AT256938B - Verfahren zur Herstellung einer Halbleitervorrichtung - Google Patents

Verfahren zur Herstellung einer Halbleitervorrichtung

Info

Publication number
AT256938B
AT256938B AT1052265A AT1052265A AT256938B AT 256938 B AT256938 B AT 256938B AT 1052265 A AT1052265 A AT 1052265A AT 1052265 A AT1052265 A AT 1052265A AT 256938 B AT256938 B AT 256938B
Authority
AT
Austria
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Application number
AT1052265A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of AT256938B publication Critical patent/AT256938B/de

Links

Classifications

    • H10P72/0444—
    • H10W72/015—
    • H10W72/0711—
    • H10W72/07502—
    • H10W72/07532—
    • H10W72/5366—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/932—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion
AT1052265A 1964-11-26 1965-11-23 Verfahren zur Herstellung einer Halbleitervorrichtung AT256938B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL646413724A NL142018B (nl) 1964-11-26 1964-11-26 Werkwijze tot het vervaardigen van een halfgeleidende inrichting en inrichting vervaardigd volgens de werkwijze.

Publications (1)

Publication Number Publication Date
AT256938B true AT256938B (de) 1967-09-11

Family

ID=19791511

Family Applications (1)

Application Number Title Priority Date Filing Date
AT1052265A AT256938B (de) 1964-11-26 1965-11-23 Verfahren zur Herstellung einer Halbleitervorrichtung

Country Status (8)

Country Link
US (1) US3376635A (de)
AT (1) AT256938B (de)
BE (1) BE672776A (de)
CH (1) CH444971A (de)
DE (1) DE1514285C3 (de)
FR (1) FR1454827A (de)
GB (1) GB1127439A (de)
NL (1) NL142018B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3438405A (en) * 1967-06-22 1969-04-15 Rca Corp Wire stringing machine
BE755950A (fr) * 1969-09-11 1971-03-09 Philips Nv Procede permettant d'etablir des liaisons electriques entre desemplacements de contact d'un corps semiconducteur et des conducteurs d'alimentation
US3628717A (en) * 1969-11-12 1971-12-21 Ibm Apparatus for positioning and bonding
NL7204573A (de) * 1972-04-06 1973-10-09
US3941298A (en) * 1972-10-26 1976-03-02 Esec Sales S.A. Process of making wire connections in semi-conductor elements
AU507497B2 (en) * 1975-06-26 1980-02-14 Kollmorgen Corp. Coupling continuous conductive filaments toan element
DE2528806C2 (de) * 1975-06-27 1983-09-15 Texas Instruments Deutschland Gmbh, 8050 Freising Schweißvorrichtung
CH592365A5 (de) * 1975-12-23 1977-10-31 Esec Sales Sa
US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
JPH08153759A (ja) * 1994-11-29 1996-06-11 Nec Yamagata Ltd シングルポイントボンダーおよび半導体装置の製造方法
US7240820B2 (en) * 2004-07-19 2007-07-10 Asm Technology Singapore Pte Ltd. Clamping device for processing electronic devices
JP5592554B1 (ja) 2013-12-18 2014-09-17 武延 本郷 冷間圧接装置、コイル製造装置、コイルおよびその製造方法
CN113067439B (zh) 2013-12-18 2024-07-30 株式会社阿斯特 线圈制造方法、线圈制造装置以及线圈

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2983987A (en) * 1958-06-30 1961-05-16 Western Electric Co Method of forming articles
US3087239A (en) * 1959-06-19 1963-04-30 Western Electric Co Methods of bonding leads to semiconductive devices
US3133459A (en) * 1960-11-08 1964-05-19 Texas Instruments Inc Apparatus for attaching leads to contacts
US3313464A (en) * 1963-11-07 1967-04-11 Western Electric Co Thermocompression bonding apparatus

Also Published As

Publication number Publication date
CH444971A (de) 1967-10-15
US3376635A (en) 1968-04-09
NL142018B (nl) 1974-04-16
FR1454827A (fr) 1966-10-07
GB1127439A (en) 1968-09-18
DE1514285A1 (de) 1969-08-14
DE1514285C3 (de) 1974-12-12
BE672776A (de) 1966-04-25
NL6413724A (de) 1966-05-27
DE1514285B2 (de) 1974-04-11

Similar Documents

Publication Publication Date Title
AT261004B (de) Verfahren zur Herstellung einer Halbleiteranordnung
AT280349B (de) Verfahren zur Herstellung einer Halbleitervorrichtung
CH513514A (de) Verfahren zur Herstellung einer Halbleitervorrichtung
CH519789A (de) Verfahren zur Herstellung einer Halbleitervorrichtung
AT280350B (de) Verfahren zur Herstellung einer Halbleitervorrichtung
AT318001B (de) Verfahren zur Herstellung einer integrierten Halbleitervorrichtung
CH533907A (de) Verfahren zur Herstellung einer Halbleiteranordnung
AT320737B (de) Halbleittervorrichtung und Verfahren zur Herstellung einer solchen Halbleitervorrichtung
CH449777A (de) Verfahren zur Herstellung einer Festkörperschaltung
AT322632B (de) Verfahren zur herstellung einer integrierten halbleitervorrichtung
CH512144A (de) Verfahren zur Herstellung einer Halbleiteranordnung
AT256938B (de) Verfahren zur Herstellung einer Halbleitervorrichtung
CH381329A (de) Verfahren zur Herstellung einer Halbleiteranordnung
AT299311B (de) Verfahren zur Herstellung einer Halbleitervorrichtung
CH403991A (de) Verfahren zur Herstellung einer Halbleitervorrichtung
CH391111A (de) Verfahren zur Herstellung einer Halbleiteranordnung
CH395349A (de) Verfahren zur Herstellung einer Halbleiteranordnung
CH423999A (de) Verfahren zur Herstellung einer Halbleiteranordnung
CH418466A (de) Verfahren zur Herstellung einer Halbleitervorrichtung
CH474856A (de) Verfahren zur Herstellung einer Halbleitervorrichtung
CH520405A (de) Verfahren zur Herstellung einer Halbleiteranordnung
AT299309B (de) Verfahren zur Herstellung einer Halbleitervorrichtung
AT261676B (de) Verfahren zur Herstellung eines Bodens für eine Hülle einer Halbleitervorrichtung
CH519790A (de) Verfahren zur Herstellung einer Halbleiteranordnung
CH474158A (de) Verfahren zur Herstellung einer Halbleitervorrichtung