AR219299A1 - Metodo de fabricacion de un encapsulado de circuito - Google Patents

Metodo de fabricacion de un encapsulado de circuito

Info

Publication number
AR219299A1
AR219299A1 AR269087A AR26908777A AR219299A1 AR 219299 A1 AR219299 A1 AR 219299A1 AR 269087 A AR269087 A AR 269087A AR 26908777 A AR26908777 A AR 26908777A AR 219299 A1 AR219299 A1 AR 219299A1
Authority
AR
Argentina
Prior art keywords
manufacturing
circuit capsule
capsule
circuit
Prior art date
Application number
AR269087A
Other languages
English (en)
Spanish (es)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of AR219299A1 publication Critical patent/AR219299A1/es

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/879—Bump connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
AR269087A 1976-09-03 1977-09-02 Metodo de fabricacion de un encapsulado de circuito AR219299A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/720,471 US4034469A (en) 1976-09-03 1976-09-03 Method of making conduction-cooled circuit package

Publications (1)

Publication Number Publication Date
AR219299A1 true AR219299A1 (es) 1980-08-15

Family

ID=24894127

Family Applications (1)

Application Number Title Priority Date Filing Date
AR269087A AR219299A1 (es) 1976-09-03 1977-09-02 Metodo de fabricacion de un encapsulado de circuito

Country Status (9)

Country Link
US (2) US4034469A (enExample)
JP (1) JPS5928989B2 (enExample)
AR (1) AR219299A1 (enExample)
BE (1) BE857399A (enExample)
CA (1) CA1093699A (enExample)
FR (1) FR2363892A1 (enExample)
GB (1) GB1569453A (enExample)
IT (1) IT1114116B (enExample)
SE (1) SE435126B (enExample)

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US4034469A (en) * 1976-09-03 1977-07-12 Ibm Corporation Method of making conduction-cooled circuit package
US4153988A (en) * 1977-07-15 1979-05-15 International Business Machines Corporation High performance integrated circuit semiconductor package and method of making
US4279292A (en) * 1978-09-29 1981-07-21 The United States Of America As Represented By The Secretary Of The Navy Charge coupled device temperature gradient and moisture regulator
US4253515A (en) * 1978-09-29 1981-03-03 United States Of America As Represented By The Secretary Of The Navy Integrated circuit temperature gradient and moisture regulator
JPS5591145A (en) * 1978-12-28 1980-07-10 Narumi China Corp Production of ceramic package
US4237086A (en) * 1979-02-22 1980-12-02 Rockwell International Corporation Method for releasably mounting a substrate on a base providing heat transfer and electrical conduction
DE2926785C2 (de) * 1979-07-03 1985-12-12 HIGRATHERM electric GmbH, 7100 Heilbronn Bipolarer Transistor und Verfahren zu seiner Herstellung
US4388967A (en) * 1980-09-02 1983-06-21 Thermalloy Incorporated Solderable mounting stakes for heat sinks
US4561011A (en) * 1982-10-05 1985-12-24 Mitsubishi Denki Kabushiki Kaisha Dimensionally stable semiconductor device
US4448240A (en) * 1982-12-20 1984-05-15 International Business Machines Corporation Telescoping thermal conduction element for cooling semiconductor devices
CA1235528A (en) * 1984-10-11 1988-04-19 Teradyne, Inc. Heat dissipation for electronic components on ceramic substrate
US5032897A (en) * 1990-02-28 1991-07-16 International Business Machines Corp. Integrated thermoelectric cooling
US5012325A (en) * 1990-04-24 1991-04-30 International Business Machines Corp. Thermoelectric cooling via electrical connections
JPH07109867B2 (ja) * 1991-04-15 1995-11-22 インターナショナル・ビジネス・マシーンズ・コーポレイション 半導体チツプの冷却構造
GB9218233D0 (en) * 1992-08-27 1992-10-14 Dsk Technology International L Cooling of electronics equipment
US5339216A (en) * 1993-03-02 1994-08-16 National Semiconductor Corporation Device and method for reducing thermal cycling in a semiconductor package
US5730636A (en) * 1995-09-29 1998-03-24 Micron Display Technology, Inc. Self-dimensioning support member for use in a field emission display
US5808874A (en) * 1996-05-02 1998-09-15 Tessera, Inc. Microelectronic connections with liquid conductive elements
US6016006A (en) * 1996-06-24 2000-01-18 Intel Corporation Thermal grease insertion and retention
SG71046A1 (en) 1996-10-10 2000-03-21 Connector Systems Tech Nv High density connector and method of manufacture
US5891753A (en) 1997-01-24 1999-04-06 Micron Technology, Inc. Method and apparatus for packaging flip chip bare die on printed circuit boards
US5796038A (en) * 1997-06-16 1998-08-18 Vlsi Technology, Inc. Technique to produce cavity-up HBGA packages
US5981310A (en) * 1998-01-22 1999-11-09 International Business Machines Corporation Multi-chip heat-sink cap assembly
US6117797A (en) 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
US6214647B1 (en) 1998-09-23 2001-04-10 International Business Machines Corporation Method for bonding heatsink to multiple-height chip
US5986887A (en) * 1998-10-28 1999-11-16 Unisys Corporation Stacked circuit board assembly adapted for heat dissipation
US6084775A (en) * 1998-12-09 2000-07-04 International Business Machines Corporation Heatsink and package structures with fusible release layer
US6461891B1 (en) * 1999-09-13 2002-10-08 Intel Corporation Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple
US6330157B1 (en) * 1999-12-21 2001-12-11 International Business Machines Corporation Variable thermal exchanger and method thereof
US6396700B1 (en) * 2000-06-29 2002-05-28 International Business Machines Corporation Thermal spreader and interface assembly for heat generating component of an electronic device
US6724078B1 (en) 2000-08-31 2004-04-20 Intel Corporation Electronic assembly comprising solderable thermal interface
US6586279B1 (en) * 2000-11-17 2003-07-01 Sun Microsystems, Inc. Method of integrating a heat spreader and a semiconductor, and package formed thereby
US6601753B2 (en) * 2001-05-17 2003-08-05 Visteon Global Technologies, Inc. Void-free die attachment method with low melting metal
US6504242B1 (en) 2001-11-15 2003-01-07 Intel Corporation Electronic assembly having a wetting layer on a thermally conductive heat spreader
US7436058B2 (en) * 2002-05-09 2008-10-14 Intel Corporation Reactive solder material
JP4241623B2 (ja) * 2003-02-24 2009-03-18 富士通株式会社 半導体装置および半導体装置の製造方法
US7132746B2 (en) * 2003-08-18 2006-11-07 Delphi Technologies, Inc. Electronic assembly with solder-bonded heat sink
US7133286B2 (en) * 2004-05-10 2006-11-07 International Business Machines Corporation Method and apparatus for sealing a liquid cooled electronic device
JP2007005670A (ja) * 2005-06-27 2007-01-11 Fujitsu Ltd 電子部品パッケージおよび接合組立体
US8733620B2 (en) * 2005-12-08 2014-05-27 Intel Corporation Solder deposition and thermal processing of thin-die thermal interface material
US7513035B2 (en) * 2006-06-07 2009-04-07 Advanced Micro Devices, Inc. Method of integrated circuit packaging
US20080124840A1 (en) * 2006-07-31 2008-05-29 Su Michael Z Electrical Insulating Layer for Metallic Thermal Interface Material
US7982307B2 (en) * 2006-11-22 2011-07-19 Agere Systems Inc. Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate
US7834442B2 (en) * 2007-12-12 2010-11-16 International Business Machines Corporation Electronic package method and structure with cure-melt hierarchy
JP5447175B2 (ja) 2010-05-17 2014-03-19 富士通セミコンダクター株式会社 半導体装置
US20120032350A1 (en) * 2010-08-06 2012-02-09 Conexant Systems, Inc. Systems and Methods for Heat Dissipation Using Thermal Conduits
US8647974B2 (en) 2011-03-25 2014-02-11 Ati Technologies Ulc Method of fabricating a semiconductor chip with supportive terminal pad
US9142520B2 (en) * 2011-08-30 2015-09-22 Ati Technologies Ulc Methods of fabricating semiconductor chip solder structures
US20130224510A1 (en) * 2012-02-29 2013-08-29 General Electric Company System including thermal interface material
JP2015522898A (ja) * 2012-04-11 2015-08-06 ヴァレリオ，テオドール 柔軟な変形可能プレートでインタリーブされるスタックされたフィン要素から形成されるヒートシンク
US9826662B2 (en) 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2776920A (en) * 1952-11-05 1957-01-08 Gen Electric Germanium-zinc alloy semi-conductors
US2903629A (en) * 1958-10-23 1959-09-08 Advanced Res Associates Inc Encapsulated semiconductor assembly
US3197839A (en) * 1959-12-11 1965-08-03 Gen Electric Method of fabricating semiconductor devices
US3267341A (en) * 1962-02-09 1966-08-16 Hughes Aircraft Co Double container arrangement for transistors
GB1030540A (en) * 1964-01-02 1966-05-25 Gen Electric Improvements in and relating to semi-conductor diodes
US3430335A (en) * 1965-06-08 1969-03-04 Hughes Aircraft Co Method of treating semiconductor devices or components
US3429040A (en) * 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate
US3414775A (en) * 1967-03-03 1968-12-03 Ibm Heat dissipating module assembly and method
US3504096A (en) * 1968-01-31 1970-03-31 Westinghouse Electric Corp Semiconductor device and method
CA892844A (en) * 1970-08-14 1972-02-08 Microsystems International Limited Semiconductor heat sink
US3741292A (en) * 1971-06-30 1973-06-26 Ibm Liquid encapsulated air cooled module
US3868725A (en) * 1971-10-14 1975-02-25 Philips Corp Integrated circuit lead structure
US3972062A (en) * 1973-10-04 1976-07-27 Motorola, Inc. Mounting assemblies for a plurality of transistor integrated circuit chips
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
US4034469A (en) * 1976-09-03 1977-07-12 Ibm Corporation Method of making conduction-cooled circuit package

Also Published As

Publication number Publication date
US4034469A (en) 1977-07-12
SE7709310L (sv) 1978-03-04
BE857399A (fr) 1977-12-01
SE435126B (sv) 1984-09-03
US4081825A (en) 1978-03-28
JPS5331968A (en) 1978-03-25
GB1569453A (en) 1980-06-18
IT1114116B (it) 1986-01-27
JPS5928989B2 (ja) 1984-07-17
CA1093699A (en) 1981-01-13
FR2363892B1 (enExample) 1979-03-02
FR2363892A1 (fr) 1978-03-31

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