ATE324671T1 - Licht-emittierende diode mit verbesserter wärmezerstreuung - Google Patents

Licht-emittierende diode mit verbesserter wärmezerstreuung

Info

Publication number
ATE324671T1
ATE324671T1 AT00126394T AT00126394T ATE324671T1 AT E324671 T1 ATE324671 T1 AT E324671T1 AT 00126394 T AT00126394 T AT 00126394T AT 00126394 T AT00126394 T AT 00126394T AT E324671 T1 ATE324671 T1 AT E324671T1
Authority
AT
Austria
Prior art keywords
chip
connection
connecting pins
emitting diode
plate connection
Prior art date
Application number
AT00126394T
Other languages
English (en)
Inventor
Mu-Chin Yu
Original Assignee
Mu-Chin Yu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mu-Chin Yu filed Critical Mu-Chin Yu
Application granted granted Critical
Publication of ATE324671T1 publication Critical patent/ATE324671T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
AT00126394T 2000-12-04 2000-12-04 Licht-emittierende diode mit verbesserter wärmezerstreuung ATE324671T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00126394A EP1211735B1 (de) 2000-12-04 2000-12-04 Licht-emittierende Diode mit verbesserter Wärmezerstreuung

Publications (1)

Publication Number Publication Date
ATE324671T1 true ATE324671T1 (de) 2006-05-15

Family

ID=8170554

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00126394T ATE324671T1 (de) 2000-12-04 2000-12-04 Licht-emittierende diode mit verbesserter wärmezerstreuung

Country Status (3)

Country Link
EP (1) EP1211735B1 (de)
AT (1) ATE324671T1 (de)
DE (1) DE60027579D1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030058650A1 (en) * 2001-09-25 2003-03-27 Kelvin Shih Light emitting diode with integrated heat dissipater
JP5569558B2 (ja) * 2012-06-06 2014-08-13 第一精工株式会社 電気部品用ハウジング

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2315709A1 (de) * 1973-03-29 1974-10-10 Licentia Gmbh Strahlung abgebende halbleiteranordnung mit hoher strahlungsleistung
US4478588A (en) * 1978-03-06 1984-10-23 Amp Incorporated Light emitting diode assembly
JPH06204604A (ja) * 1993-01-06 1994-07-22 Sanyo Electric Co Ltd 半導体レーザー装置
JPH07335980A (ja) * 1994-06-07 1995-12-22 Fuji Electric Co Ltd 半導体レーザ装置
US5660461A (en) * 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
EP1004145B1 (de) * 1997-07-29 2005-06-01 Osram Opto Semiconductors GmbH Optoelektronisches bauelement
EP1089335A4 (de) * 1998-05-20 2002-02-06 Rohm Co Ltd Halbleitervorrichtung

Also Published As

Publication number Publication date
EP1211735B1 (de) 2006-04-26
EP1211735A1 (de) 2002-06-05
DE60027579D1 (de) 2006-06-01

Similar Documents

Publication Publication Date Title
US7935982B2 (en) Side view type LED package
KR950030323A (ko) 반도체 장치와 반도체 장치의 생산방법 및 반도체 모듈
JP2006093470A (ja) リードフレーム、発光装置、発光装置の製造方法
ATE444568T1 (de) Gehäuse für oberflächenmontierten lichtemissionschip hoher leistung
JP4674487B2 (ja) 表面実装型発光装置
WO2008043264A1 (en) Light-emitting component package, light-emitting component packaging apparatus, and light source device
KR200329900Y1 (ko) 점착형 발광 다이오드 리드 프레임
US9046252B2 (en) LED lamp
KR101374894B1 (ko) 양면 발광형 발광 다이오드 패키지
JP2008172187A (ja) 側面発光装置
TW200717840A (en) Light emitting diode package
US20050082965A1 (en) LED with good heat-dissipating capability
US6903382B2 (en) Light emitting diode mounting structure
DE60027579D1 (de) Licht-emittierende Diode mit verbesserter Wärmezerstreuung
KR101791149B1 (ko) Ｌｅｄ 조명 램프
JP3217354U (ja) 照明装置
KR100747642B1 (ko) 측면 발광형 ｌｅｄ 패키지
MY130241A (en) Improved light emtting diode
JP2009170642A (ja) 電気装置
US8581278B2 (en) Light-emitting diode packaging structure
JP2007116074A (ja) 発光ダイオード装置および照明装置
JP3181604U (ja) 発光ダイオード取付装置
JP3308078B2 (ja) 樹脂封止型半導体装置
JP2005251824A (ja) 発光ダイオード
KR20120016787A (ko) 발광 다이오드 패키지

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties