ATE293513T1 - LEAD-FREE SOFT SOLDER - Google Patents

LEAD-FREE SOFT SOLDER

Info

Publication number
ATE293513T1
ATE293513T1 AT00976153T AT00976153T ATE293513T1 AT E293513 T1 ATE293513 T1 AT E293513T1 AT 00976153 T AT00976153 T AT 00976153T AT 00976153 T AT00976153 T AT 00976153T AT E293513 T1 ATE293513 T1 AT E293513T1
Authority
AT
Austria
Prior art keywords
lead
soft solder
free soft
free
bismuth
Prior art date
Application number
AT00976153T
Other languages
German (de)
Inventor
Jennie S Hwang
Zhenfeng Guo
Original Assignee
Singapore Asahi Chemical & Solder Ind Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singapore Asahi Chemical & Solder Ind Pte Ltd filed Critical Singapore Asahi Chemical & Solder Ind Pte Ltd
Application granted granted Critical
Publication of ATE293513T1 publication Critical patent/ATE293513T1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Abstract

Disclosed is a high strength, high fatigue resistance, and high wetting lead-free solder alloy comprising effective amounts of tin, copper silver, bismuth, indium, and antimony and having a melting temperature between 175-215 DEG C.
AT00976153T 2000-11-16 2000-11-16 LEAD-FREE SOFT SOLDER ATE293513T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/GB2000/004365 WO2002040213A1 (en) 2000-11-16 2000-11-16 Lead-free solders

Publications (1)

Publication Number Publication Date
ATE293513T1 true ATE293513T1 (en) 2005-05-15

Family

ID=9886311

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00976153T ATE293513T1 (en) 2000-11-16 2000-11-16 LEAD-FREE SOFT SOLDER

Country Status (14)

Country Link
EP (1) EP1333957B1 (en)
AT (1) ATE293513T1 (en)
AU (1) AU2001214037A1 (en)
CY (1) CY1105145T1 (en)
CZ (1) CZ297089B6 (en)
DE (1) DE60019651T2 (en)
DK (1) DK1333957T3 (en)
ES (1) ES2241671T3 (en)
HU (1) HU228577B1 (en)
NO (1) NO333677B1 (en)
PL (1) PL195528B1 (en)
PT (1) PT1333957E (en)
RU (1) RU2254971C2 (en)
WO (1) WO2002040213A1 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8122833B2 (en) 2005-10-04 2012-02-28 Alliant Techsystems Inc. Reactive material enhanced projectiles and related methods
USRE45899E1 (en) 2000-02-23 2016-02-23 Orbital Atk, Inc. Low temperature, extrudable, high density reactive materials
US7977420B2 (en) 2000-02-23 2011-07-12 Alliant Techsystems Inc. Reactive material compositions, shot shells including reactive materials, and a method of producing same
US20050199323A1 (en) 2004-03-15 2005-09-15 Nielson Daniel B. Reactive material enhanced munition compositions and projectiles containing same
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
EP1465468B1 (en) * 2003-03-31 2007-11-14 SANYO ELECTRIC Co., Ltd. Metal mask and method of printing lead-free solder paste using same
JP4979944B2 (en) * 2003-08-26 2012-07-18 株式会社トクヤマ Element bonding substrate, element bonding substrate and manufacturing method thereof
FR2867469A1 (en) * 2004-03-15 2005-09-16 Alliant Techsystems Inc Reactive composition, useful in military and industrial explosives, comprises a metallic material defining a continuous phase and having an energetic material, which comprises oxidant and/or explosive of class 1.1
CZ300575B6 (en) * 2005-01-04 2009-06-17 Jeník@Jan Lead-free solder
CN100453244C (en) * 2005-12-16 2009-01-21 浙江亚通焊材有限公司 Lead les tin solder
CN101357421B (en) * 2005-12-16 2010-12-29 浙江亚通焊材有限公司 Lead-free welding material
WO2009011392A1 (en) * 2007-07-18 2009-01-22 Senju Metal Industry Co., Ltd. In-containing lead-free solder for on-vehicle electronic circuit
US7821130B2 (en) * 2008-03-31 2010-10-26 Infineon Technologies Ag Module including a rough solder joint
EP2422918B1 (en) * 2009-04-20 2017-12-06 Panasonic Intellectual Property Management Co., Ltd. Soldering material and electronic component assembly
JP2014527466A (en) * 2011-08-02 2014-10-16 アルファ・メタルズ・インコーポレイテッドＡｌｐｈａ Ｍｅｔａｌｓ，Ｉｎｃ． Solder composition
JP2013252548A (en) * 2012-06-08 2013-12-19 Nihon Almit Co Ltd Solder paste for joining micro component
CN103042315B (en) * 2013-01-22 2015-05-27 马莒生 Heat-resistant and moisture-resistant low-melting-point lead-free solder alloy
JP2015077601A (en) * 2013-04-02 2015-04-23 千住金属工業株式会社 Lead-free solder alloy
EP3138658B1 (en) * 2014-04-30 2020-11-04 Nihon Superior Co., Ltd. Lead-free solder alloy
MY162879A (en) * 2014-06-24 2017-07-20 Harima Chemicals Inc Solder alloy, solder paste, and electronic circuit board
JP6730999B2 (en) * 2015-05-05 2020-07-29 インディウム コーポレーション Highly reliable lead-free solder alloy for electronic applications in harsh environments
WO2016185674A1 (en) * 2015-05-19 2016-11-24 パナソニックＩｐマネジメント株式会社 Solder alloy and package structure using same
JP6135885B2 (en) * 2015-05-19 2017-05-31 パナソニックＩｐマネジメント株式会社 Solder alloy and mounting structure using the same
JP6745453B2 (en) * 2016-05-18 2020-08-26 パナソニックＩｐマネジメント株式会社 Solder alloy and mounting structure using the same
JP6230737B1 (en) * 2017-03-10 2017-11-15 株式会社タムラ製作所 Lead-free solder alloy, solder paste and electronic circuit board
JP6397079B1 (en) * 2017-04-07 2018-09-26 株式会社ケーヒン Solder material
CN109894768B (en) * 2019-03-29 2021-06-18 东莞市千岛金属锡品有限公司 Preparation method of low-temperature lead-free alloy solder

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
KR980006783A (en) * 1996-05-13 1998-03-30 이. 힐러 윌리엄 Low cost phase locked motor control method and structure
JP3736819B2 (en) * 1997-01-17 2006-01-18 株式会社豊田中央研究所 Lead-free solder alloy
WO1999004048A1 (en) * 1997-07-17 1999-01-28 Litton Systems, Inc. Tin-bismuth based lead-free solders
US5938862A (en) * 1998-04-03 1999-08-17 Delco Electronics Corporation Fatigue-resistant lead-free alloy
JP2000288772A (en) * 1999-02-02 2000-10-17 Nippon Genma:Kk Lead-free solder

Also Published As

Publication number Publication date
NO333677B1 (en) 2013-08-05
NO20032185D0 (en) 2003-05-14
PL195528B1 (en) 2007-09-28
EP1333957B1 (en) 2005-04-20
ES2241671T3 (en) 2005-11-01
PL361336A1 (en) 2004-10-04
WO2002040213A1 (en) 2002-05-23
PT1333957E (en) 2005-09-30
NO20032185L (en) 2003-05-14
DE60019651D1 (en) 2005-05-25
CZ297089B6 (en) 2006-09-13
DK1333957T3 (en) 2005-06-20
DE60019651T2 (en) 2005-09-22
AU2001214037A1 (en) 2002-05-27
HUP0301858A3 (en) 2005-05-30
RU2003114304A (en) 2005-01-20
CZ20031348A3 (en) 2004-04-14
HU228577B1 (en) 2013-04-29
CY1105145T1 (en) 2009-11-04
EP1333957A1 (en) 2003-08-13
HUP0301858A2 (en) 2003-08-28
RU2254971C2 (en) 2005-06-27

Similar Documents

Publication Publication Date Title
ATE293513T1 (en) LEAD-FREE SOFT SOLDER
TW528638B (en) Lead-free solders
Darveaux et al. Constitutive relations for tin-based-solder joints
MY116246A (en) Lead-free solder and soldered article
DE69418533D1 (en) Lead-free, tin-based ternary soft solder alloy with bismuth and indium
EP1880032A4 (en) Tin alloy solder compositions
ATE555871T1 (en) LEAD-FREE SOLDER BALL
WO2002076669A8 (en) Brazing filler metal
WO2007001598A3 (en) Lead-free semiconductor package
WO2003026828A3 (en) Improved compositions, methods and devices for high temperature lead-free solder
DE60319932D1 (en) Lead-free solder ball
JP2000079494A (en) Solder
WO2006023914A3 (en) Thermal fatigue resistant tin-lead-silver solder
MXPA05006299A (en) Brazing sheet product and method of its manufacture.
EP1039527A3 (en) Semiconductor device mounting structure
Bastow 5 solder families and how they work: low melting-temperature alloys are vital to successful electronics assembly
Weise et al. Application of a cadmium-free silver alloy as a low melting hard solder
Fan et al. Thermodynamic and Kinetic Effects on Microstructure Evolution in Hybrid Low Temperature Solder/High-Sn Solder Joints
TH914B (en) Alloy elements for lead-free soldering and welding
AU6333096A (en) Lead-free, high tin ternary solder alloy of tin, silver, and bismuth
HUP0104903A2 (en) Lead-free solder alloy
TH62361A (en) Lead-free solder
Volcker et al. Application of a silver alloy as a cadmium-free hard solder
Weise et al. Application of cadmium-free silver alloys as hard solder
MY116826A (en) Solder alloy.

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1333957

Country of ref document: EP