ATE158135T1 - Verfahren für das drucken einer abbildung auf einem substrat, insbesondere geeignet für die herstellung von gedruckten schaltplatinen - Google Patents
Verfahren für das drucken einer abbildung auf einem substrat, insbesondere geeignet für die herstellung von gedruckten schaltplatinenInfo
- Publication number
- ATE158135T1 ATE158135T1 AT92110691T AT92110691T ATE158135T1 AT E158135 T1 ATE158135 T1 AT E158135T1 AT 92110691 T AT92110691 T AT 92110691T AT 92110691 T AT92110691 T AT 92110691T AT E158135 T1 ATE158135 T1 AT E158135T1
- Authority
- AT
- Austria
- Prior art keywords
- image
- substrate
- film
- printing
- printed circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0577—Double layer of resist having the same pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0585—Second resist used as mask for selective stripping of first resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/146—Laser beam
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/165—Thermal imaging composition
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structural Engineering (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Architecture (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL9866091A IL98660A (en) | 1991-06-28 | 1991-06-28 | Method of printing an image on a substrate particularly useful for producing printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE158135T1 true ATE158135T1 (de) | 1997-09-15 |
Family
ID=11062586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT92110691T ATE158135T1 (de) | 1991-06-28 | 1992-06-25 | Verfahren für das drucken einer abbildung auf einem substrat, insbesondere geeignet für die herstellung von gedruckten schaltplatinen |
Country Status (6)
Country | Link |
---|---|
US (1) | US5328811A (de) |
EP (1) | EP0520437B1 (de) |
JP (1) | JPH05279862A (de) |
AT (1) | ATE158135T1 (de) |
DE (1) | DE69222097T2 (de) |
IL (1) | IL98660A (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MX9305898A (es) * | 1992-10-30 | 1995-01-31 | Texas Instruments Inc | Metodo de grabado fotoquimico anisotropico para la fabricacion decircuitos integrados. |
US5459103A (en) * | 1994-04-18 | 1995-10-17 | Texas Instruments Incorporated | Method of forming lead frame with strengthened encapsulation adhesion |
US5641608A (en) * | 1995-10-23 | 1997-06-24 | Macdermid, Incorporated | Direct imaging process for forming resist pattern on a surface and use thereof in fabricating printing plates |
US6215269B1 (en) * | 1996-05-21 | 2001-04-10 | Kent Gregg | Method of exposing a path on a curved, or otherwise irregularly shaped, surface |
PL182062B1 (pl) | 1996-11-22 | 2001-10-31 | Armstrong World Ind Inc | Uklad izolacyjny dla rur PL |
US6063528A (en) * | 1997-05-20 | 2000-05-16 | Morgan; David A. | Thermosensitive composition |
US5958647A (en) * | 1997-05-20 | 1999-09-28 | Morgan; David A. | Thermosensitive etch resist for forming a mask |
DE69818485T2 (de) | 1997-08-14 | 2004-07-22 | Kodak Polychrome Graphics Co. Ltd., Norwalk | Verfahren zur herstellung von elektronischen bauteilen |
US6387597B1 (en) | 1998-06-05 | 2002-05-14 | Creo Srl | Method for exposing features on non-planar resists |
US6136509A (en) * | 1998-06-05 | 2000-10-24 | Creo Srl | Method of exposing thermoresist |
US6078713A (en) * | 1998-06-08 | 2000-06-20 | Uv Technology, Inc. | Beam delivery system for curing of photo initiated inks |
US6590635B2 (en) | 1998-06-19 | 2003-07-08 | Creo Inc. | High resolution optical stepper |
US6593064B1 (en) | 1998-06-19 | 2003-07-15 | Creo Inc. | High resolution optical stepper |
IL133889A (en) | 2000-01-05 | 2007-03-08 | Orbotech Ltd | Pulse light pattern writer |
DE10018419A1 (de) * | 2000-04-13 | 2001-10-31 | Schweizer Electronic Ag | Verfahren zur Herstellung einer flexiblen oder starren Schaltungsträgerplatte |
US6602653B1 (en) * | 2000-08-25 | 2003-08-05 | Micron Technology, Inc. | Conductive material patterning methods |
US7453486B2 (en) * | 2000-12-13 | 2008-11-18 | Orbotech Ltd | Pulse light pattern writer |
AU2002239581B2 (en) | 2000-12-15 | 2006-09-28 | The Arizona Board Of Regents On Behalf Of The University Of Arizona | Method for patterning metal using nanoparticle containing precursors |
US6451685B1 (en) | 2001-02-05 | 2002-09-17 | Micron Technology, Inc. | Method for multilevel copper interconnects for ultra large scale integration |
US7147338B2 (en) | 2001-04-09 | 2006-12-12 | Kent Gregg | Circuit on a curved, or otherwise irregularly shaped, surface, such as on a helmet to be worn on the head, including a fiber optic conductive path |
US6614123B2 (en) * | 2001-07-31 | 2003-09-02 | Chippac, Inc. | Plastic ball grid array package with integral heatsink |
JP5415106B2 (ja) * | 2008-03-21 | 2014-02-12 | 住友化学株式会社 | 樹脂パッケージの製造方法 |
USD661262S1 (en) * | 2009-10-26 | 2012-06-05 | Nichia Corporation | Light emitting diode |
US9035673B2 (en) * | 2010-01-25 | 2015-05-19 | Palo Alto Research Center Incorporated | Method of in-process intralayer yield detection, interlayer shunt detection and correction |
CN102762037B (zh) * | 2011-04-29 | 2016-03-02 | 比亚迪股份有限公司 | 一种陶瓷电路板及其制造方法 |
WO2015105939A1 (en) * | 2014-01-08 | 2015-07-16 | University Of Houston System | Systems and methods for locally reducing oxides |
JP7005625B2 (ja) | 2017-07-18 | 2022-01-21 | 旭化成株式会社 | 導電性パターン領域を有する構造体及びその製造方法、積層体及びその製造方法、並びに、銅配線 |
DE102020209767A1 (de) | 2020-08-03 | 2022-02-03 | Gebr. Schmid Gmbh | Verfahren zur Leiterplattenherstellung |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3773514A (en) * | 1971-08-12 | 1973-11-20 | Fromson H A | Light-sensitive structure |
US3964907A (en) * | 1973-11-12 | 1976-06-22 | Xerox Corporation | Method for the preparation of relief printing masters |
US3923514A (en) * | 1974-06-27 | 1975-12-02 | Xerox Corp | Method for the preparation of relief printing masters |
US4013466A (en) * | 1975-06-26 | 1977-03-22 | Western Electric Company, Inc. | Method of preparing a circuit utilizing a liquid crystal artwork master |
US4259433A (en) * | 1976-10-22 | 1981-03-31 | Fuji Photo Film Co., Ltd. | Method for producing disk-recording plates |
US4396997A (en) * | 1981-05-26 | 1983-08-02 | Hewlett-Packard Company | Liquid crystal information storage and retrieval system |
US5079600A (en) * | 1987-03-06 | 1992-01-07 | Schnur Joel M | High resolution patterning on solid substrates |
US4997674A (en) * | 1987-06-30 | 1991-03-05 | Akzo America Inc. | Conductive metallization of substrates via developing agents |
JPH0234984A (ja) * | 1988-04-13 | 1990-02-05 | Mitsubishi Electric Corp | プリント回路基板の製造方法 |
JP2678313B2 (ja) * | 1989-05-31 | 1997-11-17 | スズキ株式会社 | エンジンマウント装置 |
-
1991
- 1991-06-28 IL IL9866091A patent/IL98660A/en not_active IP Right Cessation
-
1992
- 1992-06-24 US US07/903,396 patent/US5328811A/en not_active Expired - Fee Related
- 1992-06-24 JP JP4165873A patent/JPH05279862A/ja active Pending
- 1992-06-25 EP EP92110691A patent/EP0520437B1/de not_active Expired - Lifetime
- 1992-06-25 DE DE69222097T patent/DE69222097T2/de not_active Expired - Fee Related
- 1992-06-25 AT AT92110691T patent/ATE158135T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0520437A1 (de) | 1992-12-30 |
EP0520437B1 (de) | 1997-09-10 |
US5328811A (en) | 1994-07-12 |
IL98660A (en) | 1996-10-16 |
DE69222097D1 (de) | 1997-10-16 |
IL98660A0 (en) | 1992-07-15 |
DE69222097T2 (de) | 1998-03-26 |
JPH05279862A (ja) | 1993-10-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |