ATE103131T1 - Anordnung von elektronischen leistungsbauelementen. - Google Patents

Anordnung von elektronischen leistungsbauelementen.

Info

Publication number
ATE103131T1
ATE103131T1 AT90119250T AT90119250T ATE103131T1 AT E103131 T1 ATE103131 T1 AT E103131T1 AT 90119250 T AT90119250 T AT 90119250T AT 90119250 T AT90119250 T AT 90119250T AT E103131 T1 ATE103131 T1 AT E103131T1
Authority
AT
Austria
Prior art keywords
electronic power
arrangement
power components
constituted
low level
Prior art date
Application number
AT90119250T
Other languages
English (en)
Inventor
Jacques Chave
Original Assignee
Alsthom Gec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alsthom Gec filed Critical Alsthom Gec
Application granted granted Critical
Publication of ATE103131T1 publication Critical patent/ATE103131T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
AT90119250T 1989-10-11 1990-10-08 Anordnung von elektronischen leistungsbauelementen. ATE103131T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8913278A FR2652982B1 (fr) 1989-10-11 1989-10-11 Assemblage de composants en electronique de puissance.
EP90119250A EP0425841B1 (de) 1989-10-11 1990-10-08 Anordnung von elektronischen Leistungsbauelementen

Publications (1)

Publication Number Publication Date
ATE103131T1 true ATE103131T1 (de) 1994-04-15

Family

ID=9386285

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90119250T ATE103131T1 (de) 1989-10-11 1990-10-08 Anordnung von elektronischen leistungsbauelementen.

Country Status (7)

Country Link
US (1) US5057970A (de)
EP (1) EP0425841B1 (de)
JP (1) JPH03150892A (de)
AT (1) ATE103131T1 (de)
DE (1) DE69007419T2 (de)
ES (1) ES2050905T3 (de)
FR (1) FR2652982B1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5233500A (en) * 1992-06-01 1993-08-03 Conductus, Inc. Package for cascaded microwave devices
JP2854757B2 (ja) * 1992-06-17 1999-02-03 三菱電機株式会社 半導体パワーモジュール
DE69322980T2 (de) * 1992-11-18 1999-06-02 Fuji Electric Co Ltd Halbleiter-Umwandlungsvorrichtung
DE19522126C2 (de) * 1995-06-19 1999-01-28 Hella Kg Hueck & Co Elektronischer Lastschalter für ein Kraftfahrzeug, beispielsweise Blinkgeber
DE102009029476B4 (de) 2009-09-15 2012-11-08 Lisa Dräxlmaier GmbH Elektronische Vorrichtung zum Schalten von Strömen und Herstellungsverfahren für dieselbe

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3710193A (en) * 1971-03-04 1973-01-09 Lambda Electronics Corp Hybrid regulated power supply having individual heat sinks for heat generative and heat sensitive components
DE3420535C2 (de) * 1984-06-01 1986-04-30 Anton Piller GmbH & Co KG, 3360 Osterode Halbleiter-Modul für eine schnelle Schaltanordnung
DE3630830A1 (de) * 1986-09-10 1988-03-17 Bregenhorn Buetow & Co Regelgeraet zum steuern von motorischen antrieben
JPH01233795A (ja) * 1988-03-15 1989-09-19 Mitsubishi Electric Corp 混成集績回路
DE8811949U1 (de) * 1988-09-21 1988-12-01 Standard Elektrik Lorenz Ag, 7000 Stuttgart, De

Also Published As

Publication number Publication date
US5057970A (en) 1991-10-15
DE69007419T2 (de) 1994-06-30
FR2652982B1 (fr) 1993-04-30
FR2652982A1 (fr) 1991-04-12
JPH03150892A (ja) 1991-06-27
ES2050905T3 (es) 1994-06-01
EP0425841A1 (de) 1991-05-08
EP0425841B1 (de) 1994-03-16
DE69007419D1 (de) 1994-04-21

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee