GB1324347A - Heat dissipator for encased semiconductor device having a heat conductive tab extending therefrom - Google Patents

Heat dissipator for encased semiconductor device having a heat conductive tab extending therefrom

Info

Publication number
GB1324347A
GB1324347A GB1324347DA GB1324347A GB 1324347 A GB1324347 A GB 1324347A GB 1324347D A GB1324347D A GB 1324347DA GB 1324347 A GB1324347 A GB 1324347A
Authority
GB
United Kingdom
Prior art keywords
heat
semiconductor device
extending therefrom
sink
tab extending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Staver Co Inc
Original Assignee
Staver Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Staver Co Inc filed Critical Staver Co Inc
Publication of GB1324347A publication Critical patent/GB1324347A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1324347 Semi-conductor devices STAVER CO Inc 17 Dec 1971 58861/71 Heading H1K A heat sink 17, for an encapsulated semiconductor device 10 having a heat conducting tab 16 extending therefrom, comprises a sheetmetal body 18 with finger portions 22 folded over to form a slot in which the tab is retained. The heat sink may be stamped from a beryllium copper strip and include upstanding portions 26 to improve convection cooling. In a further embodiment the device 10 may be supported on an extending leg portion of the sink extending beneath the device, the portion entering a circuit board to secure the device thereto. To reduce space requirements the sink may be bent back upon itself about its mid-point.
GB1324347D 1971-12-17 1971-12-17 Heat dissipator for encased semiconductor device having a heat conductive tab extending therefrom Expired GB1324347A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5886171 1971-12-17

Publications (1)

Publication Number Publication Date
GB1324347A true GB1324347A (en) 1973-07-25

Family

ID=10482565

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1324347D Expired GB1324347A (en) 1971-12-17 1971-12-17 Heat dissipator for encased semiconductor device having a heat conductive tab extending therefrom

Country Status (1)

Country Link
GB (1) GB1324347A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0053030A2 (en) * 1980-11-25 1982-06-02 Columbia-Staver Limited Heatsink for integrated circuit device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0053030A2 (en) * 1980-11-25 1982-06-02 Columbia-Staver Limited Heatsink for integrated circuit device
EP0053030A3 (en) * 1980-11-25 1983-02-16 Staver Thermal Products (U.K.) Ltd. Heatsink for integrated circuit device

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee