ATE327853T1 - Verfahren und vorrichtung zum abgeben eines materials in einem drucker - Google Patents

Verfahren und vorrichtung zum abgeben eines materials in einem drucker

Info

Publication number
ATE327853T1
ATE327853T1 AT00908338T AT00908338T ATE327853T1 AT E327853 T1 ATE327853 T1 AT E327853T1 AT 00908338 T AT00908338 T AT 00908338T AT 00908338 T AT00908338 T AT 00908338T AT E327853 T1 ATE327853 T1 AT E327853T1
Authority
AT
Austria
Prior art keywords
substrate
frame
viscous material
printer
dispensing
Prior art date
Application number
AT00908338T
Other languages
English (en)
Inventor
Mark Rossmeisl
Gary Freeman
Robert J Balog
Original Assignee
Speedline Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedline Technologies Inc filed Critical Speedline Technologies Inc
Application granted granted Critical
Publication of ATE327853T1 publication Critical patent/ATE327853T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0692—Solder baths with intermediary means for bringing solder on workpiece, e.g. rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Coating Apparatus (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
  • Fixing For Electrophotography (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
AT00908338T 1999-01-21 2000-01-21 Verfahren und vorrichtung zum abgeben eines materials in einem drucker ATE327853T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/235,034 US6324973B2 (en) 1997-11-07 1999-01-21 Method and apparatus for dispensing material in a printer

Publications (1)

Publication Number Publication Date
ATE327853T1 true ATE327853T1 (de) 2006-06-15

Family

ID=22883803

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00908338T ATE327853T1 (de) 1999-01-21 2000-01-21 Verfahren und vorrichtung zum abgeben eines materials in einem drucker

Country Status (10)

Country Link
US (2) US6324973B2 (de)
EP (1) EP1144150B1 (de)
JP (1) JP2002540592A (de)
CN (1) CN1158155C (de)
AT (1) ATE327853T1 (de)
AU (1) AU2970400A (de)
CA (1) CA2359953A1 (de)
DE (1) DE60028338T2 (de)
HK (1) HK1044907A1 (de)
WO (1) WO2000043156A1 (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6324973B2 (en) 1997-11-07 2001-12-04 Speedline Technologies, Inc. Method and apparatus for dispensing material in a printer
US6957783B1 (en) 1999-01-26 2005-10-25 Dl Technology Llc Dispense tip with vented outlets
US7207498B1 (en) 2000-01-26 2007-04-24 Dl Technology, Llc Fluid dispense tips
US6511301B1 (en) 1999-11-08 2003-01-28 Jeffrey Fugere Fluid pump and cartridge
US6866881B2 (en) * 1999-02-19 2005-03-15 Speedline Technologies, Inc. Dispensing system and method
US6891967B2 (en) * 1999-05-04 2005-05-10 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US7072503B2 (en) * 1999-05-04 2006-07-04 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US6892959B1 (en) 2000-01-26 2005-05-17 Dl Technology Llc System and method for control of fluid dispense pump
US6981664B1 (en) 2000-01-26 2006-01-03 Dl Technology Llc Fluid dispense tips
US6435396B1 (en) * 2000-04-10 2002-08-20 Micron Technology, Inc. Print head for ejecting liquid droplets
GB2360252B (en) * 2000-03-07 2002-07-24 Matsushita Electric Ind Co Ltd Screen printing method
US6878396B2 (en) * 2000-04-10 2005-04-12 Micron Technology, Inc. Micro C-4 semiconductor die and method for depositing connection sites thereon
US6571701B1 (en) 2001-05-04 2003-06-03 Speedline Technologies, Inc. Stirring mechanism for viscous-material printer and method of printing
US6983867B1 (en) 2002-04-29 2006-01-10 Dl Technology Llc Fluid dispense pump with drip prevention mechanism and method for controlling same
US20040045458A1 (en) * 2002-09-06 2004-03-11 Gerald Pham-Van-Diep Method and apparatus for releasing materials from stencils
EP1415805A1 (de) * 2002-10-28 2004-05-06 Hauni Maschinenbau AG Druckwerk mit Temperiereinrichtung
US6955120B2 (en) 2003-03-28 2005-10-18 Speedline Technologies, Inc. Pressure control system for printing a viscous material
US7331482B1 (en) 2003-03-28 2008-02-19 Dl Technology, Llc Dispense pump with heated pump housing and heated material reservoir
US20040244612A1 (en) * 2003-03-28 2004-12-09 Speedline Technologies, Inc. Method and apparatus for printing viscous material
US20040238003A1 (en) * 2003-05-30 2004-12-02 Gerald Pham-Van-Diep Stencil cleaner for use in the solder paste print operation
US7013802B2 (en) * 2004-02-19 2006-03-21 Speedline Technologies, Inc. Method and apparatus for simultaneous inspection and cleaning of a stencil
KR100591693B1 (ko) * 2004-04-13 2006-06-22 주식회사 탑 엔지니어링 페이스트 도포기 및 그 제어 방법
US20050268799A1 (en) * 2004-06-02 2005-12-08 Speedline Technologies, Inc. Solder paste lateral flow and redistribution system and methods of same
US7249558B2 (en) * 2004-07-15 2007-07-31 Speedline Technologies, Inc. Solder paste dispenser for a stencil printer
JP4907253B2 (ja) * 2006-08-03 2012-03-28 シャープ株式会社 注入装置、製造装置、および半導体発光装置の製造方法
US8707559B1 (en) 2007-02-20 2014-04-29 Dl Technology, Llc Material dispense tips and methods for manufacturing the same
US7806048B2 (en) * 2007-04-13 2010-10-05 Illinois Tool Works, Inc. Method and apparatus for calibrating print head pressure and applying an accurate print pressure during production
US7987781B2 (en) 2008-02-14 2011-08-02 Illinois Tool Works, Inc. Method and apparatus for applying an accurate print pressure during production
US8864055B2 (en) 2009-05-01 2014-10-21 Dl Technology, Llc Material dispense tips and methods for forming the same
US20110054543A1 (en) * 2009-08-31 2011-03-03 Warsaw Orthopedic, Inc. Locking mechanism
US8331844B2 (en) 2010-04-14 2012-12-11 Xerox Corporation Proof printing using recycled marking material
JP5854857B2 (ja) * 2012-01-24 2016-02-09 ヤマハ発動機株式会社 印刷装置、印刷装置の温度調整方法、および印刷装置の温度調整システム
US8939073B2 (en) 2012-02-08 2015-01-27 Illinois Tool Works Inc. Print head for stencil printer
US9725225B1 (en) 2012-02-24 2017-08-08 Dl Technology, Llc Micro-volume dispense pump systems and methods
CN103375006B (zh) * 2012-04-11 2015-12-09 佛山市三水森诺建材有限公司 马赛克印刷胶粘剂成联工艺
CN103249262B (zh) * 2013-05-21 2015-08-12 无锡江南计算技术研究所 表面贴装互联座焊膏印刷钢网开口结构
JP6051411B2 (ja) * 2013-12-27 2016-12-27 パナソニックＩｐマネジメント株式会社 ペースト供給装置、スクリーン印刷機及びペースト供給方法
US9370924B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Dual action stencil wiper assembly for stencil printer
US9370925B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
US9370923B1 (en) 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US11746656B1 (en) 2019-05-13 2023-09-05 DL Technology, LLC. Micro-volume dispense pump systems and methods
US20240034049A1 (en) * 2022-07-29 2024-02-01 Illinois Tool Works Inc. Stencil printer cover

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3097554A (en) 1963-07-16 Fluid driven mechanism
US2382920A (en) 1941-11-18 1945-08-14 Charles F Schaefer Stencil coating machine
US2571064A (en) 1945-11-01 1951-10-09 Charles F Schaefer Mounting for stencil screens
US3037457A (en) 1959-08-26 1962-06-05 Gen Electric Pumps
US3463363A (en) 1967-10-12 1969-08-26 Fusion Inc Applicator gun
DE2108085C3 (de) 1970-03-09 1974-08-22 Peter Kufstein Zimmer (Oesterreich) Rakelrolle
US3921521A (en) 1970-07-23 1975-11-25 Zimmer Peter Squeegee device
CH552471A (de) 1972-05-30 1974-08-15 Zimmer Peter Rakeleinrichtung an schablonendruckmaschine.
AT321855B (de) 1973-04-03 1975-04-25 Zimmer Johannes Vorrichtung zum bedrucken von warenbahnen
US4043683A (en) 1974-06-20 1977-08-23 Loctite Corporation Dispensing and wiping device
US4023486A (en) 1974-08-01 1977-05-17 E.T. Barwick Industries Screen printing squeegee apparatus
FI52028C (fi) 1976-01-13 1977-06-10 Outokumpu Oy Vaahdotuskenno.
US4032046A (en) * 1976-11-01 1977-06-28 Usm Corporation Apparatus for feeding glue to a hot melt glue dispensing appliance
US4485736A (en) 1983-08-26 1984-12-04 Strutz Jr Carl Ink-dispensing system and method for silk-screen printing having squeegee stroke movement counter
US5050498A (en) * 1984-11-02 1991-09-24 Smith Michael S Stencil manufacturing and printing process and apparatus
US4636406A (en) * 1984-12-31 1987-01-13 Motorola, Inc. Method and apparatus for dispensing solder paste
SE460779B (sv) 1985-02-27 1989-11-20 Svecia Silkscreen Maskiner Ab Rakelarrangemang foer en stenciltryckmaskin
US4622239A (en) * 1986-02-18 1986-11-11 At&T Technologies, Inc. Method and apparatus for dispensing viscous materials
JPH0777665B2 (ja) 1986-05-16 1995-08-23 栄修 永田 ハンダ付け方法およびハンダ付け装置
US4720402A (en) * 1987-01-30 1988-01-19 American Telephone And Telegraph Company Method for dispensing viscous material
DE3823200C1 (de) 1988-07-08 1990-03-08 Gerhard 4800 Bielefeld De Klemm
US4942998A (en) 1988-12-15 1990-07-24 Horvath Bruce B Apparatus and process for automatically dispensing metal alloy paste material for joining metal components
US4961955A (en) 1988-12-20 1990-10-09 Itt Corporation Solder paste applicator for circuit boards
US5211311A (en) 1989-06-23 1993-05-18 E. R. Carpenter Company, Inc. Cartridge for a dispenser of reactive chemicals
US5044306A (en) 1990-06-11 1991-09-03 Gunter Erdmann Solder applying mechanism
GB2257386B (en) 1991-06-24 1995-07-05 Tani Denki Kogyo Kk Screen printing apparatus
US5309837A (en) 1991-06-24 1994-05-10 Tani Denkikogyo Co., Ltd. Method for screen printing of paste
GB2279899B (en) 1991-06-24 1995-07-05 Tani Denki Kogyo Kk A screen printing system
GB2259661A (en) 1991-09-18 1993-03-24 Ibm Depositing solder on printed circuit boards
US5320250A (en) 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
CA2143287A1 (en) 1992-08-28 1994-03-17 Edgar B. Chiswell Retracting writing instrument having replaceable cartridge
JP3345653B2 (ja) * 1993-05-12 2002-11-18 谷電機工業株式会社 スクリーン版クリーニング装置
JP3583462B2 (ja) 1993-04-05 2004-11-04 フォード モーター カンパニー 電子成分のための微小はんだ付け装置および方法
TW288254B (de) 1993-05-19 1996-10-11 Tani Denki Kogyo Kk
US5553540A (en) 1993-05-19 1996-09-10 Tani Denkikogyo Co., Ltd. Method for screen printing of viscous materials
US5407488A (en) 1993-10-12 1995-04-18 At&T Corp. Method and apparatus for in-situ removal of material from openings in a stencil
EP0800457B1 (de) 1994-12-27 2000-07-05 Ford Motor Company Verfahren und vorrichtung zum abgeben eines viskosen materials
MY112503A (en) * 1995-03-01 2001-06-30 Tani Electronics Ind Co Ltd Screen printing method and apparatus therefor
DE19541996C2 (de) 1995-11-10 1997-09-25 David Finn Vorrichtung zur Applikation von Verbindungsmaterialeinheiten
EP1029626B1 (de) * 1995-11-16 2004-06-23 Nordson Corporation Verfahren und Vorrichtung zur Ausgabe von kleinen Mengen eines flüssiges Materials
JP2896343B2 (ja) * 1996-05-14 1999-05-31 谷電機工業株式会社 印刷用スキージー装置
FR2754473B1 (fr) 1996-10-15 1999-02-26 Novatec Procede de realisation de depots de produit visqueux et/ou pateux sur un substrat a travers les ouvertures d'un pochoir et dispositif distributeur de produit
US6324973B2 (en) 1997-11-07 2001-12-04 Speedline Technologies, Inc. Method and apparatus for dispensing material in a printer
US5947022A (en) * 1997-11-07 1999-09-07 Speedline Technologies, Inc. Apparatus for dispensing material in a printer

Also Published As

Publication number Publication date
EP1144150A1 (de) 2001-10-17
JP2002540592A (ja) 2002-11-26
US6626097B2 (en) 2003-09-30
US6324973B2 (en) 2001-12-04
DE60028338D1 (de) 2006-07-06
US20010011506A1 (en) 2001-08-09
EP1144150B1 (de) 2006-05-31
CN1158155C (zh) 2004-07-21
DE60028338T2 (de) 2007-05-10
WO2000043156A1 (en) 2000-07-27
US20020007741A1 (en) 2002-01-24
AU2970400A (en) 2000-08-07
CA2359953A1 (en) 2000-07-27
CN1339993A (zh) 2002-03-13
HK1044907A1 (zh) 2002-11-08

Similar Documents

Publication Publication Date Title
ATE327853T1 (de) Verfahren und vorrichtung zum abgeben eines materials in einem drucker
DE69820905D1 (de) Vorrichtung zum aufbringen eines materials auf einem substrat
TW200724384A (en) Printing apparatus for liquid crystal display device and pattern forming method using the same
DE60111668D1 (de) Vorrichtung zum Auf- und Abbewegen von einem Druckkopf, Druckvorrichtung
WO2005118160A3 (en) Droplet dispensing in imprint lithography
DE19983145T1 (de) Vorrichtung zum Abgeben eines losen Erzeugnisses
HK1054345A1 (en) Method and apparatus for making particle-embedded webs.
DE60022433D1 (de) Verfahren zum Bedrucken eines Trägers und ein diesem Verfahren angepasstes Druckgerät
ATE246128T1 (de) Vorrichtung zum ausgeben eines produkts mit konzentrationsgradienten
DE60032980D1 (de) Verfahren und Vorrichtung zum Überführen eines flüssigen Materials in ein Gas.
JP3810319B2 (ja) 錠剤型の対象物、特に医薬錠剤の印刷装置および印刷方法
DE60032076D1 (de) Vorrichtung zum drucken eines zeichens und damit versehene frankiermaschine
DE59800908D1 (de) Vorrichtung und Verfahren zur Unterstützung der ferngesteuerten Anwahl von Farbdosierelementen in Farbkästen von Rotationdsdruckmachinen, insbesondere zum Druck von Zeitungen
DE60136708D1 (de) Verfahren und gerät zum drucken auf einem gewölbten substrat
ATE406085T1 (de) Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat
US6823782B2 (en) Stencil printing machine
DE60043542D1 (de) Verfahren und apparat zum verteilen eines behandlungsmittels auf eine sich bewegende bahn
TW200744858A (en) Method and apparatus for manufacturing a pattern on a substrate and a liquid crystal display
US7854196B2 (en) Apparatus for the coating or flocking of articles, especially of textile materials and flocking machine
DE69623135T2 (de) Vorrichtung zum Drucken mit flüssiger Tinte
US4893952A (en) Dot matrix printing system including improved ink transfer mechanism
ATE239616T1 (de) Verfahren und vorrichtung zum entfernen von farbe aus einem einseitig offenen behälter
GB9922598D0 (en) Apparatus for bringing an ink-chamber doctor blade device into contact with, and removing it from, the screen roller of a printing machine
DE60038491D1 (de) Lithographisches verfahren und lithographische vorrichtung, verfahren und vorrichtung zur herstellung einer druckplatte und verfahren und vorrichtung zum tintenstrahldrucken
JP2007050605A (ja) 光触媒噴射施工装置付き印刷機

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties