ATE167705T1 - Cantilever montagevorrichtung für rotierende zylindrische magnetrone - Google Patents

Cantilever montagevorrichtung für rotierende zylindrische magnetrone

Info

Publication number
ATE167705T1
ATE167705T1 AT91914088T AT91914088T ATE167705T1 AT E167705 T1 ATE167705 T1 AT E167705T1 AT 91914088 T AT91914088 T AT 91914088T AT 91914088 T AT91914088 T AT 91914088T AT E167705 T1 ATE167705 T1 AT E167705T1
Authority
AT
Austria
Prior art keywords
drive shaft
housing
mounting device
rotating cylindrical
cantilever mounting
Prior art date
Application number
AT91914088T
Other languages
German (de)
English (en)
Inventor
David E Stevenson
Erik J Bjornard
Geoffrey H Humberstone
Original Assignee
Viratec Thin Films Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Viratec Thin Films Inc filed Critical Viratec Thin Films Inc
Application granted granted Critical
Publication of ATE167705T1 publication Critical patent/ATE167705T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Snaps, Bayonet Connections, Set Pins, And Snap Rings (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Earth Drilling (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Sealing Of Bearings (AREA)
AT91914088T 1990-08-10 1991-07-31 Cantilever montagevorrichtung für rotierende zylindrische magnetrone ATE167705T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US56621490A 1990-08-10 1990-08-10
US07/737,372 US5200049A (en) 1990-08-10 1991-07-29 Cantilever mount for rotating cylindrical magnetrons

Publications (1)

Publication Number Publication Date
ATE167705T1 true ATE167705T1 (de) 1998-07-15

Family

ID=27074110

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91914088T ATE167705T1 (de) 1990-08-10 1991-07-31 Cantilever montagevorrichtung für rotierende zylindrische magnetrone

Country Status (9)

Country Link
US (1) US5200049A (enExample)
EP (1) EP0543844B1 (enExample)
JP (1) JP3324654B2 (enExample)
AT (1) ATE167705T1 (enExample)
CA (1) CA2089147C (enExample)
DE (1) DE69129658T2 (enExample)
DK (1) DK0543844T3 (enExample)
ES (1) ES2129027T3 (enExample)
WO (1) WO1992002660A1 (enExample)

Families Citing this family (57)

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CH690805A5 (de) * 1993-05-04 2001-01-15 Unaxis Balzers Ag Magnetfeldunterstützte Zerstäubungsanordnung und Vakuumbehandlungsanlage hiermit.
EP0658634B1 (en) * 1993-12-17 1999-03-10 KABUSHIKI KAISHA KOBE SEIKO SHO also known as Kobe Steel Ltd. Vacuum arc deposition apparatus
US5567289A (en) * 1993-12-30 1996-10-22 Viratec Thin Films, Inc. Rotating floating magnetron dark-space shield and cone end
US5620577A (en) * 1993-12-30 1997-04-15 Viratec Thin Films, Inc. Spring-loaded mount for a rotatable sputtering cathode
US5571393A (en) * 1994-08-24 1996-11-05 Viratec Thin Films, Inc. Magnet housing for a sputtering cathode
US5445721A (en) * 1994-08-25 1995-08-29 The Boc Group, Inc. Rotatable magnetron including a replacement target structure
US5518592A (en) * 1994-08-25 1996-05-21 The Boc Group, Inc. Seal cartridge for a rotatable magnetron
US5812405A (en) * 1995-05-23 1998-09-22 Viratec Thin Films, Inc. Three variable optimization system for thin film coating design
US5789838A (en) * 1996-10-09 1998-08-04 Satcon Technology Corporation Three-axis force actuator for a magnetic bearing
US6328858B1 (en) * 1998-10-01 2001-12-11 Nexx Systems Packaging, Llc Multi-layer sputter deposition apparatus
US6641701B1 (en) * 2000-06-14 2003-11-04 Applied Materials, Inc. Cooling system for magnetron sputtering apparatus
US6530733B2 (en) 2000-07-27 2003-03-11 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6821912B2 (en) 2000-07-27 2004-11-23 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6682288B2 (en) 2000-07-27 2004-01-27 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6375815B1 (en) * 2001-02-17 2002-04-23 David Mark Lynn Cylindrical magnetron target and apparatus for affixing the target to a rotatable spindle assembly
US7399385B2 (en) * 2001-06-14 2008-07-15 Tru Vue, Inc. Alternating current rotatable sputter cathode
US6736948B2 (en) * 2002-01-18 2004-05-18 Von Ardenne Anlagentechnik Gmbh Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation
US20030173217A1 (en) * 2002-03-14 2003-09-18 Sputtering Components, Inc. High-power ion sputtering magnetron
DE10247051A1 (de) * 2002-10-09 2004-04-22 Polymer Latex Gmbh & Co Kg Latex und Verfahren zu seiner Herstellung
DE10312632B4 (de) * 2003-03-21 2005-11-24 Interpane Entwicklungs- Und Beratungsgesellschaft Mbh & Co.Kg Magnetron mit zweistufiger Dichtung
DE10312631A1 (de) * 2003-03-21 2004-10-07 Interpane Entwicklungs- Und Beratungsgesellschaft Mbh & Co.Kg Magnetron mit Kühlmittelschutz
US20060157346A1 (en) * 2003-07-04 2006-07-20 Dirk Cnockaert Rotating tubular sputter target assembly
US7100954B2 (en) * 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
SG118232A1 (en) * 2004-02-27 2006-06-27 Superiorcoat Private Ltd Cathodic arc coating apparatus
US20050224343A1 (en) * 2004-04-08 2005-10-13 Richard Newcomb Power coupling for high-power sputtering
US20060049043A1 (en) * 2004-08-17 2006-03-09 Matuska Neal W Magnetron assembly
US20060065524A1 (en) * 2004-09-30 2006-03-30 Richard Newcomb Non-bonded rotatable targets for sputtering
SI1799876T1 (sl) * 2004-10-18 2009-06-30 Bekaert Advanced Coatings Plosk končni blok zasučne tarče za napraševanje
JP4836956B2 (ja) * 2004-10-18 2011-12-14 ベーカート・アドヴァンスト・コーティングス 回転可能なターゲットスパッタリング装置用エンドブロック
US20060096855A1 (en) * 2004-11-05 2006-05-11 Richard Newcomb Cathode arrangement for atomizing a rotatable target pipe
DE102004058316A1 (de) * 2004-12-02 2006-06-08 W.C. Heraeus Gmbh Rohrförmiges Sputtertarget
PL1856303T3 (pl) * 2005-03-11 2009-06-30 Bekaert Advanced Coatings Pojedynczy, prostokątny blok czołowy
US20060278521A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for controlling ion density and energy using modulated power signals
US20060278524A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for modulating power signals to control sputtering
ATE415503T1 (de) 2005-08-10 2008-12-15 Applied Materials Gmbh & Co Kg Vakuumbeschichtungsanlage mit motorisch angetriebener drehkathode
US7842355B2 (en) * 2005-11-01 2010-11-30 Applied Materials, Inc. System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties
US20070095281A1 (en) * 2005-11-01 2007-05-03 Stowell Michael W System and method for power function ramping of microwave liner discharge sources
JP5080573B2 (ja) * 2006-06-19 2012-11-21 ソレラス・アドヴァンスト・コーティングス・ナムローゼ・フェンノートシャップ スパッタリング設備のエンドブロック用のインサート部品
CN100564582C (zh) * 2006-09-19 2009-12-02 中国科学院合肥物质科学研究院 用于10-8Pa超高真空圆形平面磁控溅射靶的密封装置
WO2008154397A1 (en) * 2007-06-08 2008-12-18 General Plasma, Inc. Rotatable magnetron sputtering with axially moveable target electrode tube
DE102008018609B4 (de) * 2008-04-11 2012-01-19 Von Ardenne Anlagentechnik Gmbh Antriebsendblock für ein rotierendes Magnetron
US8137517B1 (en) 2009-02-10 2012-03-20 Wd Media, Inc. Dual position DC magnetron assembly
US8182662B2 (en) * 2009-03-27 2012-05-22 Sputtering Components, Inc. Rotary cathode for magnetron sputtering apparatus
DE102009056241B4 (de) * 2009-12-01 2012-07-12 Von Ardenne Anlagentechnik Gmbh Stützeinrichtung für eine Magnetronanordnung mit einem rotierenden Target
EP2371992B1 (en) * 2010-04-01 2013-06-05 Applied Materials, Inc. End-block and sputtering installation
GB201200574D0 (en) * 2012-01-13 2012-02-29 Gencoa Ltd In-vacuum rotational device
US8674327B1 (en) 2012-05-10 2014-03-18 WD Media, LLC Systems and methods for uniformly implanting materials on substrates using directed magnetic fields
DE102014101344B4 (de) * 2014-02-04 2016-03-31 Von Ardenne Gmbh Endblock-Anordnung
DE102014101582B4 (de) * 2014-02-07 2017-10-26 Von Ardenne Gmbh Lagervorrichtung
DE102014101830B4 (de) * 2014-02-13 2015-10-08 Von Ardenne Gmbh Antriebs-Baugruppe, Prozessieranordnung, Verfahren zum Montieren einer Antriebs-Baugruppe und Verfahren zum Demontieren einer Antriebs-Baugruppe
EA028887B1 (ru) * 2014-02-28 2018-01-31 Общество С Ограниченной Ответственностью "Изовак" Система охлаждения мишени магнетронно-распылительного устройства цилиндрического типа
CN104357802B (zh) * 2014-11-06 2017-03-15 深圳市纳为金属技术有限公司 一种氟化物轴封超薄旋转阴极端头
EP3032565A1 (en) 2014-12-08 2016-06-15 Soleras Advanced Coatings bvba A device having two end blocks, an assembly and a sputter system comprising same, and a method of providing RF power to a target tube using said device or assembly
EP3032566B1 (en) 2014-12-08 2019-11-06 Soleras Advanced Coatings bvba Cylindrical structure for use in an RF sputter process and a sputtering system comprising same
BE1023876B1 (nl) 2016-07-13 2017-08-31 Soleras Advanced Coatings Bvba Elektrische overdracht in een eindblok
BE1024754B9 (nl) * 2016-11-29 2018-07-24 Soleras Advanced Coatings Bvba Een universeel monteerbaar eindblok
BE1026859B1 (nl) 2018-10-22 2020-07-14 Soleras Advanced Coatings Bv Magnetron met geïntegreerd circuit voor het monitoren en controle

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4166018A (en) * 1974-01-31 1979-08-28 Airco, Inc. Sputtering process and apparatus
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4422916A (en) * 1981-02-12 1983-12-27 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4417968A (en) * 1983-03-21 1983-11-29 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4443318A (en) * 1983-08-17 1984-04-17 Shatterproof Glass Corporation Cathodic sputtering apparatus
US4445997A (en) * 1983-08-17 1984-05-01 Shatterproof Glass Corporation Rotatable sputtering apparatus
US4466877A (en) * 1983-10-11 1984-08-21 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4519885A (en) * 1983-12-27 1985-05-28 Shatterproof Glass Corp. Method and apparatus for changing sputtering targets in a magnetron sputtering system
US4904362A (en) * 1987-07-24 1990-02-27 Miba Gleitlager Aktiengesellschaft Bar-shaped magnetron or sputter cathode arrangement
US5100527A (en) * 1990-10-18 1992-03-31 Viratec Thin Films, Inc. Rotating magnetron incorporating a removable cathode

Also Published As

Publication number Publication date
EP0543844A4 (enExample) 1994-03-09
DK0543844T3 (da) 1999-04-06
EP0543844B1 (en) 1998-06-24
WO1992002660A1 (en) 1992-02-20
DE69129658T2 (de) 1999-03-11
US5200049A (en) 1993-04-06
EP0543844A1 (en) 1993-06-02
CA2089147C (en) 2001-04-17
JPH06508886A (ja) 1994-10-06
ES2129027T3 (es) 1999-06-01
DE69129658D1 (de) 1998-07-30
JP3324654B2 (ja) 2002-09-17
CA2089147A1 (en) 1992-02-11

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
EELA Cancelled due to lapse of time