ATE18103T1 - Waermesenke fuer integrierte stromkreisanordnung. - Google Patents
Waermesenke fuer integrierte stromkreisanordnung.Info
- Publication number
- ATE18103T1 ATE18103T1 AT81305528T AT81305528T ATE18103T1 AT E18103 T1 ATE18103 T1 AT E18103T1 AT 81305528 T AT81305528 T AT 81305528T AT 81305528 T AT81305528 T AT 81305528T AT E18103 T1 ATE18103 T1 AT E18103T1
- Authority
- AT
- Austria
- Prior art keywords
- recess
- integrated circuit
- heat sink
- circuit arrangements
- lug
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8037767A GB2088128B (en) | 1980-11-25 | 1980-11-25 | Heatsink for integrated circuit device |
EP81305528A EP0053030B1 (de) | 1980-11-25 | 1981-11-24 | Wärmesenke für integrierte Stromkreisanordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE18103T1 true ATE18103T1 (de) | 1986-03-15 |
Family
ID=10517537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT81305528T ATE18103T1 (de) | 1980-11-25 | 1981-11-24 | Waermesenke fuer integrierte stromkreisanordnung. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0053030B1 (de) |
AT (1) | ATE18103T1 (de) |
DE (1) | DE3173844D1 (de) |
GB (1) | GB2088128B (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4481525A (en) * | 1982-08-12 | 1984-11-06 | Anthony D. Calabro | Heat dissipator for integrated circuit chips |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE7124853U (de) * | 1971-06-29 | 1971-10-28 | Licentia Gmbh | Kuehlkoerper fuer halbleiterbauelemente |
GB1324347A (en) * | 1971-12-17 | 1973-07-25 | Staver Co | Heat dissipator for encased semiconductor device having a heat conductive tab extending therefrom |
JPS5266376A (en) * | 1975-11-29 | 1977-06-01 | Hitachi Ltd | Device and manufacture of resin body type semiconductor |
-
1980
- 1980-11-25 GB GB8037767A patent/GB2088128B/en not_active Expired
-
1981
- 1981-11-24 EP EP81305528A patent/EP0053030B1/de not_active Expired
- 1981-11-24 DE DE8181305528T patent/DE3173844D1/de not_active Expired
- 1981-11-24 AT AT81305528T patent/ATE18103T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0053030A3 (en) | 1983-02-16 |
DE3173844D1 (en) | 1986-03-27 |
GB2088128B (en) | 1984-11-28 |
EP0053030A2 (de) | 1982-06-02 |
GB2088128A (en) | 1982-06-03 |
EP0053030B1 (de) | 1986-02-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |