ATE312211T1 - Verfahren zum aufbringen einer beschichtung auf einem metallischen gegenstand - Google Patents

Verfahren zum aufbringen einer beschichtung auf einem metallischen gegenstand

Info

Publication number
ATE312211T1
ATE312211T1 AT99307657T AT99307657T ATE312211T1 AT E312211 T1 ATE312211 T1 AT E312211T1 AT 99307657 T AT99307657 T AT 99307657T AT 99307657 T AT99307657 T AT 99307657T AT E312211 T1 ATE312211 T1 AT E312211T1
Authority
AT
Austria
Prior art keywords
coating
metallic article
applying
plasma
hollow cathode
Prior art date
Application number
AT99307657T
Other languages
English (en)
Inventor
Rickerby David Stafford
Original Assignee
Rolls Royce Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rolls Royce Plc filed Critical Rolls Royce Plc
Application granted granted Critical
Publication of ATE312211T1 publication Critical patent/ATE312211T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5826—Treatment with charged particles
    • C23C14/5833—Ion beam bombardment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Turbine Rotor Nozzle Sealing (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
AT99307657T 1998-10-09 1999-09-28 Verfahren zum aufbringen einer beschichtung auf einem metallischen gegenstand ATE312211T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9821903.3A GB9821903D0 (en) 1998-10-09 1998-10-09 A method of applying a coating to a metallic article and an apparatus for applying a coating to a metallic article

Publications (1)

Publication Number Publication Date
ATE312211T1 true ATE312211T1 (de) 2005-12-15

Family

ID=10840171

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99307657T ATE312211T1 (de) 1998-10-09 1999-09-28 Verfahren zum aufbringen einer beschichtung auf einem metallischen gegenstand

Country Status (5)

Country Link
US (1) US6176982B1 (de)
EP (1) EP0992606B1 (de)
AT (1) ATE312211T1 (de)
DE (1) DE69928739T2 (de)
GB (1) GB9821903D0 (de)

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US7105810B2 (en) * 2001-12-21 2006-09-12 Cornell Research Foundation, Inc. Electrospray emitter for microfluidic channel
DE10213049A1 (de) * 2002-03-22 2003-10-02 Dieter Wurczinger Drehbare Rohrkatode
GB0208261D0 (en) * 2002-04-10 2002-05-22 Dow Corning An atmospheric pressure plasma assembly
TW200409669A (en) * 2002-04-10 2004-06-16 Dow Corning Ireland Ltd Protective coating composition
DE10256257A1 (de) * 2002-12-03 2004-06-24 Robert Bosch Gmbh Vorrichtung und Verfahren zum Beschichten eines Substrates und Beschichtung auf einem Substrat
DE10355036A1 (de) * 2003-11-25 2005-06-23 Mtu Aero Engines Gmbh Verfahren zur Herstellung einer Schutzschicht, Schutzschicht und Bauteil mit einer solchen Schutzschicht
TWI466595B (zh) * 2005-08-02 2014-12-21 Pureron Japan Co Ltd A plasma generating device and a film forming method using the same
KR20090068236A (ko) 2006-09-08 2009-06-25 메사추세츠 인스티튜트 오브 테크놀로지 자동화된 층상 분무 기법
US7879203B2 (en) * 2006-12-11 2011-02-01 General Electric Company Method and apparatus for cathodic arc ion plasma deposition
US20080160213A1 (en) * 2006-12-29 2008-07-03 Michael Patrick Maly Method for restoring or regenerating an article
US20080160208A1 (en) * 2006-12-29 2008-07-03 Michael Patrick Maly System and method for restoring or regenerating an article
US7899309B2 (en) * 2007-02-14 2011-03-01 Battelle Memorial Institute Apparatus for vaporization of liquid
US20080226938A1 (en) 2007-03-16 2008-09-18 Calvary Design Team, Inc. Wear resistant ceramic coated aluminum alloy article and method for making same
US8968528B2 (en) * 2008-04-14 2015-03-03 United Technologies Corporation Platinum-modified cathodic arc coating
US9506140B2 (en) 2013-03-15 2016-11-29 United Technologies Corporation Spallation-resistant thermal barrier coating
DE102015121518A1 (de) * 2015-12-10 2017-06-14 Technische Universität Clausthal Verfahren und Anlage zur Herstellung von Beschichtungen auf Substraten sowie ein beschichtetes drahtförmiges Substrat
US10202855B2 (en) 2016-06-02 2019-02-12 General Electric Company Airfoil with improved coating system
CN109855939A (zh) * 2019-04-03 2019-06-07 黑龙江科技大学 一种热障涂层结构模拟脱粘缺陷界面热阻等效试件及其制备方法
DE102020211265A1 (de) 2020-09-08 2022-03-10 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur metallischen oder keramischen Beschichtung

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DE2336825B2 (de) * 1973-07-19 1976-08-05 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zum tempern eines aufdampfschichten tragenden substrates
AU532935B2 (en) * 1978-11-02 1983-10-20 Ford Motor Co. Vapour deposition of metals
US4521286A (en) 1983-03-09 1985-06-04 Unisearch Limited Hollow cathode sputter etcher
GB8512455D0 (en) * 1985-05-16 1985-06-19 Atomic Energy Authority Uk Coating apparatus
GB2182350B (en) * 1985-07-01 1989-04-26 Atomic Energy Authority Uk Coating improvements
US4637853A (en) 1985-07-29 1987-01-20 International Business Machines Corporation Hollow cathode enhanced plasma for high rate reactive ion etching and deposition
US4915805A (en) 1988-11-21 1990-04-10 At&T Bell Laboratories Hollow cathode type magnetron apparatus construction
US5317006A (en) * 1989-06-15 1994-05-31 Microelectronics And Computer Technology Corporation Cylindrical magnetron sputtering system
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GB2261226B (en) * 1991-11-08 1994-10-26 Univ Hull Deposition of non-conductive material
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DE4235953C2 (de) 1992-10-23 1998-07-02 Fraunhofer Ges Forschung Sputterquelle mit einer linearen Hohlkathode zum reaktiven Beschichten von Substraten
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US5716505A (en) 1996-02-23 1998-02-10 Balzers Prozess-Systems Gmbh Apparatus for coating substrates by cathode sputtering with a hollow target
DE19635669C1 (de) 1996-09-03 1997-07-24 Fraunhofer Ges Forschung Verfahren und Vorrichtung zur Beschichtung von Substraten mittels Gasflußsputtern

Also Published As

Publication number Publication date
DE69928739D1 (de) 2006-01-12
DE69928739T2 (de) 2006-06-29
EP0992606B1 (de) 2005-12-07
US6176982B1 (en) 2001-01-23
EP0992606A3 (de) 2000-06-21
GB9821903D0 (en) 1998-12-02
EP0992606A2 (de) 2000-04-12

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