AT261002B - Verfahren zum Behandeln der Oberfläche von Halbleiteranordnungen - Google Patents

Verfahren zum Behandeln der Oberfläche von Halbleiteranordnungen

Info

Publication number
AT261002B
AT261002B AT245866A AT245866A AT261002B AT 261002 B AT261002 B AT 261002B AT 245866 A AT245866 A AT 245866A AT 245866 A AT245866 A AT 245866A AT 261002 B AT261002 B AT 261002B
Authority
AT
Austria
Prior art keywords
treating
semiconductor devices
semiconductor
devices
Prior art date
Application number
AT245866A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of AT261002B publication Critical patent/AT261002B/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/02Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using non-aqueous solutions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/958Passivation layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Weting (AREA)
AT245866A 1965-03-16 1966-03-15 Verfahren zum Behandeln der Oberfläche von Halbleiteranordnungen AT261002B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES95977A DE1253366B (de) 1965-03-16 1965-03-16 Verfahren zum Behandeln der Oberflaeche von Halbleiteranordnungen

Publications (1)

Publication Number Publication Date
AT261002B true AT261002B (de) 1968-04-10

Family

ID=7519749

Family Applications (1)

Application Number Title Priority Date Filing Date
AT245866A AT261002B (de) 1965-03-16 1966-03-15 Verfahren zum Behandeln der Oberfläche von Halbleiteranordnungen

Country Status (7)

Country Link
US (1) US3392050A (de)
AT (1) AT261002B (de)
CH (1) CH481488A (de)
DE (1) DE1253366B (de)
GB (1) GB1076638A (de)
NL (1) NL6602159A (de)
SE (1) SE301016B (de)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2798189A (en) * 1953-04-16 1957-07-02 Sylvania Electric Prod Stabilized semiconductor devices
NL190814A (de) * 1957-08-07 1900-01-01
NL236678A (de) * 1958-03-04 1900-01-01
FR1354590A (fr) * 1962-04-25 1964-03-06 Siemens Ag Procédé de traitement superficiel des dispositifs à semi-conducteurs

Also Published As

Publication number Publication date
NL6602159A (de) 1966-09-19
SE301016B (de) 1968-05-20
GB1076638A (en) 1967-07-19
CH481488A (de) 1969-11-15
DE1253366B (de) 1967-11-02
US3392050A (en) 1968-07-09

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