ATE367457T1 - Verfahren zur vermeidung von ablagerungen von verunreinigungsteilchen auf die oberfläche eines mikrobauteils, aufbewahrungsvorrichtung für ein mikrobauteil und vorrichtung zur abscheidung von dünnen schichten - Google Patents
Verfahren zur vermeidung von ablagerungen von verunreinigungsteilchen auf die oberfläche eines mikrobauteils, aufbewahrungsvorrichtung für ein mikrobauteil und vorrichtung zur abscheidung von dünnen schichtenInfo
- Publication number
- ATE367457T1 ATE367457T1 AT04354017T AT04354017T ATE367457T1 AT E367457 T1 ATE367457 T1 AT E367457T1 AT 04354017 T AT04354017 T AT 04354017T AT 04354017 T AT04354017 T AT 04354017T AT E367457 T1 ATE367457 T1 AT E367457T1
- Authority
- AT
- Austria
- Prior art keywords
- microcomponent
- micro component
- particles
- storage device
- contaminant
- Prior art date
Links
- 239000002245 particle Substances 0.000 title abstract 7
- 239000000356 contaminant Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 3
- 230000008021 deposition Effects 0.000 title abstract 2
- 238000000151 deposition Methods 0.000 title 2
- 239000000463 material Substances 0.000 abstract 2
- 238000005507 spraying Methods 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/134—Plasma spraying
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0305169A FR2854169B1 (fr) | 2003-04-28 | 2003-04-28 | Procede destine a eviter le depot de particules contaminatrices sur la surface d'un micro-composant, dispositif de stockage d'un micro-composant et dispositif de depot de couches minces. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE367457T1 true ATE367457T1 (de) | 2007-08-15 |
Family
ID=32982313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04354017T ATE367457T1 (de) | 2003-04-28 | 2004-04-02 | Verfahren zur vermeidung von ablagerungen von verunreinigungsteilchen auf die oberfläche eines mikrobauteils, aufbewahrungsvorrichtung für ein mikrobauteil und vorrichtung zur abscheidung von dünnen schichten |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20050051421A1 (de) |
| EP (1) | EP1473381B1 (de) |
| JP (1) | JP4597565B2 (de) |
| AT (1) | ATE367457T1 (de) |
| DE (1) | DE602004007573T2 (de) |
| FR (1) | FR2854169B1 (de) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6972420B2 (en) * | 2004-04-28 | 2005-12-06 | Intel Corporation | Atomic beam to protect a reticle |
| CN101681114B (zh) | 2007-06-12 | 2013-05-08 | 皇家飞利浦电子股份有限公司 | 光学设备和原位处理euv光学部件以增强降低的反射率的方法 |
| US8084757B2 (en) * | 2008-01-17 | 2011-12-27 | Applied Materials, Inc. | Contamination prevention in extreme ultraviolet lithography |
| KR102714101B1 (ko) | 2018-12-10 | 2024-10-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 극자외선 리소그래피 애플리케이션에서 포토마스크로부터의 부착 피처 제거 |
| TWI807165B (zh) | 2019-02-11 | 2023-07-01 | 美商應用材料股份有限公司 | 物理氣相沉積方法 |
| KR102467650B1 (ko) | 2021-11-16 | 2022-11-21 | 덕우세미텍 주식회사 | 진공 시스템에서 전자층을 이용한 입자 이동 차단 장치 및 리소그래피 장치 |
| KR102776881B1 (ko) * | 2022-04-06 | 2025-03-10 | 덕우세미텍 주식회사 | 진공 시스템에서 정전 트랩을 구비한 전자층을 이용한 입자 이동 차단 장치 및 리소그래피 장치 |
| KR102776880B1 (ko) * | 2022-04-06 | 2025-03-10 | 덕우세미텍 주식회사 | 진공 시스템에서 전자층을 이용한 리소그래피 장치 |
| KR102748080B1 (ko) * | 2022-06-21 | 2024-12-31 | 덕우세미텍 주식회사 | 전기적 포텐셜 배리어 모듈 및 이를 포함하는 리소그래피 장치 |
| KR102748108B1 (ko) * | 2022-06-21 | 2024-12-31 | 덕우세미텍 주식회사 | 열전달 방지기능을 구비한 전기적 포텐셜 배리어 모듈 및 이를 포함하는 리소그래피 장치 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4392453A (en) * | 1981-08-26 | 1983-07-12 | Varian Associates, Inc. | Molecular beam converters for vacuum coating systems |
| US5366559A (en) * | 1993-05-27 | 1994-11-22 | Research Triangle Institute | Method for protecting a substrate surface from contamination using the photophoretic effect |
| JPH0729832A (ja) * | 1993-07-15 | 1995-01-31 | Sony Corp | 成膜装置およびこれを用いた成膜方法 |
| JPH07291790A (ja) * | 1994-04-15 | 1995-11-07 | Nippon Steel Corp | 分子線エピタキシー装置 |
| JP3503787B2 (ja) * | 1996-01-22 | 2004-03-08 | 貢 英 | 薄膜の形成方法 |
| JP3874397B2 (ja) * | 2000-07-11 | 2007-01-31 | 株式会社荏原製作所 | 基板上への成膜方法及び装置 |
| US20040055871A1 (en) * | 2002-09-25 | 2004-03-25 | The Regents Of The University Of California | Use of ion beams for protecting substrates from particulate defect contamination in ultra-low-defect coating processes |
-
2003
- 2003-04-28 FR FR0305169A patent/FR2854169B1/fr not_active Expired - Fee Related
-
2004
- 2004-04-02 EP EP04354017A patent/EP1473381B1/de not_active Expired - Lifetime
- 2004-04-02 DE DE602004007573T patent/DE602004007573T2/de not_active Expired - Lifetime
- 2004-04-02 AT AT04354017T patent/ATE367457T1/de not_active IP Right Cessation
- 2004-04-05 US US10/816,911 patent/US20050051421A1/en not_active Abandoned
- 2004-04-28 JP JP2004134234A patent/JP4597565B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1473381A1 (de) | 2004-11-03 |
| JP2004332115A (ja) | 2004-11-25 |
| FR2854169A1 (fr) | 2004-10-29 |
| FR2854169B1 (fr) | 2005-06-10 |
| US20050051421A1 (en) | 2005-03-10 |
| JP4597565B2 (ja) | 2010-12-15 |
| EP1473381B1 (de) | 2007-07-18 |
| DE602004007573D1 (de) | 2007-08-30 |
| DE602004007573T2 (de) | 2008-04-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |