NL6413724A - - Google Patents

Info

Publication number
NL6413724A
NL6413724A NL6413724A NL6413724A NL6413724A NL 6413724 A NL6413724 A NL 6413724A NL 6413724 A NL6413724 A NL 6413724A NL 6413724 A NL6413724 A NL 6413724A NL 6413724 A NL6413724 A NL 6413724A
Authority
NL
Netherlands
Application number
NL6413724A
Other versions
NL142018B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL646413724A priority Critical patent/NL142018B/xx
Priority to US506739A priority patent/US3376635A/en
Priority to AT1052265A priority patent/AT256938B/de
Priority to DE1514285A priority patent/DE1514285C3/de
Priority to GB49664/65A priority patent/GB1127439A/en
Priority to FR39554A priority patent/FR1454827A/fr
Priority to BE672776A priority patent/BE672776A/xx
Priority to CH1620565A priority patent/CH444971A/de
Publication of NL6413724A publication Critical patent/NL6413724A/xx
Publication of NL142018B publication Critical patent/NL142018B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85203—Thermocompression bonding
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion
NL646413724A 1964-11-26 1964-11-26 Werkwijze tot het vervaardigen van een halfgeleidende inrichting en inrichting vervaardigd volgens de werkwijze. NL142018B (nl)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL646413724A NL142018B (nl) 1964-11-26 1964-11-26 Werkwijze tot het vervaardigen van een halfgeleidende inrichting en inrichting vervaardigd volgens de werkwijze.
US506739A US3376635A (en) 1964-11-26 1965-11-08 Method of preparing electrodes for bonding to a semiconductive body
AT1052265A AT256938B (de) 1964-11-26 1965-11-23 Verfahren zur Herstellung einer Halbleitervorrichtung
DE1514285A DE1514285C3 (de) 1964-11-26 1965-11-23 Verfahren zur Herstellung einer Halbleitervorrichtung
GB49664/65A GB1127439A (en) 1964-11-26 1965-11-23 Improvements in and relating to methods of manufacturing semiconductor devices
FR39554A FR1454827A (fr) 1964-11-26 1965-11-24 Procédé pour la fabrication d'un dispositif semi-conducteur
BE672776A BE672776A (de) 1964-11-26 1965-11-24
CH1620565A CH444971A (de) 1964-11-26 1965-11-24 Verfahren zur Herstellung einer Halbleitervorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL646413724A NL142018B (nl) 1964-11-26 1964-11-26 Werkwijze tot het vervaardigen van een halfgeleidende inrichting en inrichting vervaardigd volgens de werkwijze.

Publications (2)

Publication Number Publication Date
NL6413724A true NL6413724A (de) 1966-05-27
NL142018B NL142018B (nl) 1974-04-16

Family

ID=19791511

Family Applications (1)

Application Number Title Priority Date Filing Date
NL646413724A NL142018B (nl) 1964-11-26 1964-11-26 Werkwijze tot het vervaardigen van een halfgeleidende inrichting en inrichting vervaardigd volgens de werkwijze.

Country Status (8)

Country Link
US (1) US3376635A (de)
AT (1) AT256938B (de)
BE (1) BE672776A (de)
CH (1) CH444971A (de)
DE (1) DE1514285C3 (de)
FR (1) FR1454827A (de)
GB (1) GB1127439A (de)
NL (1) NL142018B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3438405A (en) * 1967-06-22 1969-04-15 Rca Corp Wire stringing machine
BE755950A (fr) * 1969-09-11 1971-03-09 Philips Nv Procede permettant d'etablir des liaisons electriques entre desemplacements de contact d'un corps semiconducteur et des conducteurs d'alimentation
US3628717A (en) * 1969-11-12 1971-12-21 Ibm Apparatus for positioning and bonding
NL7204573A (de) * 1972-04-06 1973-10-09
US3941298A (en) * 1972-10-26 1976-03-02 Esec Sales S.A. Process of making wire connections in semi-conductor elements
AU507497B2 (en) * 1975-06-26 1980-02-14 Kollmorgen Corp. Coupling continuous conductive filaments toan element
DE2528806C2 (de) * 1975-06-27 1983-09-15 Texas Instruments Deutschland Gmbh, 8050 Freising Schweißvorrichtung
CH592365A5 (de) * 1975-12-23 1977-10-31 Esec Sales Sa
US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
JPH08153759A (ja) * 1994-11-29 1996-06-11 Nec Yamagata Ltd シングルポイントボンダーおよび半導体装置の製造方法
US7240820B2 (en) * 2004-07-19 2007-07-10 Asm Technology Singapore Pte Ltd. Clamping device for processing electronic devices
JP5592554B1 (ja) * 2013-12-18 2014-09-17 武延 本郷 冷間圧接装置、コイル製造装置、コイルおよびその製造方法
CN117543908A (zh) 2013-12-18 2024-02-09 株式会社阿斯特 线圈制造装置和线圈

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2983987A (en) * 1958-06-30 1961-05-16 Western Electric Co Method of forming articles
US3087239A (en) * 1959-06-19 1963-04-30 Western Electric Co Methods of bonding leads to semiconductive devices
US3133459A (en) * 1960-11-08 1964-05-19 Texas Instruments Inc Apparatus for attaching leads to contacts
US3313464A (en) * 1963-11-07 1967-04-11 Western Electric Co Thermocompression bonding apparatus

Also Published As

Publication number Publication date
US3376635A (en) 1968-04-09
NL142018B (nl) 1974-04-16
BE672776A (de) 1966-04-25
AT256938B (de) 1967-09-11
DE1514285C3 (de) 1974-12-12
GB1127439A (en) 1968-09-18
DE1514285B2 (de) 1974-04-11
CH444971A (de) 1967-10-15
FR1454827A (fr) 1966-10-07
DE1514285A1 (de) 1969-08-14

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V1 Lapsed because of non-payment of the annual fee
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Owner name: PHILIPS