ATE195598T1 - Herstellungsvorrichtung für chipkarten - Google Patents

Herstellungsvorrichtung für chipkarten

Info

Publication number
ATE195598T1
ATE195598T1 AT93402292T AT93402292T ATE195598T1 AT E195598 T1 ATE195598 T1 AT E195598T1 AT 93402292 T AT93402292 T AT 93402292T AT 93402292 T AT93402292 T AT 93402292T AT E195598 T1 ATE195598 T1 AT E195598T1
Authority
AT
Austria
Prior art keywords
station
cards
chip cards
production device
stations
Prior art date
Application number
AT93402292T
Other languages
English (en)
Inventor
Gerard Nioche
Dominique Perdoux
Patrick Baudron
Original Assignee
Leroux Gilles Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leroux Gilles Sa filed Critical Leroux Gilles Sa
Application granted granted Critical
Publication of ATE195598T1 publication Critical patent/ATE195598T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1304—Means making hole or aperture in part to be laminated
    • Y10T156/1309—Means making hole or aperture in part to be laminated and securing separate part over hole or aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y10T156/1768—Means simultaneously conveying plural articles from a single source and serially presenting them to an assembly station
    • Y10T156/1771—Turret or rotary drum-type conveyor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y10T156/1776—Means separating articles from bulk source
    • Y10T156/1778—Stacked sheet source
AT93402292T 1992-09-22 1993-09-20 Herstellungsvorrichtung für chipkarten ATE195598T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9211430A FR2695854B1 (fr) 1992-09-22 1992-09-22 Dispositif de fraisage de cavités dans des cartes en matière plastique et d'encartage de circuits intégrés dans lesdites cavités.

Publications (1)

Publication Number Publication Date
ATE195598T1 true ATE195598T1 (de) 2000-09-15

Family

ID=9433875

Family Applications (1)

Application Number Title Priority Date Filing Date
AT93402292T ATE195598T1 (de) 1992-09-22 1993-09-20 Herstellungsvorrichtung für chipkarten

Country Status (8)

Country Link
US (1) US5397426A (de)
EP (1) EP0589771B1 (de)
JP (1) JPH071876A (de)
KR (1) KR100307937B1 (de)
AT (1) ATE195598T1 (de)
CA (1) CA2106498C (de)
DE (1) DE69329226T2 (de)
FR (1) FR2695854B1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4433076A1 (de) * 1994-09-16 1996-03-21 Melzer Maschinenbau Gmbh Werkzeugmaschine
FR2766945B1 (fr) * 1997-07-29 1999-10-29 Leroux Gilles Sa Machine de personnalisation a haute cadence
DE19750344C2 (de) * 1997-11-13 2000-05-18 Ods Landis & Gyr Gmbh & Co Kg Verfahren zum Herstellen eines flachen Kartengrundkörpers für eine Chipkarte
TW426630B (en) * 1998-05-28 2001-03-21 Asahi Seiko Co Ltd IC card processing machine
DE19926885A1 (de) * 1999-06-12 2000-12-14 Atlantic Zeiser Gmbh & Co Transporteinrichtung für Informationsträger, insbesondere Karten
AU2003266825A1 (en) * 2002-05-08 2003-11-11 Drexler Technology Corporation Method of making secure personal data card
EP1598861A1 (de) * 2004-05-19 2005-11-23 Axalto S.A. Methode und Apparatur zu Kalibrierung und Steuerung des Bestückens einer Chipkarte mit einem Chip
FR2883503B1 (fr) * 2005-03-23 2020-11-06 Datacard Corp Machine de marquage laser a haute cadence
FR2925969B1 (fr) * 2007-12-26 2010-01-22 Datacard Corp Procede et dispositif d'encartage d'un module ou puce.
FR2939421B1 (fr) 2008-12-05 2011-01-14 Datacard Corp Dispositif ascenseur pour machine de personnalisation et machine de personnalisation munie d'un dispositif ascenseur
WO2013078610A1 (en) * 2011-11-29 2013-06-06 Gemalto Technologies (Shanghai) Co., Ltd. Modular conveyer for conveying chip cards

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3655024A (en) * 1970-05-22 1972-04-11 Chas H Stehling Co Method of and apparatus for feeding workpieces to two machine units
US3687276A (en) * 1971-01-04 1972-08-29 Mechtron Intern Corp Self-propelled conveyor apparatus
US4653630A (en) * 1981-11-16 1987-03-31 Anna Bravin Method of and device for controlling the transfer of articles from a first conveyor belt to predetermined locations on a second conveyor belt
US4915565A (en) * 1984-03-22 1990-04-10 Sgs-Thomson Microelectronics, Inc. Manipulation and handling of integrated circuit dice
DE3509802A1 (de) * 1985-03-19 1986-09-25 Heckler & Koch Gmbh, 7238 Oberndorf Verfahren und vorrichtung zum handhaben von werkstuecken
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
CN85100044B (zh) * 1985-04-01 1985-09-10 清华大学 深水池式供热堆
DE3520732A1 (de) * 1985-06-10 1986-12-11 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH, 8000 München Montagemaschine
JPS626476A (ja) * 1985-07-02 1987-01-13 Kasei Baabeitamu Kk 補強リング貼付け装置
CH672285A5 (de) * 1987-04-14 1989-11-15 Landis & Gyr Ag
FR2624999B1 (fr) * 1987-12-22 1990-04-06 Sgs Thomson Microelectronics Procede de fabrication de cartes a puce
CA2025295C (en) * 1989-09-16 1993-11-02 Ryoichi Yamamoto Magnetic card manufacturing arrangement
US5097939A (en) * 1989-11-03 1992-03-24 Shanklin Corporation Synchronous position product feed system

Also Published As

Publication number Publication date
FR2695854A1 (fr) 1994-03-25
DE69329226D1 (de) 2000-09-21
KR940008550A (ko) 1994-04-29
EP0589771B1 (de) 2000-08-16
FR2695854B1 (fr) 1994-12-09
CA2106498C (fr) 2004-08-03
CA2106498A1 (fr) 1994-03-23
US5397426A (en) 1995-03-14
DE69329226T2 (de) 2001-02-22
KR100307937B1 (ko) 2001-11-30
JPH071876A (ja) 1995-01-06
EP0589771A1 (de) 1994-03-30

Similar Documents

Publication Publication Date Title
ATE195598T1 (de) Herstellungsvorrichtung für chipkarten
FR2488427B1 (fr) Carte d'identification avec un module de circuits integres et son procede de fabrication
DE69015154T2 (de) Kontaktlose integrierte Schaltungskarte.
HK21896A (en) Semiconductor integrated circuit chip having an identification circuit therein
DE68918775D1 (de) Chip-auf-Chip-Verbindungsschema für integrierte Halbleiterschaltungen.
DE3878280T2 (de) Bearbeitungsvorrichtung für schnellaufende Bänder.
DE68918133D1 (de) Untereinheiten für hybrid-integrierte optoelektronische Schaltkreise.
BR0203165A (pt) Sistema e método para transferência de lentes inteligente
EP0654830A3 (de) Integriertes Halbleiterschaltkreisbauelement.
DE68917398T2 (de) Integrierte Schaltungshalbleiteranordnung mit verbesserter Einrichtung für Speiseleitungen.
DE3853764T2 (de) Zwischenschaltungssystem für integrierte Halbleiterschaltungen.
IT8220661A0 (it) Processo per la fabbricazione di transistori mos complementari in circuiti integrati ad alta densita' per tensioni elevate.
DE69112264T2 (de) Automatischer Entzerrer und integrierte Halbleiterschaltung, die einen solchen Entzerrer enthält.
EP0231811A3 (en) Method for manufacturing integrated electronic devices, in particular high voltage p-channel mos transistors
EP0249988A3 (de) Masterslice-integrierte Schaltung mit einer Anordnung von Transistorelementen für vereinfachte Verdrahtungen
DE68907451T2 (de) Ausgangstreiberschaltung für Halbleiter-IC.
IT8125308A0 (it) Dispositivo per l'alimentazione elo scarico di pezzi in macchine diproduzione installate inparallello.
DE3889584T2 (de) Ausgangspuffer für MOS-integrierte Halbleiterschaltung.
IT8224816A0 (it) Interfaccia d'uscita per circuito logico a tre stati in circuito integrato a transistori "mos".
EP0439922A3 (en) Integrated circuit transfer test device system utilizing lateral transistors
DE3768010D1 (de) Spritzgiessanlage.
DE59402030D1 (de) Förderanlage zur Förderung von Hohlkörpern
DE8807283U1 (de)
GB8322822D0 (en) Mos transistor integrated circuit
EP0421448A3 (en) Signal output circuit having bipolar transistors at output, for use in a mos semiconductor integrated circuit