ATE331329T1 - Laser-detektor-einheit und verfahren zur montage derselben - Google Patents
Laser-detektor-einheit und verfahren zur montage derselbenInfo
- Publication number
- ATE331329T1 ATE331329T1 AT02721334T AT02721334T ATE331329T1 AT E331329 T1 ATE331329 T1 AT E331329T1 AT 02721334 T AT02721334 T AT 02721334T AT 02721334 T AT02721334 T AT 02721334T AT E331329 T1 ATE331329 T1 AT E331329T1
- Authority
- AT
- Austria
- Prior art keywords
- reference surface
- mount
- sub
- laser
- laser diode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02375—Positioning of the laser chips
- H01S5/0238—Positioning of the laser chips using marks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02375—Positioning of the laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Optical Head (AREA)
- Lasers (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US27540201P | 2001-03-13 | 2001-03-13 | |
| US09/923,471 US6577656B2 (en) | 2001-03-13 | 2001-08-06 | System and method of packaging a laser/detector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE331329T1 true ATE331329T1 (de) | 2006-07-15 |
Family
ID=26957398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02721334T ATE331329T1 (de) | 2001-03-13 | 2002-03-08 | Laser-detektor-einheit und verfahren zur montage derselben |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6577656B2 (de) |
| EP (1) | EP1380079B1 (de) |
| AT (1) | ATE331329T1 (de) |
| AU (1) | AU2002252271A1 (de) |
| DE (1) | DE60212609D1 (de) |
| WO (1) | WO2002073755A2 (de) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4262937B2 (ja) * | 2001-07-26 | 2009-05-13 | シャープ株式会社 | 半導体レーザ装置 |
| USD484105S1 (en) | 2002-07-10 | 2003-12-23 | Mitsubishi Denki Kabushiki Kaisha | Optical module |
| USD494147S1 (en) | 2002-07-10 | 2004-08-10 | Mitsubishi Denki Kabushiki Kaisha | Optical module |
| USD483338S1 (en) | 2002-07-10 | 2003-12-09 | Mitsubishi Denki Kabushiki Kaisha | Optical module |
| USD505664S1 (en) * | 2002-07-10 | 2005-05-31 | Mitsubishi Denki Kabushiki Kaisha | Optical package |
| US7061949B1 (en) * | 2002-08-16 | 2006-06-13 | Jds Uniphase Corporation | Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth |
| US7061025B2 (en) * | 2003-03-10 | 2006-06-13 | Mccolloch Lawrence R | Optoelectronic device packaging assemblies and methods of making the same |
| KR100871011B1 (ko) | 2008-01-23 | 2008-11-27 | 김정수 | 파장 잠금 기능을 갖는 티오형 레이저 다이오드 패키지 및 그 패키지에 구비된 경사필터의 제작 방법 |
| KR100841210B1 (ko) * | 2007-11-26 | 2008-06-24 | 김정수 | 경사거울의 후면 반사율이 조절된 티오형 레이저 다이오드 패키지 및 그 경사거울의 제작 방법 |
| JP2011077456A (ja) * | 2009-10-01 | 2011-04-14 | Sumitomo Electric Ind Ltd | 半導体光素子及び半導体光デバイス |
| US8456961B1 (en) | 2011-03-22 | 2013-06-04 | Western Digital (Fremont), Llc | Systems and methods for mounting and aligning a laser in an electrically assisted magnetic recording assembly |
| US8518748B1 (en) | 2011-06-29 | 2013-08-27 | Western Digital (Fremont), Llc | Method and system for providing a laser submount for an energy assisted magnetic recording head |
| US8288204B1 (en) | 2011-08-30 | 2012-10-16 | Western Digital (Fremont), Llc | Methods for fabricating components with precise dimension control |
| US9475151B1 (en) | 2012-10-30 | 2016-10-25 | Western Digital (Fremont), Llc | Method and apparatus for attaching a laser diode and a slider in an energy assisted magnetic recording head |
| JP2020009915A (ja) * | 2018-07-09 | 2020-01-16 | ウシオオプトセミコンダクター株式会社 | 半導体発光装置および半導体発光装置の製造方法 |
| CN110783810B (zh) * | 2019-10-23 | 2020-08-14 | 武汉东飞凌科技有限公司 | 同轴封装型边发射激光器的封帽同轴度定位方法 |
| EP3965145B1 (de) | 2020-09-03 | 2025-04-16 | Schott Ag | Transistorsockel für optoelektronisches hochgeschwindigkeits-gehäuse |
| EP3965147A1 (de) * | 2020-09-03 | 2022-03-09 | Schott Ag | Sockel für eine elektronische oder optoelektronische komponente und verfahren zu seiner herstellung |
| EP3965146B1 (de) | 2020-09-03 | 2025-04-09 | Schott Ag | Sockel für eine elektronische komponente |
| US20230176196A1 (en) * | 2021-12-08 | 2023-06-08 | Beijing Voyager Technology Co., Ltd. | Submount for a transmitter of an optical sensing system including a pair of co-packaged laser bars |
| TWI841329B (zh) * | 2023-03-30 | 2024-05-01 | 佳必琪國際股份有限公司 | 防水電連接裝置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0691296B2 (ja) | 1987-03-31 | 1994-11-14 | 三菱電機株式会社 | 半導体レ−ザの組立方法 |
| EP0366472B1 (de) * | 1988-10-28 | 1994-01-19 | Matsushita Electric Industrial Co., Ltd. | Halbleiterlaser-Vorrichtung |
| JPH03274781A (ja) * | 1990-03-23 | 1991-12-05 | Rohm Co Ltd | レーザダイオード |
| US5485479A (en) * | 1990-11-07 | 1996-01-16 | Fuji Electric Co., Ltd. | Semiconductor laser device encapsulated in a transparent resin layer |
| JPH07170019A (ja) * | 1993-12-14 | 1995-07-04 | Fuji Electric Co Ltd | 半導体レーザ装置 |
| JP2695995B2 (ja) * | 1991-01-14 | 1998-01-14 | 株式会社東芝 | 光半導体装置 |
| US5367530A (en) * | 1992-05-29 | 1994-11-22 | Sanyo Electric Co., Ltd. | Semiconductor laser apparatus |
| JPH0799368A (ja) * | 1993-09-29 | 1995-04-11 | Mitsubishi Electric Corp | 光半導体装置 |
| JPH07335980A (ja) * | 1994-06-07 | 1995-12-22 | Fuji Electric Co Ltd | 半導体レーザ装置 |
| US5764675A (en) * | 1994-06-30 | 1998-06-09 | Juhala; Roland E. | Diode laser array |
| JP3082695B2 (ja) * | 1997-01-16 | 2000-08-28 | 日本電気株式会社 | 半導体レーザ装置、その製造方法 |
| GB2326760B (en) * | 1997-06-28 | 2002-02-13 | Mitel Semiconductor Ab | Optical source with monitor |
-
2001
- 2001-08-06 US US09/923,471 patent/US6577656B2/en not_active Expired - Lifetime
-
2002
- 2002-03-08 AU AU2002252271A patent/AU2002252271A1/en not_active Abandoned
- 2002-03-08 AT AT02721334T patent/ATE331329T1/de not_active IP Right Cessation
- 2002-03-08 EP EP02721334A patent/EP1380079B1/de not_active Expired - Lifetime
- 2002-03-08 WO PCT/US2002/007247 patent/WO2002073755A2/en not_active Ceased
- 2002-03-08 DE DE60212609T patent/DE60212609D1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1380079B1 (de) | 2006-06-21 |
| DE60212609D1 (de) | 2006-08-03 |
| AU2002252271A1 (en) | 2002-09-24 |
| WO2002073755A3 (en) | 2003-09-18 |
| EP1380079A2 (de) | 2004-01-14 |
| WO2002073755A2 (en) | 2002-09-19 |
| US6577656B2 (en) | 2003-06-10 |
| US20020131460A1 (en) | 2002-09-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |