ATE324671T1 - Licht-emittierende diode mit verbesserter wärmezerstreuung - Google Patents
Licht-emittierende diode mit verbesserter wärmezerstreuungInfo
- Publication number
- ATE324671T1 ATE324671T1 AT00126394T AT00126394T ATE324671T1 AT E324671 T1 ATE324671 T1 AT E324671T1 AT 00126394 T AT00126394 T AT 00126394T AT 00126394 T AT00126394 T AT 00126394T AT E324671 T1 ATE324671 T1 AT E324671T1
- Authority
- AT
- Austria
- Prior art keywords
- chip
- connection
- connecting pins
- emitting diode
- plate connection
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8585—Means for heat extraction or cooling being an interconnection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8582—Means for heat extraction or cooling characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Led Device Packages (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP00126394A EP1211735B1 (de) | 2000-12-04 | 2000-12-04 | Licht-emittierende Diode mit verbesserter Wärmezerstreuung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE324671T1 true ATE324671T1 (de) | 2006-05-15 |
Family
ID=8170554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT00126394T ATE324671T1 (de) | 2000-12-04 | 2000-12-04 | Licht-emittierende diode mit verbesserter wärmezerstreuung |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP1211735B1 (de) |
| AT (1) | ATE324671T1 (de) |
| DE (1) | DE60027579D1 (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030058650A1 (en) * | 2001-09-25 | 2003-03-27 | Kelvin Shih | Light emitting diode with integrated heat dissipater |
| JP5569558B2 (ja) * | 2012-06-06 | 2014-08-13 | 第一精工株式会社 | 電気部品用ハウジング |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2315709A1 (de) * | 1973-03-29 | 1974-10-10 | Licentia Gmbh | Strahlung abgebende halbleiteranordnung mit hoher strahlungsleistung |
| US4478588A (en) * | 1978-03-06 | 1984-10-23 | Amp Incorporated | Light emitting diode assembly |
| JPH06204604A (ja) * | 1993-01-06 | 1994-07-22 | Sanyo Electric Co Ltd | 半導体レーザー装置 |
| JPH07335980A (ja) * | 1994-06-07 | 1995-12-22 | Fuji Electric Co Ltd | 半導体レーザ装置 |
| US5660461A (en) * | 1994-12-08 | 1997-08-26 | Quantum Devices, Inc. | Arrays of optoelectronic devices and method of making same |
| EP1566846B1 (de) * | 1997-07-29 | 2016-02-03 | OSRAM Opto Semiconductors GmbH | Optoelektronisches Bauelement |
| WO1999060626A1 (fr) * | 1998-05-20 | 1999-11-25 | Rohm Co., Ltd. | Dispositif semi-conducteur |
-
2000
- 2000-12-04 EP EP00126394A patent/EP1211735B1/de not_active Expired - Lifetime
- 2000-12-04 DE DE60027579T patent/DE60027579D1/de not_active Expired - Lifetime
- 2000-12-04 AT AT00126394T patent/ATE324671T1/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1211735B1 (de) | 2006-04-26 |
| EP1211735A1 (de) | 2002-06-05 |
| DE60027579D1 (de) | 2006-06-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |