AT520099A3 - Düsenspitzenadapter, Düsenanordnung sowie Düse - Google Patents

Düsenspitzenadapter, Düsenanordnung sowie Düse Download PDF

Info

Publication number
AT520099A3
AT520099A3 ATA50494/2018A AT504942018A AT520099A3 AT 520099 A3 AT520099 A3 AT 520099A3 AT 504942018 A AT504942018 A AT 504942018A AT 520099 A3 AT520099 A3 AT 520099A3
Authority
AT
Austria
Prior art keywords
nozzle
nozzle tip
channel
assembly
protruding portion
Prior art date
Application number
ATA50494/2018A
Other languages
English (en)
Other versions
AT520099B1 (de
AT520099A2 (de
Original Assignee
Suss Microtec Lithography Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Lithography Gmbh filed Critical Suss Microtec Lithography Gmbh
Publication of AT520099A2 publication Critical patent/AT520099A2/de
Publication of AT520099A3 publication Critical patent/AT520099A3/de
Application granted granted Critical
Publication of AT520099B1 publication Critical patent/AT520099B1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/28—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with integral means for shielding the discharged liquid or other fluent material, e.g. to limit area of spray; with integral means for catching drips or collecting surplus liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B05B1/3033—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0278—Arrangement or mounting of spray heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/60—Arrangements for mounting, supporting or holding spraying apparatus
    • B05B15/62—Arrangements for supporting spraying apparatus, e.g. suction cups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/60—Arrangements for mounting, supporting or holding spraying apparatus
    • B05B15/65—Mounting arrangements for fluid connection of the spraying apparatus or its outlets to flow conduits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C17/00—Hand tools or apparatus using hand held tools, for applying liquids or other fluent materials to, for spreading applied liquids or other fluent materials on, or for partially removing applied liquids or other fluent materials from, surfaces
    • B05C17/005—Hand tools or apparatus using hand held tools, for applying liquids or other fluent materials to, for spreading applied liquids or other fluent materials on, or for partially removing applied liquids or other fluent materials from, surfaces for discharging material from a reservoir or container located in or on the hand tool through an outlet orifice by pressure without using surface contacting members like pads or brushes
    • B05C17/01—Hand tools or apparatus using hand held tools, for applying liquids or other fluent materials to, for spreading applied liquids or other fluent materials on, or for partially removing applied liquids or other fluent materials from, surfaces for discharging material from a reservoir or container located in or on the hand tool through an outlet orifice by pressure without using surface contacting members like pads or brushes with manually mechanically or electrically actuated piston or the like
    • B05C17/014—Hand tools or apparatus using hand held tools, for applying liquids or other fluent materials to, for spreading applied liquids or other fluent materials on, or for partially removing applied liquids or other fluent materials from, surfaces for discharging material from a reservoir or container located in or on the hand tool through an outlet orifice by pressure without using surface contacting members like pads or brushes with manually mechanically or electrically actuated piston or the like comprising means for preventing oozing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nozzles (AREA)
  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Ein Düsenspitzenadapter (12) hat einen Saugkanal (34), einen Zufuhrkanal (36) und einen Grundkörper (16) mit einem Vorrichtungs-Ende (18) und einem Substrat-Ende (20). Der Grundkörper (16) hat eine Düsenspitzenaussparung (26) an seinem Substrat-Ende (20) zum Aufnehmen einer Düsenspitze (14) und einen vorstehenden Abschnitt (30), der sich in die Düsenspitzenaussparung (26) erstreckt, wobei sich der Saugkanal (34) durch den vorstehenden Abschnitt (30) erstreckt und der Zufuhrkanal (36) in die Düsenspitzenaussparung (26) hinein öffnet, wobei der Saugkanal (34) mindestens teilweise von dem Zufuhrkanal (36) umgeben ist, und wobei der Grundkörper (16) und der vorstehende Abschnitt (30) unbeweglich aneinander befestigt sind. Des Weiteren sind eine Düsenanordnung (10) und eine Düse (60) gezeigt.
ATA50494/2018A 2017-06-20 2018-06-20 Düsenspitzenadapter, Düsenanordnung sowie Düse AT520099B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2019096A NL2019096B1 (en) 2017-06-20 2017-06-20 Nozzle tip adapter, nozzle assembly as well as nozzle

Publications (3)

Publication Number Publication Date
AT520099A2 AT520099A2 (de) 2019-01-15
AT520099A3 true AT520099A3 (de) 2023-04-15
AT520099B1 AT520099B1 (de) 2023-07-15

Family

ID=60294347

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50494/2018A AT520099B1 (de) 2017-06-20 2018-06-20 Düsenspitzenadapter, Düsenanordnung sowie Düse

Country Status (9)

Country Link
US (1) US10953415B2 (de)
JP (1) JP7209479B2 (de)
KR (1) KR102506232B1 (de)
CN (1) CN109092592B (de)
AT (1) AT520099B1 (de)
DE (1) DE102018114763A1 (de)
NL (1) NL2019096B1 (de)
SG (1) SG10201805196XA (de)
TW (1) TWI754758B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7297591B2 (ja) * 2019-08-09 2023-06-26 東京エレクトロン株式会社 基板処理装置およびその製造方法
JP2023041334A (ja) * 2021-09-13 2023-03-24 株式会社Subaru ファスナ塗装システム及びファスナ塗装方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0139211A2 (de) * 1983-09-12 1985-05-02 Fuji Photo Film Co., Ltd. Saugdüse
JPH0644703U (ja) * 1992-11-26 1994-06-14 株式会社資生堂 液垂れ防止用充填ノズル
US5756155A (en) * 1996-01-22 1998-05-26 Taiwan Semiconductor Manufacturing Company, Ltd. Combination nozzle and vacuum hood that is self cleaning
AT407385B (de) * 1997-09-18 2001-02-26 Sez Semiconduct Equip Zubehoer Anordnung um das nachtropfen von flüssigkeiten aus leitungen zu verhindern
EP1319446A2 (de) * 2001-12-13 2003-06-18 Dow Global Technologies Inc. Saugdüse
US20090226624A1 (en) * 2006-05-16 2009-09-10 Kabushiki Kaisha Toshiba Substrate processing apparatus and method
WO2013117633A1 (en) * 2012-02-07 2013-08-15 Suss Microtec Lithography Gmbh A method for non-drip dispensing of a liquid and a nozzle therefore

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2134709A (en) * 1937-10-22 1938-11-01 Frank L Drew Nondrip nozzle
US4516702A (en) * 1982-12-06 1985-05-14 Copar Corporation Dripless valve
US4606382A (en) * 1984-03-12 1986-08-19 Figgie International Inc. Nozzle assembly for a filling apparatus
US4917348A (en) * 1988-11-14 1990-04-17 Oden Corporation Filling nozzle cut-off valve
EP0564762B1 (de) 1992-04-08 1997-07-23 Hewlett-Packard Company Plattengerät mit verbesserter Wandleraufhängungsvorrichtung
JPH0631207A (ja) * 1992-07-22 1994-02-08 Ebara Corp 洗浄用ノズル
US5392989A (en) * 1993-01-13 1995-02-28 Semiconductor Systems, Inc. Nozzle assembly for dispensing liquid
JP2775236B2 (ja) * 1995-01-30 1998-07-16 富士写真フイルム株式会社 連続走行するウエブの塗布層縁部の吸引処理を行う吸引ノズル
JPH09992A (ja) * 1995-06-20 1997-01-07 Kyoritsu Gokin Seisakusho:Kk 液体噴出ノズル
JP3612158B2 (ja) * 1996-11-18 2005-01-19 スピードファム株式会社 プラズマエッチング方法及びその装置
KR100252224B1 (ko) * 1997-09-26 2000-06-01 윤종용 반도체장치 제조설비의 포토레지스트 셕크백장치
US7588311B2 (en) * 2003-03-24 2009-09-15 Canon Kabushiki Kaisha Discharging apparatus and removing method
DE60331520D1 (de) * 2003-03-24 2010-04-15 Nestec Sa Vorrichtung zum Pumpen einer Flüssigkeit von einer Verpackung oder von einem Container
JP2004359340A (ja) * 2003-06-06 2004-12-24 Kuroisutaa Chemicals:Kk 液体充填ノズルおよび充填方法
CN200985630Y (zh) 2006-12-23 2007-12-05 汪祥峰 防滴落涂料滚筒
JP5147445B2 (ja) * 2007-09-28 2013-02-20 株式会社スギノマシン 噴流液柱内に導かれたレーザー光によるレーザー加工装置
JP2010149036A (ja) * 2008-12-25 2010-07-08 Mitsubishi Electric Corp 樹脂材料吐出ノズルおよび樹脂コーティング装置
JPWO2011037174A1 (ja) 2009-09-24 2013-02-21 千寿製薬株式会社 薬液容器用ノズル
CA2792080C (en) 2010-03-09 2018-06-19 Woods Dispensing Systems, Llc Dispenser device and container
EP2552594A4 (de) * 2010-04-02 2016-06-29 Sta Rite Ind Llc Luftabsaugvorrichtung
ITMI20101063A1 (it) * 2010-06-11 2011-12-12 Weightpack S P A Rubinetto antisgocciolamento in macchina riempitrice particolarmente per liquido viscoso.
JP2013115232A (ja) * 2011-11-29 2013-06-10 Nippon Dempa Kogyo Co Ltd レジスト塗布装置およびそれに具備される吐出ノズル
AU2013207109B2 (en) * 2012-01-04 2017-10-26 Rieke Corporation Dispensers
CN202953804U (zh) 2012-11-28 2013-05-29 日立造船株式会社 液体填充装置
US9061302B1 (en) 2014-03-19 2015-06-23 Arganius E. Peckels Liquid pourer device with venturi effect
US9458002B2 (en) 2014-04-11 2016-10-04 Suss Microtec Lithography Gmbh Bottle supply system and bottle cap adapter
US9446422B2 (en) * 2015-02-10 2016-09-20 Nordson Corporation Adhesive dispensing module and method of spraying a plurality of droplets of a liquid adhesive
NL2014598B1 (en) 2015-04-08 2017-01-20 Suss Microtec Lithography Gmbh Method for coating a substrate.
JP6416702B2 (ja) 2015-06-11 2018-10-31 株式会社共立合金製作所 ノズル抜出装置及び抜出方法
DE102015112322A1 (de) 2015-07-28 2017-02-02 Hoerbiger Antriebstechnik Holding Gmbh Verfahren zum Herstellen eines Synchronrings sowie Synchronring
CN106185762A (zh) 2016-07-12 2016-12-07 欧德机械成都有限公司 一种防止流体滴落的奶制品灌装出料结构

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0139211A2 (de) * 1983-09-12 1985-05-02 Fuji Photo Film Co., Ltd. Saugdüse
JPH0644703U (ja) * 1992-11-26 1994-06-14 株式会社資生堂 液垂れ防止用充填ノズル
US5756155A (en) * 1996-01-22 1998-05-26 Taiwan Semiconductor Manufacturing Company, Ltd. Combination nozzle and vacuum hood that is self cleaning
AT407385B (de) * 1997-09-18 2001-02-26 Sez Semiconduct Equip Zubehoer Anordnung um das nachtropfen von flüssigkeiten aus leitungen zu verhindern
EP1319446A2 (de) * 2001-12-13 2003-06-18 Dow Global Technologies Inc. Saugdüse
US20090226624A1 (en) * 2006-05-16 2009-09-10 Kabushiki Kaisha Toshiba Substrate processing apparatus and method
WO2013117633A1 (en) * 2012-02-07 2013-08-15 Suss Microtec Lithography Gmbh A method for non-drip dispensing of a liquid and a nozzle therefore

Also Published As

Publication number Publication date
AT520099B1 (de) 2023-07-15
TW201906048A (zh) 2019-02-01
KR20180138174A (ko) 2018-12-28
JP7209479B2 (ja) 2023-01-20
US10953415B2 (en) 2021-03-23
TWI754758B (zh) 2022-02-11
DE102018114763A1 (de) 2018-12-20
US20180361403A1 (en) 2018-12-20
SG10201805196XA (en) 2019-01-30
CN109092592B (zh) 2022-05-03
NL2019096B1 (en) 2018-12-27
CN109092592A (zh) 2018-12-28
KR102506232B1 (ko) 2023-03-06
JP2019030868A (ja) 2019-02-28
AT520099A2 (de) 2019-01-15

Similar Documents

Publication Publication Date Title
EP3306082A3 (de) Energiewandler mit thermoelastischer anordnung sowie heiz/kühlsystem
AT520099A3 (de) Düsenspitzenadapter, Düsenanordnung sowie Düse
UA121006C2 (uk) Знаряддя і пристрої для нанесення, що мають блок нанесення текучих середовищ із соплами для розміщення матеріалів, що вносяться, щодо сільськогосподарських рослин на сільськогосподарських полях
ATE459533T1 (de) Raumtransporter mit einer vorrichtung zum andocken an einen satelliten
EP2756791A3 (de) Endoskopische und/oder medizinische Vorrichtung mit Kühleinrichtung
SA517390369B1 (ar) وسيلة ترذيذ طيور مباشرة ذات فوهات رذاذ آلية تعمل بسرعة
EP4268973A3 (de) Zerstäubersystem mit einem silikon-düsenfeld
DE2129542A1 (de) Handstueck fuer zahnaerztliche Bohrmaschine
WO2015055821A4 (de) Zitzengummi und düse
EP2522800A3 (de) Schiebetüranordnung
EP3269888A3 (de) Kanalreinigungsfahrzeug
EP2722263A3 (de) Rangierantrieb mit Freigabeleitung
AT519920A3 (de) Befestigungsvorrichtung
EP2941096A3 (de) Beleuchtungsanordnung mit betriebsgerät zum bereitstellen eines geeigneten versorgungsstroms
AR106673A1 (es) Dispositivo para la inoculación de semillas
AT513055A3 (de) Spritzgieß-Zwischenplatte und Spritzgießmaschine mit einer solchen Spritzgieß-Zwischenplatte
EP2311571A3 (de) Elektrisch beheizbare Sprühdüse
AU2015230044A8 (en) Locking device for a wear part of a soil-working implement
AT520773A5 (de) Regner mit multifunktioneller Düse zum Einspannen von der Seite mit Düsenlagerclip und zugehörigem Werkzeug
CN204750940U (zh) 一种新型线缆扎带
AT518470A3 (de) Dichtelement für eine Rosette und Rosette mit einem solchen Dichtelement
DE202013008532U1 (de) Wasserpistole
EP2538510A3 (de) Gerätebecher für Unterflur-Elektroinstallationen
MX2017005826A (es) Tornillos de madera.
WO2016116092A3 (de) DENTALINSTRUMENT ZUR PRÄPARATION VON ZÄHNEN, INSBESONDERE ZAHNWURZELKANÄLEN, UND STIFT ZUM EINSATZ IN EIN VORGESEHENES BOHRLOCH, INSBESONDERE EIN MIT EINEM ERFINDUNGSGEMÄßEN DENTALINSTRUMENT ERZEUGTES BOHRLOCH