PT780486E - Processo e dispostivo para a formacao de um revestimento sobre um substrato - Google Patents

Processo e dispostivo para a formacao de um revestimento sobre um substrato

Info

Publication number
PT780486E
PT780486E PT96203211T PT96203211T PT780486E PT 780486 E PT780486 E PT 780486E PT 96203211 T PT96203211 T PT 96203211T PT 96203211 T PT96203211 T PT 96203211T PT 780486 E PT780486 E PT 780486E
Authority
PT
Portugal
Prior art keywords
substrate
target
coating
surface layer
chamber
Prior art date
Application number
PT96203211T
Other languages
English (en)
Inventor
Stephane Lucas
Alain Weymeersch
Pierre Vanden Brande
Original Assignee
Cockerill Rech & Dev
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cockerill Rech & Dev filed Critical Cockerill Rech & Dev
Publication of PT780486E publication Critical patent/PT780486E/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
PT96203211T 1995-12-20 1996-11-19 Processo e dispostivo para a formacao de um revestimento sobre um substrato PT780486E (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE9501052A BE1009838A3 (fr) 1995-12-20 1995-12-20 Procede et dispositif pour la formation d'un revetement sur un substrat.

Publications (1)

Publication Number Publication Date
PT780486E true PT780486E (pt) 2005-04-29

Family

ID=3889362

Family Applications (1)

Application Number Title Priority Date Filing Date
PT96203211T PT780486E (pt) 1995-12-20 1996-11-19 Processo e dispostivo para a formacao de um revestimento sobre um substrato

Country Status (7)

Country Link
EP (1) EP0780486B1 (pt)
AT (1) ATE285484T1 (pt)
BE (1) BE1009838A3 (pt)
DE (1) DE69634071T2 (pt)
DK (1) DK0780486T3 (pt)
ES (1) ES2235178T3 (pt)
PT (1) PT780486E (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6432281B2 (en) 1995-12-20 2002-08-13 Recherche Et Developpement Due Groupe Cockerill Sambre Process for formation of a coating on a substrate
DE69722619T2 (de) * 1997-10-08 2004-05-13 Recherche et Développement du Groupe Cockerill Sambre, en abrégé: RD-CS Vorrichtung zur Kondensationserzeugung eines Schichtes auf einem Substrat
EP1182272A1 (fr) * 2000-08-23 2002-02-27 Cold Plasma Applications C.P.A. Procédé et dispositif permettant le dépôt de couches métalliques en continu par plasma froid
EP1947210A1 (fr) 2007-01-16 2008-07-23 ARCELOR France Procede de revetement d'un substrat, installation de mise en oeuvre du procede et dispositif d'alimentation en metal d'une telle installation
BR112016022605B1 (pt) 2014-04-04 2022-05-24 Arcelormittal Substrato dotado de uma pluralidade de camadas e método para a fabricação de um substrato
US11459651B2 (en) * 2017-02-07 2022-10-04 Applied Materials, Inc. Paste method to reduce defects in dielectric sputtering

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3799862A (en) * 1971-11-19 1974-03-26 United Aircraft Corp Apparatus for sputtering
DE2528108B2 (de) * 1975-06-24 1977-11-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zum aufbringen von elektrisch leitenden schichten auf eine unterlage
JPH0219466A (ja) * 1988-07-07 1990-01-23 Matsushita Electric Ind Co Ltd 繊維・フィルム連続蒸着装置
US5211824A (en) * 1991-10-31 1993-05-18 Siemens Solar Industries L.P. Method and apparatus for sputtering of a liquid
US5507931A (en) 1993-12-30 1996-04-16 Deposition Technologies, Inc. Sputter deposition process
BE1008303A3 (fr) * 1994-06-02 1996-04-02 Cockerill Rech & Dev Procede et dispositif pour la formation d'un revetement sur un substrat par pulverisation cathodique.

Also Published As

Publication number Publication date
DE69634071D1 (de) 2005-01-27
EP0780486A1 (fr) 1997-06-25
ES2235178T3 (es) 2005-07-01
DE69634071T2 (de) 2005-12-08
EP0780486B1 (fr) 2004-12-22
DK0780486T3 (da) 2005-04-25
BE1009838A3 (fr) 1997-10-07
ATE285484T1 (de) 2005-01-15

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