ATE335253T1 - Kontaktlose oder kombinierte kontaktlose/kontaktbehaftete chipkarte mit verstärkter montage des chipmoduls - Google Patents

Kontaktlose oder kombinierte kontaktlose/kontaktbehaftete chipkarte mit verstärkter montage des chipmoduls

Info

Publication number
ATE335253T1
ATE335253T1 AT02777434T AT02777434T ATE335253T1 AT E335253 T1 ATE335253 T1 AT E335253T1 AT 02777434 T AT02777434 T AT 02777434T AT 02777434 T AT02777434 T AT 02777434T AT E335253 T1 ATE335253 T1 AT E335253T1
Authority
AT
Austria
Prior art keywords
contactless
card
support
antenna
combined
Prior art date
Application number
AT02777434T
Other languages
English (en)
Inventor
Christophe Halope
Original Assignee
Ask Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR0111918A external-priority patent/FR2829856A1/fr
Application filed by Ask Sa filed Critical Ask Sa
Application granted granted Critical
Publication of ATE335253T1 publication Critical patent/ATE335253T1/de

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07728Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
AT02777434T 2001-09-14 2002-09-13 Kontaktlose oder kombinierte kontaktlose/kontaktbehaftete chipkarte mit verstärkter montage des chipmoduls ATE335253T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0111918A FR2829856A1 (fr) 2001-09-14 2001-09-14 Carte a puce hybride contact-sans contact a tenue renforcee du module electronique
FR0202161A FR2829857B1 (fr) 2001-09-14 2002-02-20 Carte a puce sans contact ou hybride contact-sans contact a tenue renforcee du module electronique

Publications (1)

Publication Number Publication Date
ATE335253T1 true ATE335253T1 (de) 2006-08-15

Family

ID=26213186

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02777434T ATE335253T1 (de) 2001-09-14 2002-09-13 Kontaktlose oder kombinierte kontaktlose/kontaktbehaftete chipkarte mit verstärkter montage des chipmoduls

Country Status (19)

Country Link
US (1) US6851618B2 (de)
EP (1) EP1425714B1 (de)
JP (1) JP4249020B2 (de)
KR (1) KR100927881B1 (de)
CN (1) CN1273925C (de)
AT (1) ATE335253T1 (de)
AU (1) AU2002339052B2 (de)
BR (1) BRPI0205985B1 (de)
CA (1) CA2429435C (de)
DE (1) DE60213619T2 (de)
FR (1) FR2829857B1 (de)
IL (2) IL155882A0 (de)
MX (1) MXPA03004197A (de)
NO (1) NO334926B1 (de)
NZ (1) NZ525890A (de)
PL (1) PL200142B1 (de)
RU (1) RU2295155C2 (de)
TW (1) TWI222601B (de)
WO (1) WO2003025850A1 (de)

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MY148205A (en) * 2003-05-13 2013-03-15 Nagraid Sa Process for assembling an electronic component on a substrate
FR2855637B1 (fr) * 2003-05-26 2005-11-18 A S K Procede de fabrication d'un ticket sans contact et ticket obtenu a partir de ce procede
FR2857483B1 (fr) * 2003-07-11 2005-10-07 Oberthur Card Syst Sa Carte a puce anti-intrusion
JP4454585B2 (ja) * 2003-12-10 2010-04-21 王子製紙株式会社 Icチップ内蔵テープを用いたicチップ内蔵シート
DE602004016690D1 (de) * 2004-03-25 2008-10-30 Bauer Eric Verfahren zur herstellung eines elektronischen labels
US8407097B2 (en) 2004-04-15 2013-03-26 Hand Held Products, Inc. Proximity transaction apparatus and methods of use thereof
EP1789914A1 (de) * 2004-08-31 2007-05-30 Koninklijke Philips Electronics N.V. Chip mit verschiedenen chipkontakten für verschiedene betriebsarten
US7225537B2 (en) * 2005-01-27 2007-06-05 Cardxx, Inc. Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces
ATE481690T1 (de) 2005-03-21 2010-10-15 Nxp Bv Rfid-kennzeichnung und verfahren zur herstellung einer rfid-kennzeichnung
JP2008537215A (ja) * 2005-03-23 2008-09-11 カードエックスエックス インコーポレイテッド 高品質外面を有する等方性熱硬化接着材料を使用して集積電子機器を備えた最新スマートカードを製造する方法。
FR2890212B1 (fr) * 2005-08-30 2009-08-21 Smart Packaging Solutions Sps Module electronique a double interface de communication, notamment pour carte a puce
US7224278B2 (en) * 2005-10-18 2007-05-29 Avery Dennison Corporation Label with electronic components and method of making same
JP4825522B2 (ja) * 2005-12-26 2011-11-30 共同印刷株式会社 Icカード、インレットシート及びicカードの製造方法
US20070290048A1 (en) * 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
US7701352B2 (en) * 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
FR2917871B1 (fr) * 2007-06-21 2010-10-22 Smart Packaging Solutions Sps Insert securise notamment pour carte a puce
FR2922342B1 (fr) * 2007-10-11 2010-07-30 Ask Sa Support de dispositif d'identification radiofrequence renforce et son procede de fabrication
US20100288436A1 (en) * 2008-02-04 2010-11-18 Solido 3D, Ltd. Depicting interior details in a three-dimensional object
EP2116366B1 (de) * 2008-05-06 2015-08-12 HID Global GmbH Funktionelles Laminat
RU2468430C1 (ru) * 2008-10-23 2012-11-27 ОСЕЛОТ, ЭлЭлСи. Устройство для хранения данных (варианты)
DE102009030818B4 (de) 2009-06-26 2013-04-18 Bundesdruckerei Gmbh Verfahren und Vorrichtung zum Herstellen eines Halbzeugs oder eines das Halbzeug umfassenden Sicherheitsdokuments
US8245959B1 (en) 2009-06-30 2012-08-21 Emc Corporation Powered card and method of disposing of the same
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
FR2964487B1 (fr) * 2010-09-02 2013-07-12 Oberthur Technologies Carte a microcircuit comprenant un moyen lumineux
EP2426627B1 (de) * 2010-09-02 2016-10-12 Oberthur Technologies Leuchtmodul für Mikroschaltungsvorrichtung
FR2977958A1 (fr) * 2011-07-12 2013-01-18 Ask Sa Carte a circuit integre hybride contact-sans contact a tenue renforcee du module electronique
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9424507B2 (en) 2014-04-01 2016-08-23 Nxp B.V. Dual interface IC card components and method for manufacturing the dual-interface IC card components
US9536188B2 (en) 2014-04-01 2017-01-03 Nxp B.V. Dual-interface IC card components and method for manufacturing the dual-interface IC card components
KR101535106B1 (ko) * 2014-04-11 2015-07-09 코나씨 주식회사 모시 원단 시트를 포함하는 카드 및 이의 제조 방법
FR3088515B1 (fr) * 2018-11-08 2022-01-28 Smart Packaging Solutions Module electronique pour carte a puce
CN110576612B (zh) * 2019-08-08 2021-06-18 广州明森合兴科技有限公司 一种非接触智能卡制造的定位方法及生产方法
FR3157614A1 (fr) * 2023-12-26 2025-06-27 Idemia France Carte équipée d’une interface sans contact et procédé de fabrication de la carte équipée d’une interface sans contact

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DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
RU2032219C1 (ru) * 1992-01-31 1995-03-27 Научно-технический центр Федерального агентства правительственной связи и информации при Президенте Российской Федерации Идентификационная карта
DE4403513A1 (de) * 1994-02-04 1995-08-10 Giesecke & Devrient Gmbh Chipkarte mit einem elektronischen Modul und Verfahren zur Herstellung einer solchen Chipkarte
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE19710144C2 (de) * 1997-03-13 1999-10-14 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte
US6025054A (en) * 1997-09-08 2000-02-15 Cardxx, Inc. Smart cards having glue-positioned electronic components
FR2778475B1 (fr) * 1998-05-11 2001-11-23 Schlumberger Systems & Service Carte a memoire du type sans contact, et procede de fabrication d'une telle carte
FR2801708B1 (fr) * 1999-11-29 2003-12-26 A S K Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux
FR2801709B1 (fr) * 1999-11-29 2002-02-15 A S K Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude
FR2801707B1 (fr) * 1999-11-29 2002-02-15 A S K Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux
RU2158204C1 (ru) * 2000-03-17 2000-10-27 Закрытое акционерное общество "Розан-Файненс" Способ изготовления ламинированных бесконтактных чиповых карт

Also Published As

Publication number Publication date
WO2003025850A1 (fr) 2003-03-27
HK1063232A1 (en) 2004-12-17
US20030052177A1 (en) 2003-03-20
PL200142B1 (pl) 2008-12-31
NO334926B1 (no) 2014-07-14
NO20032102L (no) 2003-07-11
BR0205985A (pt) 2003-10-21
TWI222601B (en) 2004-10-21
KR20040032087A (ko) 2004-04-14
DE60213619T2 (de) 2007-10-18
CA2429435C (fr) 2012-05-08
PL361780A1 (en) 2004-10-04
IL155882A (en) 2007-06-17
CA2429435A1 (fr) 2003-03-27
DE60213619D1 (de) 2006-09-14
KR100927881B1 (ko) 2009-11-23
AU2002339052B2 (en) 2008-08-28
IL155882A0 (en) 2003-12-23
CN1273925C (zh) 2006-09-06
RU2295155C2 (ru) 2007-03-10
MXPA03004197A (es) 2004-04-20
EP1425714B1 (de) 2006-08-02
NZ525890A (en) 2004-12-24
FR2829857A1 (fr) 2003-03-21
BRPI0205985B1 (pt) 2015-06-23
JP4249020B2 (ja) 2009-04-02
US6851618B2 (en) 2005-02-08
EP1425714A1 (de) 2004-06-09
FR2829857B1 (fr) 2004-09-17
NO20032102D0 (no) 2003-05-09
CN1476587A (zh) 2004-02-18
JP2005503620A (ja) 2005-02-03

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