ATE285484T1 - Verfahren und vorrichtung zum beschichten eines substrats - Google Patents

Verfahren und vorrichtung zum beschichten eines substrats

Info

Publication number
ATE285484T1
ATE285484T1 AT96203211T AT96203211T ATE285484T1 AT E285484 T1 ATE285484 T1 AT E285484T1 AT 96203211 T AT96203211 T AT 96203211T AT 96203211 T AT96203211 T AT 96203211T AT E285484 T1 ATE285484 T1 AT E285484T1
Authority
AT
Austria
Prior art keywords
target
substrate
coating
surface layer
chamber
Prior art date
Application number
AT96203211T
Other languages
English (en)
Inventor
Brande Pierre Vanden
Stephane Lucas
Alain Weymeersch
Original Assignee
Cockerill Rech & Dev
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cockerill Rech & Dev filed Critical Cockerill Rech & Dev
Application granted granted Critical
Publication of ATE285484T1 publication Critical patent/ATE285484T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
AT96203211T 1995-12-20 1996-11-19 Verfahren und vorrichtung zum beschichten eines substrats ATE285484T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE9501052A BE1009838A3 (fr) 1995-12-20 1995-12-20 Procede et dispositif pour la formation d'un revetement sur un substrat.

Publications (1)

Publication Number Publication Date
ATE285484T1 true ATE285484T1 (de) 2005-01-15

Family

ID=3889362

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96203211T ATE285484T1 (de) 1995-12-20 1996-11-19 Verfahren und vorrichtung zum beschichten eines substrats

Country Status (7)

Country Link
EP (1) EP0780486B1 (de)
AT (1) ATE285484T1 (de)
BE (1) BE1009838A3 (de)
DE (1) DE69634071T2 (de)
DK (1) DK0780486T3 (de)
ES (1) ES2235178T3 (de)
PT (1) PT780486E (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6432281B2 (en) 1995-12-20 2002-08-13 Recherche Et Developpement Due Groupe Cockerill Sambre Process for formation of a coating on a substrate
ATE242545T1 (de) * 1997-10-08 2003-06-15 Cockerill Rech & Dev Vorrichtung zur kondensationserzeugung eines schichtes auf einem substrat
EP1182272A1 (de) * 2000-08-23 2002-02-27 Cold Plasma Applications C.P.A. Verfahren und Vorrichtung zur kontinuierlichen Kaltplasma-Abscheidung von Metallschichten
EP1947210A1 (de) 2007-01-16 2008-07-23 ARCELOR France Verfahren zur Beschichtung eines Substrats, Anlage zur Umsetzung des Verfahrens und Vorrichtung zur Metallzuführung zu einer solchen Anlage
KR102214385B1 (ko) 2014-04-04 2021-02-09 아르셀러미탈 다층 기판 및 제조 방법
US11459651B2 (en) 2017-02-07 2022-10-04 Applied Materials, Inc. Paste method to reduce defects in dielectric sputtering

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3799862A (en) * 1971-11-19 1974-03-26 United Aircraft Corp Apparatus for sputtering
DE2528108B2 (de) * 1975-06-24 1977-11-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zum aufbringen von elektrisch leitenden schichten auf eine unterlage
JPH0219466A (ja) * 1988-07-07 1990-01-23 Matsushita Electric Ind Co Ltd 繊維・フィルム連続蒸着装置
US5211824A (en) * 1991-10-31 1993-05-18 Siemens Solar Industries L.P. Method and apparatus for sputtering of a liquid
US5507931A (en) 1993-12-30 1996-04-16 Deposition Technologies, Inc. Sputter deposition process
BE1008303A3 (fr) * 1994-06-02 1996-04-02 Cockerill Rech & Dev Procede et dispositif pour la formation d'un revetement sur un substrat par pulverisation cathodique.

Also Published As

Publication number Publication date
PT780486E (pt) 2005-04-29
DK0780486T3 (da) 2005-04-25
ES2235178T3 (es) 2005-07-01
DE69634071T2 (de) 2005-12-08
DE69634071D1 (de) 2005-01-27
EP0780486A1 (de) 1997-06-25
BE1009838A3 (fr) 1997-10-07
EP0780486B1 (de) 2004-12-22

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