ATE228264T1 - Feuchtigkeitsbeständige elektrisch leitfähige zemente und methode zur herstellung und anwendung derselben - Google Patents

Feuchtigkeitsbeständige elektrisch leitfähige zemente und methode zur herstellung und anwendung derselben

Info

Publication number
ATE228264T1
ATE228264T1 AT90121829T AT90121829T ATE228264T1 AT E228264 T1 ATE228264 T1 AT E228264T1 AT 90121829 T AT90121829 T AT 90121829T AT 90121829 T AT90121829 T AT 90121829T AT E228264 T1 ATE228264 T1 AT E228264T1
Authority
AT
Austria
Prior art keywords
particles
electrically conductive
carrier
moisture resistant
compaction
Prior art date
Application number
AT90121829T
Other languages
English (en)
Inventor
David Durand
David P Vieau
Tai Shing Wei
Ang-Ling Chu
Original Assignee
Poly Flex Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/436,199 external-priority patent/US5180523A/en
Priority claimed from US07/533,682 external-priority patent/US5183593A/en
Application filed by Poly Flex Circuits Inc filed Critical Poly Flex Circuits Inc
Application granted granted Critical
Publication of ATE228264T1 publication Critical patent/ATE228264T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0125—Shrinkable, e.g. heat-shrinkable polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Non-Insulated Conductors (AREA)
AT90121829T 1989-11-14 1990-11-14 Feuchtigkeitsbeständige elektrisch leitfähige zemente und methode zur herstellung und anwendung derselben ATE228264T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/436,199 US5180523A (en) 1989-11-14 1989-11-14 Electrically conductive cement containing agglomerate, flake and powder metal fillers
US07/533,682 US5183593A (en) 1989-11-14 1990-06-04 Electrically conductive cement
US60755490A 1990-11-01 1990-11-01

Publications (1)

Publication Number Publication Date
ATE228264T1 true ATE228264T1 (de) 2002-12-15

Family

ID=27411905

Family Applications (2)

Application Number Title Priority Date Filing Date
AT90121829T ATE228264T1 (de) 1989-11-14 1990-11-14 Feuchtigkeitsbeständige elektrisch leitfähige zemente und methode zur herstellung und anwendung derselben
AT02012317T ATE355594T1 (de) 1989-11-14 1990-11-14 Feuchtigkeitsbeständige elektrisch leitfähige zemente und methode zur herstellung und anwendung derselben

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT02012317T ATE355594T1 (de) 1989-11-14 1990-11-14 Feuchtigkeitsbeständige elektrisch leitfähige zemente und methode zur herstellung und anwendung derselben

Country Status (7)

Country Link
EP (2) EP0428165B1 (de)
AT (2) ATE228264T1 (de)
AU (1) AU7048091A (de)
CA (1) CA2068657C (de)
DE (3) DE69034236T2 (de)
GB (1) GB2239244B (de)
WO (1) WO1991007759A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07123179B2 (ja) * 1990-10-05 1995-12-25 信越ポリマー株式会社 異方導電接着剤による回路基板の接続構造
DE4122450A1 (de) * 1991-06-12 1992-12-17 Beiersdorf Ag Reaktiver warmschmelzklebstoff
US5613862A (en) * 1992-07-18 1997-03-25 Central Research Laboratories Limited Anisotropic electrical connection
GB2269059A (en) * 1992-07-18 1994-01-26 Central Research Lab Ltd Insulation displacement anisotropic electrical connection.
DE4228608C2 (de) * 1992-08-28 1994-12-22 Fraunhofer Ges Forschung Elektrisch leitender Kleber, Verfahren zu dessen Herstellung sowie dessen Verwendung
JP3689159B2 (ja) * 1995-12-01 2005-08-31 ナミックス株式会社 導電性接着剤およびそれを用いた回路
US5908881A (en) * 1996-11-29 1999-06-01 Sumitomo Bakelite Company Limited Heat-conductive paste
US5891367A (en) * 1998-02-23 1999-04-06 General Motors Corporation Conductive epoxy adhesive
DE10000834A1 (de) * 2000-01-12 2001-08-16 Fraunhofer Ges Forschung Verfahren zur Herstellung elektrisch leitender Verbindungen
GB2365816B (en) * 2000-08-09 2002-11-13 Murata Manufacturing Co Method of bonding conductive adhesive and electrode,and bonded structure
US7556747B2 (en) 2003-08-08 2009-07-07 Sumitomo Electric Industries, Ltd. Electrically conductive pastes
DE102013009234B4 (de) 2012-06-01 2019-10-02 Technische Universität Dresden Verfahren zur Herstellung elektrisch leitender Verbindungen zwischen Fügepartnern sowie eine Verwendung eines Polymers oder Polymergemischs
WO2017134282A1 (en) * 2016-02-05 2017-08-10 Technische Universität München Joining of components by means of energetically activated reactive particles

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2012120A1 (en) * 1968-07-01 1970-03-13 Chomerics Inc Heat shrunk plastic screening for insulating wires
US3968056A (en) * 1974-09-27 1976-07-06 General Electric Company Radiation curable inks
JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
US4487811A (en) * 1980-12-29 1984-12-11 General Electric Company Electrical conductor
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste
NL8204288A (nl) * 1982-11-05 1984-06-01 Gen Electric Polymeermengsel, werkwijze voor het bereiden van het polymeermengsel, voorwerpen gevormd uit het polymeermengsel.
US4696764A (en) * 1983-12-02 1987-09-29 Osaka Soda Co., Ltd. Electrically conductive adhesive composition
US4747968A (en) * 1985-05-08 1988-05-31 Sheldahl, Inc. Low temperature cure having single component conductive adhesive
JPS6261336A (ja) * 1985-09-11 1987-03-18 Toshiba Chem Corp 半導体素子
US4880570A (en) * 1986-03-31 1989-11-14 Harris Corporation Electroconductive adhesive
JPH0733476B2 (ja) * 1986-12-26 1995-04-12 三井東圧化学株式会社 銀ペ−スト
US4859364A (en) * 1988-05-25 1989-08-22 E. I. Du Pont De Nemours And Company Conductive paste composition

Also Published As

Publication number Publication date
WO1991007759A1 (en) 1991-05-30
EP0428165A1 (de) 1991-05-22
GB2239244A (en) 1991-06-26
CA2068657A1 (en) 1991-05-15
GB2239244B (en) 1994-06-01
DE69034020D1 (de) 2003-01-02
DE4036274A1 (de) 1991-06-06
AU7048091A (en) 1991-06-13
CA2068657C (en) 1998-01-06
EP1246206B1 (de) 2007-02-28
EP0428165B1 (de) 2002-11-20
ATE355594T1 (de) 2006-03-15
EP1246206A2 (de) 2002-10-02
DE69034020T2 (de) 2003-10-09
EP1246206A3 (de) 2004-04-14
GB9024669D0 (en) 1991-01-02
DE69034236T2 (de) 2007-10-31
DE69034236D1 (de) 2007-04-12

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties