AT317300B - Halterung für Halbleiterelemente - Google Patents
Halterung für HalbleiterelementeInfo
- Publication number
- AT317300B AT317300B AT530870A AT530870A AT317300B AT 317300 B AT317300 B AT 317300B AT 530870 A AT530870 A AT 530870A AT 530870 A AT530870 A AT 530870A AT 317300 B AT317300 B AT 317300B
- Authority
- AT
- Austria
- Prior art keywords
- holder
- semiconductor elements
- semiconductor
- elements
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Insulating Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS416569 | 1969-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AT317300B true AT317300B (de) | 1974-08-26 |
Family
ID=5383762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT530870A AT317300B (de) | 1969-06-12 | 1970-06-12 | Halterung für Halbleiterelemente |
Country Status (2)
| Country | Link |
|---|---|
| AT (1) | AT317300B (de) |
| DE (1) | DE2029135C3 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3612813A1 (de) * | 1985-04-16 | 1986-10-23 | Mitsubishi Denki K.K., Tokio/Tokyo | Halbleiter-bauelement |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE623873A (de) * | 1961-10-24 | 1900-01-01 | ||
| DE1489791A1 (de) * | 1964-12-22 | 1969-06-12 | Ckd Praha Narodni Podnik | Halbleiterbauelement mit einer Flaechenhalbleiteranordnung zwischen durch Federdruck angepressten Elektrodenkontaktplatten |
-
1970
- 1970-06-12 AT AT530870A patent/AT317300B/de not_active IP Right Cessation
- 1970-06-12 DE DE19702029135 patent/DE2029135C3/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2029135C3 (de) | 1983-02-24 |
| DE2029135A1 (de) | 1971-11-25 |
| DE2029135B2 (de) | 1975-11-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ELA | Expired due to lapse of time |