KR20080015973A - Carmera module - Google Patents

Carmera module Download PDF

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Publication number
KR20080015973A
KR20080015973A KR1020060077419A KR20060077419A KR20080015973A KR 20080015973 A KR20080015973 A KR 20080015973A KR 1020060077419 A KR1020060077419 A KR 1020060077419A KR 20060077419 A KR20060077419 A KR 20060077419A KR 20080015973 A KR20080015973 A KR 20080015973A
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South Korea
Prior art keywords
unit
sensor
lens
lens unit
camera
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KR1020060077419A
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Korean (ko)
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KR101224819B1 (en
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우재근
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엘지이노텍 주식회사
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0226—Hinges

Abstract

A camera module is provided to divide a lens unit and a sensor unit in the camera module through a hinge connecting unit and connect the lens unit and the sensor unit only in the operation of a camera, thereby reducing height than an existing module and improving camera capabilities. A camera module(100) comprises a camera housing(30), plural lenses(106), a lens unit(10), an IR(Infrared Rays) filter(121), an image sensor(118), and a sensor unit(20), and a hinge connecting unit(112). The camera housing has a space portion in the inside. The plural lenses are installed in the mounting portion of the camera housing to receive the optical image of a subject. The lens unit includes a barrel(109) for assembling the lenses with the camera housing. The IR filter is configured to block IR incident from the lenses and seal the mounting portion. The image sensor picks up the optical image, in which the IR is blocked through the IR filter, to convert the image signal into an electric signal. The sensor unit includes a PCB(Printed Circuit Board)(115) for performing the digital processing of the image signal outputted from the image sensor. The hinge connecting unit connects the sensor unit and the lens unit so that the lens unit can be rotated on the basis of a side of the sensor unit.

Description

카메라 모듈 {Carmera Module}Camera Module {Carmera Module}

도 1은 본 발명의 카메라 모듈의 내부 결합구조를 나타낸 단면도이다.1 is a cross-sectional view showing the internal coupling structure of the camera module of the present invention.

도 2는 본 발명에 따른 카메라 모듈의 구성을 나타낸 분해 사시도 이다.2 is an exploded perspective view showing the configuration of a camera module according to the present invention.

<도면의 주요 부분에 관한 부호의 설명><Explanation of symbols on main parts of the drawings>

100 - 카메라 모듈 103 - 자석부100-Camera Module 103-Magnet

106 - 렌즈 109 - 바렐106-Lens 109-Barrel

112 - 힌지연결부 115 - 인쇄회로기판112-hinge connections 115-printed circuit boards

118 - 이미지 센서 121 - IR 필터118-Image Sensor 121-IR Filter

203 - 힌지너클 206 - 힌지203-Hinge Knuckles 206-Hinge

209 - 결합부 10 - 렌즈부209-coupling part 10-lens part

20 - 센서부 30 - 카메라 하우징20-sensor unit 30-camera housing

본 발명은 카메라 모듈에 관한 것이다.The present invention relates to a camera module.

통상 휴대폰과 같은 소형 제품에 이용되는 컴팩트 사이즈의 카메라 모듈은 IMT용 카메라 폰이나 PDA, 스마트 폰, 토이 카메라 등 그 용도가 매우 다양하여 최근 각광받고 있다.BACKGROUND ART Compact camera modules, which are generally used in small products such as mobile phones, have recently been in the spotlight due to their various uses such as camera phones for IMT, PDAs, smart phones, and toy cameras.

이러한 카메라 모듈은 CCD나 CMOS의 이미지 센서 칩을 이용하여 제조하며, 이미지 센서 칩에 렌즈를 통하여 사물을 집광시킴으로써 PC 모니터나 LCD 디스플레이 장치 등의 디스플레이 매체에 사물에 대한 영상으로 디스플레이될 수 있도록 한다.Such a camera module is manufactured by using an image sensor chip of a CCD or a CMOS, and collects an object through a lens on the image sensor chip so that the image can be displayed as an image of the object on a display medium such as a PC monitor or an LCD display device.

종래의 카메라 모듈은 PCB 위에 CCD나 CMOS의 이미지 센서 칩을 다이 어태치(Di Attach)하고, 상기 이미지 센서 칩과 PCB 를 와이어 본딩 한 후, 플라스틱 하우징을 어태치하여 외부로부터 보호시키고 난 후, 하우징의 나사산이 형성되어 있는 삽입구에 형성되어 있는 나사산과 결합되도록 나사산이 형성되어 있는 렌즈 어셈블리의 삽입돌구를 삽입하여 이들 삽입구의 나사산 및 삽입돌구의 나사산에 의한 나사 결합 방식으로 하우징과 렌즈 어셈블리를 결합하도록 되어 있다.Conventional camera module die attach the image sensor chip of CCD or CMOS on PCB, wire bond the image sensor chip and PCB, attach the plastic housing to protect it from the outside, and then Insert the insertion protrusions of the lens assembly with the threads formed so as to be combined with the threads formed in the insertion hole in which the threads of the insertion holes are formed so as to join the housing and the lens assembly by the screwing method by the threads of these insertion holes and the threads of the insertion protrusions. It is.

이때, 상기 렌즈 어셈블리에 구비된 렌즈와 상기 이미지 센서 칩 사이에 적외선 차단 필터(IR Cut-off Filter)를 위치시켜 과도한 장파장의 적외선을 차단시키고 있다.At this time, an infrared cut filter (IR cut-off filter) is positioned between the lens provided in the lens assembly and the image sensor chip to block excessive long infrared rays.

이러한 종래의 카메라 모듈은 센서 설계 당시 픽셀 사이즈 등을 고려하여 칩 레이 앵글(Chip Ray Angle)등의 설계치가 고정되고, 이에 따라 높이를 낮추는데 한계가 있는 문제점이 있었다. 이러한 점을 보완하기 위하여 Flip Chip 등의 센서 마 운트(Mount) 방법이 제안되었으나, 와이어 본딩 타입(Wire Bonding Type)에 비하여 공정이 어렵고 수율 또한 떨어진다는 문제점이 있었다.The conventional camera module has a problem in that a design value such as a chip ray angle is fixed in consideration of a pixel size at the time of sensor design, and accordingly, there is a limit in lowering the height. In order to compensate for this, a sensor mount method such as a flip chip has been proposed, but there is a problem that a process is difficult and a yield is also lower than that of a wire bonding type.

본 발명은 카메라 모듈의 렌즈부와 센서부를 힌지 연결부를 통하여 분리하고, 카메라의 동작 순간에만 렌즈부와 센서부를 접합하여 촬영함으로써 기존의 모듈보다 높이를 낮추고, 렌즈의 성능을 개선할 수 있는 카메라 모듈을 제공하는 것을 목적으로 한다.According to the present invention, the lens module and the sensor unit of the camera module are separated through the hinge connection unit, and the lens unit and the sensor unit are photographed by bonding the lens unit and the sensor unit only at the moment of operation of the camera to reduce the height of the existing module and improve the performance of the lens. The purpose is to provide.

본 발명의 카메라 모듈은 내부에 공간부를 형성하고 있는 카메라 하우징과, 피사체의 광이미지를 입사받을 수 있도록 상기 카메라 하우징의 장착부 내에 설치되는 복수의 렌즈와, 상기 렌즈를 하우징에 조립하기 위한 바렐을 포함하는 렌즈부와, 상기 렌즈에 입사되는 적외선을 차단함과 동시에 상기 장착부를 밀봉시키도록 구성되는 IR필터와, 상기 IR필터를 통해 적외선이 차단된 광이미지를 결상하여 전기적인 신호로 변환시키는 이미지 센서와, 상기 이미지 센서에 의해 출력되는 영상신호를 디지털처리 하는 인쇄회로기판을 포함하는 센서부와, 상기 센서부의 일 측을 기준으로 상기 렌즈부가 회동 가능하도록 센서부와 렌즈부를 연결하는 힌지연결부를 포함한다.The camera module of the present invention includes a camera housing forming a space therein, a plurality of lenses installed in the mounting portion of the camera housing to receive an optical image of a subject, and a barrel for assembling the lens in the housing. An IR sensor configured to seal the mounting unit at the same time as blocking the infrared ray incident on the lens, and an image sensor for forming an optical image by converting an optical image blocked by the infrared ray through the IR filter into an electrical signal. And a sensor unit including a printed circuit board for digitally processing the image signal output by the image sensor, and a hinge connection unit connecting the sensor unit and the lens unit to rotate the lens unit based on one side of the sensor unit. do.

상기 힌지 연결부는, 렌즈부의 하부 일 측 양쪽 끝단에 서로 마주보도록 돌 출 형성되는 한 조의 힌지너클과, 센서부의 하부 일 측 양쪽 끝단에 돌출 형성되어, 상기 한 조의 힌지너클 사이에 회동 가능하게 결합 되는 결합부와, 상기 결합부가 회동 가능하게 결합되기 위하여 힌지너클과 결합부 사이에 설치되는 힌지를 포함하여 구성된다.The hinge connection part is formed to protrude from both ends of the set of hinge knuckles protruding from both ends of the lower side of the lens unit and the lower one side of the sensor unit, and is rotatably coupled between the set of hinge knuckles. It comprises a coupling portion, and the hinge is provided between the hinge knuckle and the coupling portion to be rotatably coupled to the coupling portion.

이때, 힌지 연결부는 180도 회전 가능한 구조로 구성되며, 상기 센서부와 렌즈부가 회동되어 결합된 상태에서 서로 맞닿는 각각의 일측면에는 자석이 구비되어있으며, 상기 자석은 상기 센서부와 렌즈부가 결합된 상태에서 움직이지 않도록 고정시키는 역할을 수행한다. In this case, the hinge connecting portion is configured to be rotated 180 degrees, a magnet is provided on each side of the sensor unit and the lens unit to be in contact with each other in a coupled state, the magnet is coupled to the sensor unit and the lens unit It plays a role of fixing not to move in the state.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예에 관하여 상세하게 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 카메라 모듈의 내부 결합구조를 나타낸 단면도이며, 도 2는 본 발명에 따른 카메라 모듈의 구성을 나타낸 분해 사시도이다.1 is a cross-sectional view showing the internal coupling structure of the camera module of the present invention, Figure 2 is an exploded perspective view showing the configuration of the camera module according to the present invention.

본 발명의 카메라 모듈(100)은 크게 렌즈부(10), 센서부(20), 힌지 연결부(112)로 구성된다.The camera module 100 of the present invention is largely composed of a lens unit 10, a sensor unit 20, and a hinge connection unit 112.

렌즈부(10)는 카메라 하우징(30), 렌즈(106) 등을 포함하여 구성된다.The lens unit 10 includes a camera housing 30, a lens 106, and the like.

렌즈(106)는 피사체의 광이미지를 입사 받을 수 있도록 카메라 하우징(30)의 장착부 내에 삽입 설치된다. The lens 106 is inserted into the mounting portion of the camera housing 30 to receive an optical image of the subject.

카메라 하우징(30)은 이미지 센서(118)와 PCB(115), 렌즈(106)를 삽입할 수 있는 공간부를 형성하고 있으며, 렌즈(106)를 하우징(109)에 조립하기 위한 바 렐(109)을 포함하고 있다. The camera housing 30 forms a space in which the image sensor 118, the PCB 115, and the lens 106 can be inserted, and a barrel 109 for assembling the lens 106 to the housing 109. It includes.

센서부(20)는 IR 필터(121), 이미지 센서(118), 인쇄회로기판(115)을 포함하여 구성된다.The sensor unit 20 includes an IR filter 121, an image sensor 118, and a printed circuit board 115.

IR 필터(121)는 렌즈(106)에 입사되는 광 이미지에 포함된 적외선을 차단한다. 즉, 통상 이미지 촬상소자인 이미지 센서(118)는 인간의 눈과 달리 근적외선 파장 및 적외선 영역 파장대의 감지가 가능하기 때문에 촬상시 화면색조가 적조의 경향을 가지므로 이 파장대 영역을 차단하기 위하여 IR필터(IR Cut Off Filter)(121)를 렌즈부(10)와 이미지 센서(118) 사이에 설치하고 있으며, 이러한 IR필터(121)에 의해 렌즈부(10)를 통하여 모여진 광이미지는 적외선이 차단된 상태로 이미지 센서(118)에 결상된다.The IR filter 121 blocks infrared rays included in the optical image incident on the lens 106. That is, since the image sensor 118, which is a normal image pickup device, can detect near-infrared wavelengths and infrared wavelength bands unlike human eyes, the screen color tends to be red-toned during imaging, and thus an IR filter is used to block the wavelength range. (IR Cut Off Filter) 121 is installed between the lens unit 10 and the image sensor 118, the optical image collected through the lens unit 10 by the IR filter 121 is the infrared ray is blocked. It is imaged in the image sensor 118 in a state.

이미지 센서(118)는 IR필터(121)를 통해 적외선이 차단된 광이미지를 결상하여 전기적인 신호로 변환시키는 역할을 수행한다. 또한 이미지센서(118)는 다수의 화소로 구성된 화소영역(미도시)과, 화소영역의 입출력 단자인 다수의 전극(미도시)으로 구성된다. 이때, 다수의 전극은 각각 와이어 본딩(Wire bonding)장비를 이용하여 인쇄회로기판(115)의 전극과 전기적으로 연결된다.The image sensor 118 forms an optical image blocked by infrared rays through the IR filter 121 and converts the optical image into an electrical signal. Also, the image sensor 118 includes a pixel area (not shown) including a plurality of pixels and a plurality of electrodes (not shown) that are input / output terminals of the pixel area. In this case, the plurality of electrodes are electrically connected to the electrodes of the printed circuit board 115 using wire bonding equipment, respectively.

인쇄회로기판(115)은 소정의 전기적인 패턴과 다수의 전극(미도시)이 구비되어 있다.The printed circuit board 115 is provided with a predetermined electrical pattern and a plurality of electrodes (not shown).

힌지 연결부(112)는 센서부(20) 및 센서부(20)의 일 측을 기준으로 렌즈부(10)가 회동 가능하도록 센서부(20)와 렌즈부(10)를 연결한다. 즉, 도 2에서와 같이 힌지 연결부(112)는 렌즈부(10)의 하부 일 측 양쪽 끝단에 서로 마주보도록 돌출 형성되는 한 조의 힌지너클(203)과, 센서부(20)의 하부 일 측 양쪽 끝단에 돌출 형성되어, 한 조의 힌지너클 사이에 회동 가능하게 결합 되는 결합부(209) 및 결합부(209)가 회동 가능하게 결합되기 위하여 힌지너클(203)과 결합부(209) 사이에 설치되는 힌지(206)로 구성되며, 힌지 연결부(112)는 180도 회전 가능한 구조로 구성된다.The hinge connection unit 112 connects the sensor unit 20 and the lens unit 10 so that the lens unit 10 can be rotated based on the sensor unit 20 and one side of the sensor unit 20. That is, as shown in FIG. 2, the hinge connection portion 112 protrudes from both ends of the lower side of the lens unit 10 so as to face each other, and a pair of hinge knuckles 203 and both sides of the lower side of the sensor unit 20. Protrudingly formed at the end, the coupling portion 209 and the coupling portion 209 which is rotatably coupled between a set of hinge knuckles are installed between the hinge knuckle 203 and the coupling portion 209 to be rotatably coupled. Consists of a hinge 206, the hinge connection portion 112 is configured to be rotated 180 degrees.

센서부(20)와 렌즈부(10)가 회동되어 결합된 상태에서 서로 맞닿는 각각의 일측면에는 자석(103)이 구비되어있으며, 자석(103)은 센서부(20)와 렌즈부(10)가 결합된 상태에서 움직이지 않도록 고정시키는 역할을 수행한다. 이때, 센서부(20)에 구비되는 자석과 렌즈부(10)에 구비되는 자석은 서로 다른 극성인 것이 바람직하다.A magnet 103 is provided on each side surface of the sensor unit 20 and the lens unit 10 that are in contact with each other in a state where the sensor unit 20 and the lens unit 10 are rotated and coupled, and the magnet 103 has the sensor unit 20 and the lens unit 10. Plays a role of fixing not to move in the combined state. At this time, the magnet provided in the sensor unit 20 and the magnet provided in the lens unit 10 are preferably of different polarities.

힌지 연결부(112)에 의한 회동은, 카메라 촬영시에만 일시적으로 카메라의 렌즈부(10)가 180도 회전하여 센서부(20)에 놓이게 되는 것이며, 이렇게 렌즈부(10)와 센서부(20)로 카메라 모듈을 나눔으로써 기존의 와이어 본딩(Wire Bonding)공정을 그대로 이용하여 수율을 안정적으로 확보하면서 무리 없이 높이를 절반 정도 낮출 수 있기 때문에 렌즈 성능 저하의 문제점을 해결하였다.The rotation by the hinge connection part 112 is such that the lens unit 10 of the camera is temporarily rotated 180 degrees and placed on the sensor unit 20 only when the camera is photographed. Thus, the lens unit 10 and the sensor unit 20 By dividing the camera module, the problem of deterioration of the lens is solved by using the existing wire bonding process as it is, so that the yield can be stably lowered by half without difficulty.

이상, 본 발명을 몇가지 예를 들어 설명하였지만, 본 발명은 특정 실시예에 한정되는 것은 아니다. 본 발명이 속하는 기술 분야에서 통상의 지식을 지닌 자라면 본 발명의 사상에서 벗어나지 않으면서 다양한 수정과 변경을 가할 수 있음을 이해할 것이다.As mentioned above, although this invention was demonstrated to the several example, this invention is not limited to a specific Example. Those skilled in the art will appreciate that various modifications and changes can be made without departing from the spirit of the invention.

본 발명은 카메라 모듈의 렌즈부와 센서부를 힌지 연결부를 통하여 분리하고, 카메라의 동작 순간에만 렌즈부와 센서부를 접합하여 촬영함으로써 기존의 모듈보다 높이를 낮추고, 렌즈의 성능을 개선하는 효과를 가진다.According to the present invention, the lens unit and the sensor unit of the camera module are separated through the hinge connection unit, and the lens unit and the sensor unit are photographed by bonding only the moment of operation of the camera, thereby lowering the height of the existing module and improving the performance of the lens.

Claims (4)

내부에 공간부를 형성하고 있는 카메라 하우징과, 피사체의 광이미지를 입사 받을 수 있도록 상기 카메라 하우징의 장착부 내에 설치되는 복수의 렌즈와, 상기 렌즈를 하우징에 조립하기 위한 바렐을 포함하는 렌즈부와,A lens housing including a camera housing forming a space therein, a plurality of lenses installed in a mounting portion of the camera housing so as to receive an optical image of a subject, and a barrel for assembling the lens into the housing; 상기 렌즈에 입사되는 적외선을 차단함과 동시에 상기 장착부를 밀봉시키도록 구성되는 IR필터와, 상기 IR필터를 통해 적외선이 차단된 광이미지를 결상하여 전기적인 신호로 변환시키는 이미지 센서와, 상기 이미지 센서에 의해 출력되는 영상신호를 디지털처리 하는 인쇄회로기판을 포함하는 센서부와, An IR filter configured to block infrared rays incident to the lens and to seal the mounting unit; an image sensor for forming an optical image by converting an optical image blocked by infrared rays through the IR filter into an electrical signal; and the image sensor A sensor unit including a printed circuit board for digitally processing an image signal output by the sensor; 상기 센서부의 일 측을 기준으로 상기 렌즈부가 회동 가능하도록 센서부와 렌즈부를 연결하는 힌지연결부Hinge connection unit for connecting the sensor unit and the lens unit so that the lens unit can rotate relative to one side of the sensor unit 를 포함하는 카메라 모듈.Camera module comprising a. 제 1항에 있어서 상기 힌지 연결부는,According to claim 1, The hinge connecting portion, 렌즈부의 하부 일 측 양쪽 끝단에 서로 마주보도록 돌출 형성되는 한 조의 힌지너클과,A set of hinge knuckles protruding to face each other at both ends of the lower one side of the lens unit; 센서부의 하부 일 측 양쪽 끝단에 돌출 형성되어, 상기 한 조의 힌지너클 사이에 회동 가능하게 결합 되는 결합부와,A coupling part protruding from both ends of the lower side of the sensor part, the coupling part being rotatably coupled between the pair of hinge knuckles, 상기 결합부가 회동 가능하게 결합되기 위하여 힌지너클과 결합부 사이에 설치되는 힌지Hinge that is installed between the hinge knuckle and the coupling portion to be rotatably coupled to the coupling portion 를 포함하는 카메라 모듈.Camera module comprising a. 제 1항에 있어서,The method of claim 1, 상기 힌지 연결부는 180도 회전 가능한 구조로 구성되는 카메라 모듈.The hinge connection unit is a camera module configured to rotate 180 degrees. 제 1항에 있어서,The method of claim 1, 상기 센서부와 렌즈부가 회동되어 결합된 상태에서 서로 맞닿는 각각의 일측면에는 자석이 구비되어있으며, 상기 자석은 상기 센서부와 렌즈부가 결합된 상태에서 움직이지 않도록 고정시키는 역할을 수행하는 카메라 모듈.And a magnet is provided at each side of the sensor unit and the lens unit which are in contact with each other in a state where the sensor unit and the lens unit are coupled to each other, and the magnet serves to fix the sensor unit and the lens unit so as not to move.
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