ATE136131T1 - Laserbearbeitungsverfahren - Google Patents

Laserbearbeitungsverfahren

Info

Publication number
ATE136131T1
ATE136131T1 AT90910802T AT90910802T ATE136131T1 AT E136131 T1 ATE136131 T1 AT E136131T1 AT 90910802 T AT90910802 T AT 90910802T AT 90910802 T AT90910802 T AT 90910802T AT E136131 T1 ATE136131 T1 AT E136131T1
Authority
AT
Austria
Prior art keywords
target
pct
sec
lens system
ablated
Prior art date
Application number
AT90910802T
Other languages
English (en)
Inventor
Nicholas John Gregg Smith
Original Assignee
Raychem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem Ltd filed Critical Raychem Ltd
Application granted granted Critical
Publication of ATE136131T1 publication Critical patent/ATE136131T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Atmospheric Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Laser Beam Processing (AREA)
  • Laser Surgery Devices (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
AT90910802T 1989-07-14 1990-07-12 Laserbearbeitungsverfahren ATE136131T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898916133A GB8916133D0 (en) 1989-07-14 1989-07-14 Laser machining

Publications (1)

Publication Number Publication Date
ATE136131T1 true ATE136131T1 (de) 1996-04-15

Family

ID=10660041

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90910802T ATE136131T1 (de) 1989-07-14 1990-07-12 Laserbearbeitungsverfahren

Country Status (8)

Country Link
US (1) US5296673A (de)
EP (1) EP0482051B1 (de)
JP (1) JPH04507479A (de)
AT (1) ATE136131T1 (de)
CA (1) CA2056358A1 (de)
DE (1) DE69026258T2 (de)
GB (1) GB8916133D0 (de)
WO (1) WO1991001514A1 (de)

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FR2694131B1 (fr) * 1992-07-21 1996-09-27 Balzers Hochvakuum Procede et installation pour la fabrication d'un composant, notamment d'un composant optique, et composant optique ainsi obtenu.
CH686461A5 (de) * 1992-07-21 1996-03-29 Balzers Hochvakuum Verfahren zur Herstellung eines Bauelementes, optisches Bauelement und Anlage zur Durchfuehrung des Verfahrens.
EP0702611A1 (de) * 1993-06-11 1996-03-27 BAUSCH & LOMB INCORPORATED Verfahren zur minimalisierung der bildung von diffraktionsrillen auf lasergeaetzten flaechen
AU7921894A (en) * 1993-09-30 1995-04-18 Cymer Laser Technologies Full field mask illumination enhancement methods and apparatus
DE69407620T2 (de) * 1993-12-17 1998-04-09 Minnesota Mining & Mfg Ablationsabbildung durch quasikontaktlithographie
US5571429A (en) * 1994-02-25 1996-11-05 Litel Instruments Apparatus and process for high speed laminate processing with computer generated holograms
JP3209641B2 (ja) * 1994-06-02 2001-09-17 三菱電機株式会社 光加工装置及び方法
GB9503230D0 (en) * 1995-02-18 1995-04-05 Bank Of England Manufacture of printing plates by photo-ablation
US5585019A (en) * 1995-03-10 1996-12-17 Lumonics Inc. Laser machining of a workpiece through adjacent mask by optical elements creating parallel beams
DE69637994D1 (de) 1995-04-26 2009-09-24 Minnesota Mining & Mfg Ablationsverfahren durch laser-darstellung
DE19520187C1 (de) * 1995-06-01 1996-09-12 Microlas Lasersystem Gmbh Optik zum Herstellen einer scharfen Beleuchtungslinie aus einem Laserstrahl
US5855835A (en) * 1996-09-13 1999-01-05 Hewlett Packard Co Method and apparatus for laser ablating a nozzle member
DE19706846A1 (de) * 1997-02-21 1998-09-03 Bodenseewerk Geraetetech Vorrichtung zur lichtinitiierten chemischen Vernetzung von Material
CA2366732C (en) * 1999-03-25 2008-11-18 Alphahelix Ab Homogenising of small-volume mixtures by centrifugation and heating
DE19918008A1 (de) 1999-04-21 2000-10-26 Claussen Claus Frenz Verfahren und Vorrichtung zur Ermittlung des Halsbewegungsmusters
KR100691924B1 (ko) * 1999-04-27 2007-03-09 지에스아이 루모닉스 인코퍼레이티드 재료 가공 장치 및 방법
DE19919009B4 (de) * 1999-04-27 2005-03-03 Institut für Oberflächenmodifizierung e.V. Maske und deren Anwendung in der Laserablation
US6313434B1 (en) 1999-05-27 2001-11-06 International Business Machines Corporation Method for creation of inclined microstructures using a scanned laser image
US6574024B1 (en) 2000-03-31 2003-06-03 Matsushita Electric Industrial Co., Ltd. Laser beam homogenization by scanning a beam onto a mask
US6433303B1 (en) * 2000-03-31 2002-08-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus using laser pulses to make an array of microcavity holes
US6623103B2 (en) 2001-04-10 2003-09-23 Lexmark International, Inc. Laser ablation method for uniform nozzle structure
US7194803B2 (en) * 2001-07-05 2007-03-27 Flowserve Management Company Seal ring and method of forming micro-topography ring surfaces with a laser
US6617542B2 (en) 2001-07-24 2003-09-09 Hutchinson Technology, Inc. Method of laser polishing surfaces on a head suspension assembly
US6577448B2 (en) 2001-09-25 2003-06-10 Siemens Dematic Electronic Assembly Systems, Inc. Laser system by modulation of power and energy
US6951627B2 (en) * 2002-04-26 2005-10-04 Matsushita Electric Industrial Co., Ltd. Method of drilling holes with precision laser micromachining
US7880117B2 (en) * 2002-12-24 2011-02-01 Panasonic Corporation Method and apparatus of drilling high density submicron cavities using parallel laser beams
GB2404453A (en) * 2003-07-30 2005-02-02 Simon Alexander Telfer Retro reflective video marker
US7303636B1 (en) 2003-10-16 2007-12-04 Hutchinson Technology Incorporated Method of laser cleaning surfaces on a head suspension
DE102004009212B4 (de) * 2004-02-25 2015-08-20 Carl Zeiss Meditec Ag Kontaktelement für Laserbearbeitung und Laserbearbeitungsvorrichtung
US20060097430A1 (en) * 2004-11-05 2006-05-11 Li Xiaochun UV pulsed laser machining apparatus and method
US20060186098A1 (en) * 2005-02-23 2006-08-24 Caristan Charles L Method and apparatus for laser processing
GB2438600B (en) * 2006-05-19 2008-07-09 Exitech Ltd Method for patterning thin films on moving substrates
US7549211B1 (en) 2006-06-30 2009-06-23 Hutchinson Technology Incorporated Method for de-tabbing a disk drive head suspension flexure
ES2637550T3 (es) 2009-07-07 2017-10-13 Neckcare Llc Procedimiento para valoración precisa y entrenamiento graduado de funciones sensitivomotrices
US10154923B2 (en) 2010-07-15 2018-12-18 Eyenovia, Inc. Drop generating device
CN103033525B (zh) * 2011-09-30 2016-03-02 清华大学 Ct系统和ct图像重建方法
US20130172830A1 (en) 2011-12-12 2013-07-04 Corinthian Ophthalmic, Inc. Ejector mechanism, ejector device, and methods of use
JP6329130B2 (ja) 2012-04-10 2018-05-30 アイノビア，インコーポレイティド 噴霧エジェクタ機構、電荷分離及び制御可能な液滴電荷を提供する装置、並びに低投与量の点眼
EP2838669B1 (de) 2012-04-20 2018-01-03 Eyenovia, Inc. Sprühausstossvorrichtung und verwendungsmethode
EA201492094A1 (ru) 2012-05-15 2015-04-30 Айновиа, Инк. Эжекторные устройства, способы, возбудители и схемы для них
WO2013190444A2 (en) * 2012-06-18 2013-12-27 Indian Institute Of Technology Kanpur Systems and methods for dry processing fabrication of binary masks with arbitrary shapes for ultra-violet laser micromachining
JP7227163B2 (ja) 2017-06-10 2023-02-21 アイノビア，インコーポレイティド 流体を取扱い、目に流体を送出するための方法および装置
JP7303053B2 (ja) * 2019-07-17 2023-07-04 ファナック株式会社 調整補助具及びレーザ溶接装置
WO2021119513A1 (en) 2019-12-11 2021-06-17 Eyenovia, Inc. Systems and devices for delivering fluids to the eye and methods of use

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4508749A (en) * 1983-12-27 1985-04-02 International Business Machines Corporation Patterning of polyimide films with ultraviolet light
DE3786939T2 (de) * 1986-04-02 1994-03-17 Dainippon Screen Mfg Laseraufzeichnungsvorrichtung.
DE3632640A1 (de) * 1986-09-25 1988-06-01 Agfa Gevaert Ag Verfahren zur herstellung eines spritzgiesswerkzeugs
US4907341A (en) * 1987-02-27 1990-03-13 John Fluke Mfg. Co., Inc. Compound resistor manufacturing method
US5095190A (en) * 1987-03-03 1992-03-10 Canon Kabushiki Kaisha Exposure apparatus
US4780177A (en) * 1988-02-05 1988-10-25 General Electric Company Excimer laser patterning of a novel resist

Also Published As

Publication number Publication date
JPH04507479A (ja) 1992-12-24
EP0482051B1 (de) 1996-03-27
GB8916133D0 (en) 1989-08-31
US5296673A (en) 1994-03-22
EP0482051A1 (de) 1992-04-29
DE69026258T2 (de) 1996-11-28
CA2056358A1 (en) 1991-01-15
WO1991001514A1 (en) 1991-02-07
DE69026258D1 (de) 1996-05-02

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Legal Events

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