Telephone And Telegraph Company | Personal memory card having a contactless interface using differential data transfer |
US4933898A (en) * | 1989-01-12 | 1990-06-12 | General Instrument Corporation | Secure integrated circuit chip with conductive shield |
JPH0787237A (ja) | 1993-09-09 | 1995-03-31 | Matsushita Electric Ind Co Ltd | 直流ループ回路 |
US5760456A (en) * | 1995-12-21 | 1998-06-02 | Grzegorek; Andrew Z. | Integrated circuit compatible planar inductors with increased Q |
US5861662A (en) * | 1997-02-24 | 1999-01-19 | General Instrument Corporation | Anti-tamper bond wire shield for an integrated circuit |
JP3037191B2 (ja) * | 1997-04-22 | 2000-04-24 | 日本電気アイシーマイコンシステム株式会社 | 半導体装置 |
DE19738990C2 (de) * | 1997-09-05 | 1999-11-25 | Siemens Ag | Einrichtung zum Schutz gegen Mißbrauch einer Chipkarte |
US6236101B1 (en) * | 1997-11-05 | 2001-05-22 | Texas Instruments Incorporated | Metallization outside protective overcoat for improved capacitors and inductors |
US6246970B1 (en) * | 1998-07-10 | 2001-06-12 | Silverbrook Research Pty Ltd | Method for making a chip tamper-resistant |
DE50004245D1 (de) * | 1999-01-29 | 2003-12-04 | Infineon Technologies Ag | Kontaktlose chipkarte |
US6879525B2 (en) * | 2001-10-31 | 2005-04-12 | Hewlett-Packard Development Company, L.P. | Feedback write method for programmable memory |
US6853093B2 (en) * | 2002-12-20 | 2005-02-08 | Lipman Electronic Engineering Ltd. | Anti-tampering enclosure for electronic circuitry |
-
2003
- 2003-12-29 FR FR0351221A patent/FR2864667B1/fr not_active Expired - Fee Related
-
2004
- 2004-12-23 EP EP04816603A patent/EP1700256B1/de not_active Not-in-force
- 2004-12-23 US US10/583,377 patent/US8110894B2/en not_active Expired - Fee Related
- 2004-12-23 WO PCT/FR2004/050756 patent/WO2005069210A1/fr active IP Right Grant
- 2004-12-23 JP JP2006546290A patent/JP4717011B2/ja not_active Expired - Fee Related
- 2004-12-23 AT AT04816603T patent/ATE370464T1/de not_active IP Right Cessation
- 2004-12-23 DE DE602004008339T patent/DE602004008339T2/de active Active
Also Published As
Publication number | Publication date |
---|---|
JP4717011B2 (ja) | 2011-07-06 |
DE602004008339T2 (de) | 2008-05-08 |
EP1700256A1 (de) | 2006-09-13 |
EP1700256B1 (de) | 2007-08-15 |
JP2007535022A (ja) | 2007-11-29 |
FR2864667B1 (fr) | 2006-02-24 |
US20070121575A1 (en) | 2007-05-31 |
FR2864667A1 (fr) | 2005-07-01 |
DE602004008339D1 (de) | 2007-09-27 |
WO2005069210A1 (fr) | 2005-07-28 |
US8110894B2 (en) | 2012-02-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE370464T1 (de) | Schutz für einen integrierten schaltungschip, der vertrauliche daten enthält | |
WO2006107777A3 (en) | Dynamic encryption of payment card numbers in electronic payment transactions | |
TW200506748A (en) | Memory cards including a standard security function | |
DE502006006516D1 (de) | Sicherheitsdokument mit integriertem schaltkreis und integriertem anzeigeelement | |
DE60233762D1 (de) | Geräteschlüssel | |
EP3678044A3 (de) | Karten und einrichtungen mit magnetischen emulatoren zur kommunikation mit magnetstreifenlesern und anwendungen hierfür | |
ATE504339T1 (de) | Verfahren, anlage und hergestellter gegenstand mit verwendung mehrerer maschine-lesbarer indizien auf spielkarten | |
ES537708A0 (es) | Un metodo de verificar un numero de identificacion personal y comprobar una serie de numeros puestos en un medio de identificacion | |
GB0610321D0 (en) | Portable security transaction protocol | |
DE69425923D1 (de) | Personenbezogene Einrichtung zur notariellen Beglaubigung des Datums und der Zeit | |
ATE476718T1 (de) | Faltbare transaktionskartensysteme | |
ATE270800T1 (de) | Vorrichtungen und verfahren zur zertifizierung von digitalen unterschriften | |
TR200100381U (tr) | Kart onaylama cihazı | |
ATE409921T1 (de) | Kartenleser | |
FI20021594A0 (fi) | Menetelmä, järjestelmä ja laite dataliikenteen aitouden osoittamiseksi | |
ATE272935T1 (de) | Vorrichtung und brückenkarte für einen computer | |
DE9405280U1 (de) | Portables Chipkartenlesegerät ohne Netzspannungsversorgung zum Einlesen von Versichertenkarten der Krankenkassen und Ausgeben der Daten an einen Computer | |
ATE354843T1 (de) | Tragbares rechnergestütztes verkaufsterminal zum durchführen von finanziellen und geschäftlichen transaktionen | |
WO2004006172A3 (de) | Tragbarer datenträger mit einer polymerbasierten integrierten schaltung | |
PH12021050258A1 (en) | Casino game medium and game table system | |
CN108389019A (zh) | 财货商品信息管理方法及系统 | |
KR20090002166A (ko) | 알에프아이디 칩을 내장한 학생증을 이용한 학생 관리시스템 | |
DE50010417D1 (de) | Reproduktionsschutz von geheimnissen auf chipkarten | |
ES1048255U (es) | Tarjeta de bolsillo perfeccionada. | |
Donberg | TI Technology Aids Amex Card Security |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |