ATE274608T1 - Säureätzlösung und verfahren zur behandlung von kupfer - Google Patents

Säureätzlösung und verfahren zur behandlung von kupfer

Info

Publication number
ATE274608T1
ATE274608T1 AT01965078T AT01965078T ATE274608T1 AT E274608 T1 ATE274608 T1 AT E274608T1 AT 01965078 T AT01965078 T AT 01965078T AT 01965078 T AT01965078 T AT 01965078T AT E274608 T1 ATE274608 T1 AT E274608T1
Authority
AT
Austria
Prior art keywords
sup
etching solution
treating copper
acid etching
copper surfaces
Prior art date
Application number
AT01965078T
Other languages
English (en)
Inventor
Uwe Hauf
Harry Fuerhaupter
Alexey Stiop
Udo Grieser
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2000134022 external-priority patent/DE10034022C2/de
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE274608T1 publication Critical patent/ATE274608T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
AT01965078T 2000-07-07 2001-07-06 Säureätzlösung und verfahren zur behandlung von kupfer ATE274608T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2000134022 DE10034022C2 (de) 2000-07-07 2000-07-07 Saure Behandlungsflüssigkeit und deren Verwendung sowie Verfahren zum Behandeln von Kupferoberflächen
PCT/EP2001/007788 WO2002004706A1 (en) 2000-07-07 2001-07-06 Acidic treatment liquid and method of treating copper surfaces

Publications (1)

Publication Number Publication Date
ATE274608T1 true ATE274608T1 (de) 2004-09-15

Family

ID=7648768

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01965078T ATE274608T1 (de) 2000-07-07 2001-07-06 Säureätzlösung und verfahren zur behandlung von kupfer

Country Status (14)

Country Link
US (1) US7153449B2 (de)
EP (1) EP1299575B1 (de)
JP (1) JP2004502875A (de)
KR (1) KR100813444B1 (de)
CN (1) CN1285765C (de)
AT (1) ATE274608T1 (de)
AU (1) AU2001285807A1 (de)
BR (1) BR0112254B1 (de)
CA (1) CA2407532A1 (de)
DE (1) DE10066028C2 (de)
HK (1) HK1051712A1 (de)
MX (1) MXPA02012902A (de)
TW (1) TWI272319B (de)
WO (1) WO2002004706A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050067378A1 (en) * 2003-09-30 2005-03-31 Harry Fuerhaupter Method for micro-roughening treatment of copper and mixed-metal circuitry
JP4886333B2 (ja) * 2005-03-30 2012-02-29 東レ株式会社 給電ローラならびにめっき被膜付きフィルムの製造装置および方法
JP4648122B2 (ja) * 2005-07-27 2011-03-09 富士通株式会社 配線基板及びその製造方法
US7393461B2 (en) * 2005-08-23 2008-07-01 Kesheng Feng Microetching solution
JP2007129193A (ja) * 2005-10-06 2007-05-24 Mec Kk プリント配線板の製造方法
DE102006041292A1 (de) * 2006-09-01 2008-03-06 Henkel Kgaa Wasserstoffperoxid-Aktivierung mit N-Heterocyclen
JP4843538B2 (ja) * 2007-03-22 2011-12-21 富士通株式会社 回路基板及びその製造方法
EP2099268A1 (de) 2008-03-07 2009-09-09 Atotech Deutschland Gmbh Nichtätzende Klebstoffzusammensetzung, Verfahren zur Herstellung eines Arbeitsteils und Verfahren zum Formen von Kupferstrukturen in einem Schaltträgersubstrat
US8518281B2 (en) * 2008-06-03 2013-08-27 Kesheng Feng Acid-resistance promoting composition
US8088246B2 (en) * 2009-01-08 2012-01-03 Cordani Jr John L Process for improving the adhesion of polymeric materials to metal surfaces
EP2729595B1 (de) 2011-07-07 2017-02-01 ATOTECH Deutschland GmbH Verfahren zur bereitstellung von resisthaftung auf einer kupfer- oder kupferlegierungsoberfläche
WO2014087693A1 (ja) * 2012-12-03 2014-06-12 メック株式会社 エッチング液、補給液及び銅配線の形成方法
KR102628632B1 (ko) 2015-06-04 2024-01-23 카티바, 인크. 금속 표면 상에서 에치 레지스트 패턴의 제조 방법
KR20240014578A (ko) * 2015-08-13 2024-02-01 카티바, 인크. 금속 표면 상에 에치 레지스트 패턴을 형성하는 방법
US10398034B2 (en) 2016-12-12 2019-08-27 Kateeva, Inc. Methods of etching conductive features, and related devices and systems
US11873564B2 (en) 2018-10-02 2024-01-16 Hutchinson Technology Incorporated Etch chemistry for metallic materials
EP3922755A1 (de) 2020-06-12 2021-12-15 ATOTECH Deutschland GmbH Wässrige basische ätzzusammensetzung zur behandlung von oberflächen von metallsubstraten
EP4279634A1 (de) 2022-05-17 2023-11-22 Atotech Deutschland GmbH & Co. KG Verfahren zum nanoätzen von kupfer- und kupferlegierungsoberflächen
CN115141629B (zh) * 2022-06-15 2023-06-02 湖北兴福电子材料股份有限公司 TiN去除液
CN116120936A (zh) * 2022-10-27 2023-05-16 上海天承化学有限公司 一种蚀刻药水及其制备方法和应用

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JPS5221460B1 (de) * 1971-04-26 1977-06-10
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
DE3623504A1 (de) * 1986-07-09 1988-01-21 Schering Ag Kupferaetzloesungen
EP0342669B1 (de) 1988-05-20 1995-08-23 Mitsubishi Gas Chemical Company, Inc. Verfahren zur Herstellung eines mit einer dünnen Kupferfolie kaschierten Substrats für Schaltungsplatten
GB9425090D0 (en) 1994-12-12 1995-02-08 Alpha Metals Ltd Copper coating
JP2923524B2 (ja) 1995-08-01 1999-07-26 メック株式会社 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法
JP3645955B2 (ja) * 1995-12-19 2005-05-11 ディップソール株式会社 錫−銀合金酸性めっき浴
TW374802B (en) 1996-07-29 1999-11-21 Ebara Densan Ltd Etching composition, method for roughening copper surface and method for producing printed wiring board
JPH10209604A (ja) * 1997-01-17 1998-08-07 Hitachi Ltd プリント配線基板の製造方法並びにそれに用いる粗化液及び粗化液の調製方法
US5958147A (en) * 1997-05-05 1999-09-28 Akzo Nobel N.V. Method of treating a metal
US6020029A (en) * 1997-06-12 2000-02-01 Macdermid, Incorporated Process for treating metal surfaces
JPH1129883A (ja) 1997-07-08 1999-02-02 Mec Kk 銅および銅合金のマイクロエッチング剤
JP3909920B2 (ja) * 1997-07-24 2007-04-25 メック株式会社 銅および銅合金の表面処理法
US6261466B1 (en) * 1997-12-11 2001-07-17 Shipley Company, L.L.C. Composition for circuit board manufacture
US6284309B1 (en) * 1997-12-19 2001-09-04 Atotech Deutschland Gmbh Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
DE19830037C2 (de) 1998-02-03 2001-08-16 Atotech Deutschland Gmbh Verfahren zum Vorbehandeln von Kupferoberflächen
TW460622B (en) * 1998-02-03 2001-10-21 Atotech Deutschland Gmbh Solution and process to pretreat copper surfaces
JP2000064067A (ja) * 1998-06-09 2000-02-29 Ebara Densan Ltd エッチング液および銅表面の粗化処理方法
JP3871013B2 (ja) * 1998-11-05 2007-01-24 上村工業株式会社 錫−銅合金電気めっき浴及びそれを使用するめっき方法
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US6506314B1 (en) * 2000-07-27 2003-01-14 Atotech Deutschland Gmbh Adhesion of polymeric materials to metal surfaces

Also Published As

Publication number Publication date
TWI272319B (en) 2007-02-01
CA2407532A1 (en) 2002-01-17
JP2004502875A (ja) 2004-01-29
BR0112254B1 (pt) 2012-03-20
DE10066028A1 (de) 2002-03-28
DE10066028C2 (de) 2003-04-24
US20030164466A1 (en) 2003-09-04
KR20030022119A (ko) 2003-03-15
US7153449B2 (en) 2006-12-26
CN1285765C (zh) 2006-11-22
EP1299575A2 (de) 2003-04-09
HK1051712A1 (en) 2003-08-15
WO2002004706A9 (en) 2002-09-19
KR100813444B1 (ko) 2008-03-13
CN1440466A (zh) 2003-09-03
EP1299575B1 (de) 2004-08-25
AU2001285807A1 (en) 2002-01-21
WO2002004706A1 (en) 2002-01-17
MXPA02012902A (es) 2003-05-14
BR0112254A (pt) 2003-06-24

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