DE69026258D1 - Laserbearbeitungsverfahren - Google Patents

Laserbearbeitungsverfahren

Info

Publication number
DE69026258D1
DE69026258D1 DE69026258T DE69026258T DE69026258D1 DE 69026258 D1 DE69026258 D1 DE 69026258D1 DE 69026258 T DE69026258 T DE 69026258T DE 69026258 T DE69026258 T DE 69026258T DE 69026258 D1 DE69026258 D1 DE 69026258D1
Authority
DE
Germany
Prior art keywords
target
pct
sec
lens system
ablated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69026258T
Other languages
English (en)
Other versions
DE69026258T2 (de
Inventor
Nicholas Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raychem Ltd
Original Assignee
Raychem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem Ltd filed Critical Raychem Ltd
Publication of DE69026258D1 publication Critical patent/DE69026258D1/de
Application granted granted Critical
Publication of DE69026258T2 publication Critical patent/DE69026258T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24Ablative recording, e.g. by burning marks; Spark recording
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Public Health (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Laser Surgery Devices (AREA)
DE69026258T 1989-07-14 1990-07-12 Laserbearbeitungsverfahren Expired - Lifetime DE69026258T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB898916133A GB8916133D0 (en) 1989-07-14 1989-07-14 Laser machining
PCT/GB1990/001071 WO1991001514A1 (en) 1989-07-14 1990-07-12 Laser machining

Publications (2)

Publication Number Publication Date
DE69026258D1 true DE69026258D1 (de) 1996-05-02
DE69026258T2 DE69026258T2 (de) 1996-11-28

Family

ID=10660041

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69026258T Expired - Lifetime DE69026258T2 (de) 1989-07-14 1990-07-12 Laserbearbeitungsverfahren

Country Status (8)

Country Link
US (1) US5296673A (de)
EP (1) EP0482051B1 (de)
JP (1) JPH04507479A (de)
AT (1) ATE136131T1 (de)
CA (1) CA2056358A1 (de)
DE (1) DE69026258T2 (de)
GB (1) GB8916133D0 (de)
WO (1) WO1991001514A1 (de)

Families Citing this family (43)

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FR2694131B1 (fr) * 1992-07-21 1996-09-27 Balzers Hochvakuum Procede et installation pour la fabrication d'un composant, notamment d'un composant optique, et composant optique ainsi obtenu.
CH686461A5 (de) * 1992-07-21 1996-03-29 Balzers Hochvakuum Verfahren zur Herstellung eines Bauelementes, optisches Bauelement und Anlage zur Durchfuehrung des Verfahrens.
WO1994029071A1 (en) * 1993-06-11 1994-12-22 Bausch & Lomb Incorporated Method of minimizing diffraction groove formation on laser etched surfaces
US5601733A (en) * 1993-09-30 1997-02-11 Cymer, Inc. Full field mask illumination enhancement methods and apparatus
KR960706405A (ko) * 1993-12-17 1996-12-09 테릴 켄트 퀼리 근접 석판인쇄에 의한 융식성 결상법(ablative imaging by proximity lithography)
US5571429A (en) * 1994-02-25 1996-11-05 Litel Instruments Apparatus and process for high speed laminate processing with computer generated holograms
JP3209641B2 (ja) * 1994-06-02 2001-09-17 三菱電機株式会社 光加工装置及び方法
GB9503230D0 (en) * 1995-02-18 1995-04-05 Bank Of England Manufacture of printing plates by photo-ablation
US5585019A (en) * 1995-03-10 1996-12-17 Lumonics Inc. Laser machining of a workpiece through adjacent mask by optical elements creating parallel beams
EP0822881B1 (de) * 1995-04-26 2009-08-12 Minnesota Mining And Manufacturing Company Ablationsverfahren durch laser-darstellung
DE19520187C1 (de) * 1995-06-01 1996-09-12 Microlas Lasersystem Gmbh Optik zum Herstellen einer scharfen Beleuchtungslinie aus einem Laserstrahl
US5855835A (en) * 1996-09-13 1999-01-05 Hewlett Packard Co Method and apparatus for laser ablating a nozzle member
DE19706846A1 (de) * 1997-02-21 1998-09-03 Bodenseewerk Geraetetech Vorrichtung zur lichtinitiierten chemischen Vernetzung von Material
ES2346128T3 (es) * 1999-03-25 2010-10-11 Alphahelix Molecular Diagnostics Ab Homogenizacion de mezclas de pequeño volumen mediante centrifugacion y calentamiento.
DE19918008A1 (de) 1999-04-21 2000-10-26 Claussen Claus Frenz Verfahren und Vorrichtung zur Ermittlung des Halsbewegungsmusters
DE19919009B4 (de) * 1999-04-27 2005-03-03 Institut für Oberflächenmodifizierung e.V. Maske und deren Anwendung in der Laserablation
CA2370832A1 (en) * 1999-04-27 2000-11-02 Gsi Lumonics Inc. A system and method for material processing using multiple laser beams
US6313434B1 (en) 1999-05-27 2001-11-06 International Business Machines Corporation Method for creation of inclined microstructures using a scanned laser image
US6433303B1 (en) * 2000-03-31 2002-08-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus using laser pulses to make an array of microcavity holes
US6574024B1 (en) 2000-03-31 2003-06-03 Matsushita Electric Industrial Co., Ltd. Laser beam homogenization by scanning a beam onto a mask
US6623103B2 (en) 2001-04-10 2003-09-23 Lexmark International, Inc. Laser ablation method for uniform nozzle structure
US7194803B2 (en) * 2001-07-05 2007-03-27 Flowserve Management Company Seal ring and method of forming micro-topography ring surfaces with a laser
US6617542B2 (en) 2001-07-24 2003-09-09 Hutchinson Technology, Inc. Method of laser polishing surfaces on a head suspension assembly
US6577448B2 (en) 2001-09-25 2003-06-10 Siemens Dematic Electronic Assembly Systems, Inc. Laser system by modulation of power and energy
US6951627B2 (en) * 2002-04-26 2005-10-04 Matsushita Electric Industrial Co., Ltd. Method of drilling holes with precision laser micromachining
US7880117B2 (en) * 2002-12-24 2011-02-01 Panasonic Corporation Method and apparatus of drilling high density submicron cavities using parallel laser beams
GB2404453A (en) * 2003-07-30 2005-02-02 Simon Alexander Telfer Retro reflective video marker
US7303636B1 (en) 2003-10-16 2007-12-04 Hutchinson Technology Incorporated Method of laser cleaning surfaces on a head suspension
DE102004009212B4 (de) * 2004-02-25 2015-08-20 Carl Zeiss Meditec Ag Kontaktelement für Laserbearbeitung und Laserbearbeitungsvorrichtung
US20060097430A1 (en) * 2004-11-05 2006-05-11 Li Xiaochun UV pulsed laser machining apparatus and method
US20060186098A1 (en) * 2005-02-23 2006-08-24 Caristan Charles L Method and apparatus for laser processing
GB2438600B (en) * 2006-05-19 2008-07-09 Exitech Ltd Method for patterning thin films on moving substrates
US7549211B1 (en) 2006-06-30 2009-06-23 Hutchinson Technology Incorporated Method for de-tabbing a disk drive head suspension flexure
EP2451352B8 (de) 2009-07-07 2017-08-02 NackCare LLC Verfahren für die genaue beurteilung und das stufenweise training von sensorimotorischen funktionen
US10154923B2 (en) 2010-07-15 2018-12-18 Eyenovia, Inc. Drop generating device
CN103033525B (zh) * 2011-09-30 2016-03-02 清华大学 Ct系统和ct图像重建方法
WO2013090459A1 (en) 2011-12-12 2013-06-20 Corinthian Ophthalmic, Inc. Ejector mechanism, ejector device, and methods of use
AU2013245946A1 (en) 2012-04-10 2014-11-27 Eyenovia, Inc. Spray ejector mechanisms and devices providing charge isolation and controllable droplet charge, and low dosage volume opthalmic administration
CN104755180B (zh) 2012-04-20 2018-09-21 艾诺维亚股份有限公司 用于向表面上喷射流体的喷射装置
IN2014DN10575A (de) 2012-05-15 2015-08-28 Corinthian Ophthalmic Inc
WO2013190444A2 (en) * 2012-06-18 2013-12-27 Indian Institute Of Technology Kanpur Systems and methods for dry processing fabrication of binary masks with arbitrary shapes for ultra-violet laser micromachining
CN115300226A (zh) 2017-06-10 2022-11-08 艾诺维亚股份有限公司 用于将一体积的流体输送到眼睛的设备
JP7303053B2 (ja) * 2019-07-17 2023-07-04 ファナック株式会社 調整補助具及びレーザ溶接装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4508749A (en) * 1983-12-27 1985-04-02 International Business Machines Corporation Patterning of polyimide films with ultraviolet light
DE3786939T2 (de) * 1986-04-02 1994-03-17 Dainippon Screen Mfg Laseraufzeichnungsvorrichtung.
DE3632640A1 (de) * 1986-09-25 1988-06-01 Agfa Gevaert Ag Verfahren zur herstellung eines spritzgiesswerkzeugs
US4907341A (en) * 1987-02-27 1990-03-13 John Fluke Mfg. Co., Inc. Compound resistor manufacturing method
US5095190A (en) * 1987-03-03 1992-03-10 Canon Kabushiki Kaisha Exposure apparatus
US4780177A (en) * 1988-02-05 1988-10-25 General Electric Company Excimer laser patterning of a novel resist

Also Published As

Publication number Publication date
ATE136131T1 (de) 1996-04-15
GB8916133D0 (en) 1989-08-31
CA2056358A1 (en) 1991-01-15
EP0482051B1 (de) 1996-03-27
DE69026258T2 (de) 1996-11-28
WO1991001514A1 (en) 1991-02-07
JPH04507479A (ja) 1992-12-24
EP0482051A1 (de) 1992-04-29
US5296673A (en) 1994-03-22

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Legal Events

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8364 No opposition during term of opposition
8330 Complete renunciation