ATE322690T1 - Sonde und testfassungsanordnung - Google Patents

Sonde und testfassungsanordnung

Info

Publication number
ATE322690T1
ATE322690T1 AT01305018T AT01305018T ATE322690T1 AT E322690 T1 ATE322690 T1 AT E322690T1 AT 01305018 T AT01305018 T AT 01305018T AT 01305018 T AT01305018 T AT 01305018T AT E322690 T1 ATE322690 T1 AT E322690T1
Authority
AT
Austria
Prior art keywords
probes
probe
socket
densely packed
test socket
Prior art date
Application number
AT01305018T
Other languages
English (en)
Inventor
David W Henry
William E Thurston
Thimothy W Dowdle
Original Assignee
Interconnect Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interconnect Devices Inc filed Critical Interconnect Devices Inc
Application granted granted Critical
Publication of ATE322690T1 publication Critical patent/ATE322690T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
AT01305018T 2000-07-14 2001-06-08 Sonde und testfassungsanordnung ATE322690T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/616,208 US6424166B1 (en) 2000-07-14 2000-07-14 Probe and test socket assembly

Publications (1)

Publication Number Publication Date
ATE322690T1 true ATE322690T1 (de) 2006-04-15

Family

ID=24468460

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01305018T ATE322690T1 (de) 2000-07-14 2001-06-08 Sonde und testfassungsanordnung

Country Status (4)

Country Link
US (1) US6424166B1 (de)
EP (1) EP1172658B1 (de)
AT (1) ATE322690T1 (de)
DE (1) DE60118465T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6799976B1 (en) * 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US20050068054A1 (en) * 2000-05-23 2005-03-31 Sammy Mok Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
JP3443687B2 (ja) * 2001-02-19 2003-09-08 株式会社エンプラス 電気部品用ソケット
US6685492B2 (en) * 2001-12-27 2004-02-03 Rika Electronics International, Inc. Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition
JP3899075B2 (ja) * 2002-03-05 2007-03-28 リカ デンシ アメリカ， インコーポレイテッド 電子パッケージと試験機器をインターフェースするための装置
DE20316645U1 (de) * 2003-10-29 2005-03-10 Fan, Wei-Fang, Jwu Beei Modulare elastische Kontaktstiftgruppevorrichtung
CN2686135Y (zh) * 2003-11-20 2005-03-16 上海莫仕连接器有限公司 压接式导电端子
CN2682639Y (zh) * 2003-11-20 2005-03-02 上海莫仕连接器有限公司 压接式导电端子
US7154286B1 (en) * 2005-06-30 2006-12-26 Interconnect Devices, Inc. Dual tapered spring probe
SG131790A1 (en) * 2005-10-14 2007-05-28 Tan Yin Leong Probe for testing integrated circuit devices
US20070115010A1 (en) * 2005-11-22 2007-05-24 Mctigue Michael T Connection accessory for micro-probing
CN101315392A (zh) * 2007-05-31 2008-12-03 佛山普立华科技有限公司 探针定位装置
US8044673B1 (en) 2010-04-28 2011-10-25 Lajos Burgyan Method and apparatus for positioning and contacting singulated semiconductor dies
US8506307B2 (en) 2010-12-02 2013-08-13 Interconnect Devices, Inc. Electrical connector with embedded shell layer
JP6107234B2 (ja) * 2013-03-01 2017-04-05 山一電機株式会社 検査用プローブ、および、それを備えるｉｃソケット
CN108152539A (zh) * 2017-12-05 2018-06-12 深圳巴斯巴科技发展有限公司 一种用于电动汽车充电接口接触电阻检测的转接结构
CN113394580B (zh) * 2020-03-12 2023-05-16 富联精密电子(天津)有限公司 电子装置
WO2024110046A1 (de) * 2022-11-24 2024-05-30 Feinmetall Gmbh Federkontaktstift

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0245787A1 (de) * 1986-05-12 1987-11-19 Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung Federkontaktstift
US4885533B1 (en) 1988-09-09 1998-11-03 Qa Technology Co Inc Electrical circuit test probe having an elongate cylindrical retaining and sliding bearing region
US5850147A (en) 1992-03-10 1998-12-15 Virginia Panel Corporation Coaxial double-headed spring contact probe assembly and coaxial surface contact for engagement therewith
JPH0627139A (ja) * 1992-04-13 1994-02-04 Towa Kogyo Kk コンタクトプローブおよびこれを用いた電気コネクタ
JP2532331B2 (ja) * 1992-11-09 1996-09-11 日本発条株式会社 導電性接触子
JP2648120B2 (ja) * 1995-02-08 1997-08-27 山一電機株式会社 表面接触形接続器
DE19507127A1 (de) * 1995-03-01 1996-09-12 Test Plus Electronic Gmbh Adaptersystem für Baugruppen-Platinen, zu verwenden in einer Prüfeinrichtung
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device
US5641315A (en) 1995-11-16 1997-06-24 Everett Charles Technologies, Inc. Telescoping spring probe
US6204680B1 (en) * 1997-04-15 2001-03-20 Delaware Capital Formation, Inc. Test socket
US6208155B1 (en) * 1998-01-27 2001-03-27 Cerprobe Corporation Probe tip and method for making electrical contact with a solder ball contact of an integrated circuit device

Also Published As

Publication number Publication date
DE60118465T2 (de) 2006-11-16
DE60118465D1 (de) 2006-05-18
EP1172658B1 (de) 2006-04-05
US6424166B1 (en) 2002-07-23
EP1172658A2 (de) 2002-01-16
EP1172658A3 (de) 2003-09-03

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Legal Events

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