ATE167097T1 - Vorbehandlungssystem zum flussmittelfreien löten und verfahren unter verwendung eines fluorhaltigen plasmas - Google Patents

Vorbehandlungssystem zum flussmittelfreien löten und verfahren unter verwendung eines fluorhaltigen plasmas

Info

Publication number
ATE167097T1
ATE167097T1 AT95902622T AT95902622T ATE167097T1 AT E167097 T1 ATE167097 T1 AT E167097T1 AT 95902622 T AT95902622 T AT 95902622T AT 95902622 T AT95902622 T AT 95902622T AT E167097 T1 ATE167097 T1 AT E167097T1
Authority
AT
Austria
Prior art keywords
sample chamber
fluorine
chamber extension
sample
passageway
Prior art date
Application number
AT95902622T
Other languages
English (en)
Inventor
Stephen M Bobbio
Nicholas George Koopman
Sundeep Nangalia
Original Assignee
Mcnc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26851941&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE167097(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US08/155,020 external-priority patent/US5407121A/en
Application filed by Mcnc filed Critical Mcnc
Application granted granted Critical
Publication of ATE167097T1 publication Critical patent/ATE167097T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT95902622T 1993-11-19 1994-11-16 Vorbehandlungssystem zum flussmittelfreien löten und verfahren unter verwendung eines fluorhaltigen plasmas ATE167097T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/155,020 US5407121A (en) 1993-11-19 1993-11-19 Fluxless soldering of copper
US08/339,770 US5499754A (en) 1993-11-19 1994-11-15 Fluxless soldering sample pretreating system

Publications (1)

Publication Number Publication Date
ATE167097T1 true ATE167097T1 (de) 1998-06-15

Family

ID=26851941

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95902622T ATE167097T1 (de) 1993-11-19 1994-11-16 Vorbehandlungssystem zum flussmittelfreien löten und verfahren unter verwendung eines fluorhaltigen plasmas

Country Status (7)

Country Link
US (1) US5499754A (de)
EP (1) EP0729397B2 (de)
JP (1) JP3153815B2 (de)
AT (1) ATE167097T1 (de)
AU (1) AU1182595A (de)
DE (1) DE69411031D1 (de)
WO (1) WO1995013896A1 (de)

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US6006763A (en) * 1995-01-11 1999-12-28 Seiko Epson Corporation Surface treatment method
JPH08279495A (ja) * 1995-02-07 1996-10-22 Seiko Epson Corp プラズマ処理装置及びその方法
JP3521587B2 (ja) * 1995-02-07 2004-04-19 セイコーエプソン株式会社 基板周縁の不要物除去方法及び装置並びにそれを用いた塗布方法
WO1996031997A1 (en) * 1995-04-07 1996-10-10 Seiko Epson Corporation Surface treatment apparatus
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JPH09233862A (ja) * 1995-12-18 1997-09-05 Seiko Epson Corp 圧電体を用いた発電方法、発電装置および電子機器
JPH09312545A (ja) 1996-03-18 1997-12-02 Seiko Epson Corp 圧電素子、その製造方法、及び圧電振動片のマウント装置
US5918354A (en) * 1996-04-02 1999-07-06 Seiko Epson Corporation Method of making a piezoelectric element
US5866986A (en) * 1996-08-05 1999-02-02 Integrated Electronic Innovations, Inc. Microwave gas phase plasma source
US5992729A (en) * 1996-10-02 1999-11-30 Mcnc Tacking processes and systems for soldering
DE19643865C2 (de) * 1996-10-30 1999-04-08 Schott Glas Plasmaunterstütztes chemisches Abscheidungsverfahren (CVD) mit entfernter Anregung eines Anregungsgases (Remote-Plasma-CVD-Verfahren) zur Beschichtung oder zur Behandlung großflächiger Substrate und Vorrichtung zur Durchführung desselben
US5902686A (en) * 1996-11-21 1999-05-11 Mcnc Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures
US5776551A (en) * 1996-12-23 1998-07-07 Lsi Logic Corporation Use of plasma activated NF3 to clean solder bumps on a device
US6142358A (en) * 1997-05-31 2000-11-07 The Regents Of The University Of California Wafer-to-wafer transfer of microstructures using break-away tethers
JP4497154B2 (ja) * 1997-12-15 2010-07-07 セイコーエプソン株式会社 固体接合方法
US6250540B1 (en) * 1999-04-30 2001-06-26 International Business Machines Corporation Fluxless joining process for enriched solders
US6056831A (en) 1998-07-10 2000-05-02 International Business Machines Corporation Process for chemically and mechanically enhancing solder surface properties
US6607613B2 (en) 1998-07-10 2003-08-19 International Business Machines Corporation Solder ball with chemically and mechanically enhanced surface properties
US6742701B2 (en) * 1998-09-17 2004-06-01 Kabushiki Kaisha Tamura Seisakusho Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus
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US6193135B1 (en) 1999-09-13 2001-02-27 Lucent Technologies Inc. System for providing back-lighting of components during fluxless soldering
US6206276B1 (en) 1999-09-13 2001-03-27 Lucent Technologies Inc. Direct-placement fluxless soldering using inert gas environment
JP2002231724A (ja) * 2001-01-30 2002-08-16 Nec Corp 配線の形成方法
DE10210216A1 (de) * 2002-03-08 2003-10-16 Behr Gmbh & Co Verfahren zum Löten von Aluminium
US20080190558A1 (en) * 2002-04-26 2008-08-14 Accretech Usa, Inc. Wafer processing apparatus and method
US20080011332A1 (en) * 2002-04-26 2008-01-17 Accretech Usa, Inc. Method and apparatus for cleaning a wafer substrate
US20080017316A1 (en) * 2002-04-26 2008-01-24 Accretech Usa, Inc. Clean ignition system for wafer substrate processing
US6936546B2 (en) * 2002-04-26 2005-08-30 Accretech Usa, Inc. Apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates
US6949398B2 (en) * 2002-10-31 2005-09-27 Freescale Semiconductor, Inc. Low cost fabrication and assembly of lid for semiconductor devices
US7332424B2 (en) * 2004-08-16 2008-02-19 International Business Machines Corporation Fluxless solder transfer and reflow process
CN104425289B (zh) * 2013-09-11 2017-12-15 先进科技新加坡有限公司 利用激发的混合气体的晶粒安装装置和方法
CN105252099B (zh) * 2015-11-24 2017-07-11 武汉工程大学 一种利用微波等离子体焊接金刚石真空窗口的方法
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US11217550B2 (en) * 2018-07-24 2022-01-04 Xilinx, Inc. Chip package assembly with enhanced interconnects and method for fabricating the same

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Also Published As

Publication number Publication date
DE69411031D1 (de) 1998-07-16
JP3153815B2 (ja) 2001-04-09
WO1995013896A1 (en) 1995-05-26
JPH09505001A (ja) 1997-05-20
EP0729397B2 (de) 2001-09-19
EP0729397B1 (de) 1998-06-10
AU1182595A (en) 1995-06-06
EP0729397A1 (de) 1996-09-04
US5499754A (en) 1996-03-19

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