ATE361547T1 - Elektronenstrahl-lithographysystem mit ziel- verriegelungsvorrichtung - Google Patents

Elektronenstrahl-lithographysystem mit ziel- verriegelungsvorrichtung

Info

Publication number
ATE361547T1
ATE361547T1 AT00105794T AT00105794T ATE361547T1 AT E361547 T1 ATE361547 T1 AT E361547T1 AT 00105794 T AT00105794 T AT 00105794T AT 00105794 T AT00105794 T AT 00105794T AT E361547 T1 ATE361547 T1 AT E361547T1
Authority
AT
Austria
Prior art keywords
field
stage
substrate
alignment
marks
Prior art date
Application number
AT00105794T
Other languages
English (en)
Inventor
John G Hartley
Rodney A Kendall
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of ATE361547T1 publication Critical patent/ATE361547T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045—Object or beam position registration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31752—Lithography using particular beams or near-field effects, e.g. STM-like techniques
    • H01J2237/31754—Lithography using particular beams or near-field effects, e.g. STM-like techniques using electron beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31761—Patterning strategy
    • H01J2237/31766—Continuous moving of wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/887—Nanoimprint lithography, i.e. nanostamp

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Sources, Ion Sources (AREA)
AT00105794T 1999-04-13 2000-03-18 Elektronenstrahl-lithographysystem mit ziel- verriegelungsvorrichtung ATE361547T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/290,785 US6437347B1 (en) 1999-04-13 1999-04-13 Target locking system for electron beam lithography

Publications (1)

Publication Number Publication Date
ATE361547T1 true ATE361547T1 (de) 2007-05-15

Family

ID=23117558

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00105794T ATE361547T1 (de) 1999-04-13 2000-03-18 Elektronenstrahl-lithographysystem mit ziel- verriegelungsvorrichtung

Country Status (5)

Country Link
US (1) US6437347B1 (de)
EP (1) EP1045427B1 (de)
JP (1) JP3344713B2 (de)
AT (1) ATE361547T1 (de)
DE (1) DE60034625T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10011202A1 (de) * 2000-03-08 2001-09-13 Leica Microsys Lithography Ltd Verfahren zur Ausrichtung eines Elektronenstrahls auf eine Zielposition an einer Substratoberfläche
US6661015B2 (en) * 2000-09-15 2003-12-09 Ims-Ionen Mikrofabrikations Systeme Gmbh Pattern lock system
US7160475B2 (en) * 2002-11-21 2007-01-09 Fei Company Fabrication of three dimensional structures
US6908255B2 (en) * 2003-06-25 2005-06-21 International Business Machines Corporation Remote clamping mechanism via vacuum feedthrough
JP3889743B2 (ja) 2003-12-05 2007-03-07 株式会社東芝 荷電ビーム描画方法及び描画装置
GB2409928B (en) * 2004-01-09 2007-03-21 Applied Materials Inc Improvements relating to ion implantation
US20060266953A1 (en) * 2005-05-27 2006-11-30 Uwe Kramer Method and system for determining a positioning error of an electron beam of a scanning electron microscope
US7477772B2 (en) * 2005-05-31 2009-01-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing 2D run length encoding for image data compression
JP4520426B2 (ja) 2005-07-04 2010-08-04 株式会社ニューフレアテクノロジー 電子ビームのビームドリフト補正方法及び電子ビームの描画方法
US7456414B2 (en) * 2005-09-28 2008-11-25 Applied Materials, Inc. Beam re-registration system and method
JP4980628B2 (ja) * 2006-03-06 2012-07-18 日本電子株式会社 自動遷移ボタンを用いたヒステリシス除去方法
WO2008030929A1 (en) * 2006-09-06 2008-03-13 Massachusetts Institute Of Technology Nanometer-level mix-and-match scanning tip and electron beam lithography using global backside position reference marks
JP2009218474A (ja) * 2008-03-12 2009-09-24 Jeol Ltd ビーム位置ドリフト抑制方法、ビーム寸法ドリフト抑制方法及び荷電粒子ビーム描画装置。
EP2676168B1 (de) * 2011-02-16 2018-09-12 Mapper Lithography IP B.V. System zur magnetischen abschirmung
US8389962B2 (en) * 2011-05-31 2013-03-05 Applied Materials Israel, Ltd. System and method for compensating for magnetic noise
JP6057672B2 (ja) * 2012-11-05 2017-01-11 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
DE102019200696B4 (de) 2019-01-21 2022-02-10 Carl Zeiss Smt Gmbh Vorrichtung, Verfahren und Computerprogram zum Bestimmen einer Position eines Elements auf einer fotolithographischen Maske

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US3874916A (en) * 1972-06-23 1975-04-01 Radiant Energy Systems Mask alignment system for electron beam pattern generator
JPS5398781A (en) 1976-11-25 1978-08-29 Jeol Ltd Electron ray exposure unit
JPS5530811A (en) * 1978-08-25 1980-03-04 Chiyou Lsi Gijutsu Kenkyu Kumiai Single field alignment method
JPS57183034A (en) 1981-05-07 1982-11-11 Toshiba Corp Electron bean transfer device
JPS62287556A (ja) * 1986-06-05 1987-12-14 Toshiba Corp 荷電ビ−ムの軸合せ方法
AT393925B (de) 1987-06-02 1992-01-10 Ims Ionen Mikrofab Syst Anordnung zur durchfuehrung eines verfahrens zum positionieren der abbildung der auf einer maske befindlichen struktur auf ein substrat, und verfahren zum ausrichten von auf einer maske angeordneten markierungen auf markierungen, die auf einem traeger angeordnet sind
US4818885A (en) 1987-06-30 1989-04-04 International Business Machines Corporation Electron beam writing method and system using large range deflection in combination with a continuously moving table
JPH0831405B2 (ja) * 1988-06-01 1996-03-27 イーエムエス イオーネン ミクロファブ リカチオンス ジステーメ ゲゼルシャフト ミト ベシュレンクテル ハフツング イオン投射リソグラフイー装置および方法
JPH0722010B2 (ja) 1989-09-28 1995-03-08 株式会社日立製作所 電子線描画装置
US5043586A (en) * 1990-10-25 1991-08-27 International Business Machines Corporation Planarized, reusable calibration grids
JP3148353B2 (ja) 1991-05-30 2001-03-19 ケーエルエー・インストルメンツ・コーポレーション 電子ビーム検査方法とそのシステム
JP2788139B2 (ja) 1991-09-25 1998-08-20 株式会社日立製作所 電子線描画装置
US5424548A (en) 1993-09-21 1995-06-13 International Business Machines Corp. Pattern specific calibration for E-beam lithography
US5552611A (en) 1995-06-06 1996-09-03 International Business Machines Pseudo-random registration masks for projection lithography tool
JPH09246135A (ja) * 1996-03-04 1997-09-19 Hitachi Ltd 荷電粒子ビーム描画装置
US5793048A (en) * 1996-12-18 1998-08-11 International Business Machines Corporation Curvilinear variable axis lens correction with shifted dipoles
US6218671B1 (en) * 1998-08-31 2001-04-17 Nikon Corporation On-line dynamic corrections adjustment method

Also Published As

Publication number Publication date
JP3344713B2 (ja) 2002-11-18
US6437347B1 (en) 2002-08-20
US20020056813A1 (en) 2002-05-16
EP1045427A3 (de) 2000-12-27
JP2000349021A (ja) 2000-12-15
DE60034625D1 (de) 2007-06-14
EP1045427B1 (de) 2007-05-02
DE60034625T2 (de) 2008-01-03
EP1045427A2 (de) 2000-10-18

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