JP3911963B2

JP3911963B2 - Photoelectric equipment

Info

Publication number: JP3911963B2
Application number: JP2000153448A
Authority: JP
Inventors: 山中　　浩; 薫戸根
Original assignee: Matsushita Electric Works Ltd
Current assignee: Panasonic Electric Works Co Ltd
Priority date: 2000-05-24
Filing date: 2000-05-24
Publication date: 2007-05-09
Anticipated expiration: 2020-05-24
Also published as: JP2001333305A

Description

【０００１】
【発明の属する技術分野】
本発明は固体撮像素子を備えた撮像装置や受発光素子を備えた受発光部材といった光電気的器材に関するものである。
【０００２】
【従来の技術】
家庭用ビデオカメラや電子スチールカメラの撮像装置、あるいはノート型パソコンや携帯電話などに組み込み可能な撮像装置は、固体撮像素子と配線基板、鏡筒、レンズ、フィルター等の部品で構成されているが、特に小型化された撮像装置としては、特開平１０−４１４９２号公報、特開平１０−２２７９６２号公報、特開平１０−３２１８２７号公報、特開平１１−１４６２８４号公報等に示されたものがあるが、これらにおいては、上記各部品を組み立てて撮像装置を構成し、該撮像装置を半田付けや導電ペーストなどを用いて該撮像装置の取り付け対象となる装置に固定接続している。
【０００３】
【発明が解決しようとする課題】
撮像装置においては、レンズやフィルターといった光学部品と、固体撮像素子との位置関係を高精度に保たなくてはならないが、固体撮像素子や配線基板、鏡筒、レンズ、フィルター、取り付け部材等を組み立てて構成された上記のものは、部品点数が多いことから各部品精度と組み付け精度とに高い精度が要求されており、製造工程の多さや部品コストなどからコストの高いものとなっている。また、撮像装置の交換の必要が生じたとしても、その交換は半田付けや導電ペーストによる接続を外すことで行うために、手間のかかるものとなっている。
【０００４】
本発明はこのような点に鑑みなされたものであって、その目的とするところは部品点数の削減によるコストの低減を図るとともに交換を容易にした光電気的器材を提供するにある。
【０００５】
【課題を解決するための手段】
しかして本発明は、実装用端子部と外部接続用の端子部とを備えている立体回路基板と、光電気的素子を備えて立体回路基板の実装用端子部に実装接続された集積回路とからなる光電気的器材であって、立体回路基板の上記外部接続用端子部が接続相手の端子に対して着脱自在なコネクター端子部として形成されているとともに、コネクター端子部である上記外部用接続用端子部は筒状となっている立体回路基板の内面側に設けられていることに特徴を有している。立体回路基板を用いることで部品点数の削減を図ると同時に、立体回路基板をコネクター対応のものとすることで、その装着交換を容易にしたものである。
【０００６】
ここでの立体回路基板には光学部品が装着される鏡筒として形成されているとともに、集積回路は光電気的素子として固体撮像素子を備えたものを好適に用いることができるが、光電気的素子は受光素子や発光素子などであってもよいのはもちろんであり、光学部品を備えていないものであってもよい。。
【０００７】
集積回路は筒状となっている立体回路基板の内部に納められて立体回路基板の内面側に設けられている実装用端子に接触接続されていることが好ましい。
【０００８】
また、外部接続用端子部に接続される端子を備えた接続相手との間で位置決めを行う位置決め部を立体回路基板が備えたものを好適に用いることができる。
【０００９】
立体回路基板はその一端側から他端側にかけて順次内寸法が大きくなっている筒状となっているとよい。
【００１０】
立体回路基板の実装用端子部及び外部接続用端子部の背後に低弾性係数の低弾性層を配したものや、立体回路基板における外部接続用端子部の背後に位置する部分に開放された中空部を備えたものを用いてもよい。
【００１１】
【発明の実施の形態】
以下本発明を実施の形態の一例に基づいて詳述すると、本発明に係る光電気的器材は、射出成形品上に銅スパッタリング法によって形成した銅薄膜に対してレーザー加工を行うことで回路として必要な部分と不必要な部分とを分離し、電気めっきによって回路として必要な部分にのみメッキを施すことで形成した立体的な電気的配線を備えるＭＩＤ（ＭｏｌｄｅｄＩｎｔｅｒｃｏｎｎｅｃｔＤｅｖｉｃｅ）と称される立体回路基板１を主体とするもので、図示例における立体回路基板１は、その内周側にレンズ２や光学絞り７やフィルター３といった光学部品が装着される被装着部１２を備える円筒部１０の一端に、矩形枠状で内部に固体撮像素子もしくは固体撮像素子を含む集積回路４が装着される被装着部１４を備えた筒状の射出成形品であり、その被装着部１４には一端側が集積回路４に接続される実装用端子部５１、他端側が外部接続用の端子部５２となっている立体的電気的配線５がめっきによって形成されている。
【００１２】
ここで、上記レンズ２は固体撮像素子に結像させるためのものであり、フィルター３は赤外線カットフィルター、水晶フィルターなどのローパスフィルターである。集積回路４の固体撮像素子にはＣＣＤやＣＭＯＳ等、任意の形態のものを用いることができるとともに、その出力の演算処理のための周辺回路を含むものであってもよい。外部から入光された光はレンズ２を介して集光されてフィルター３を通じて集積回路４である固体撮像素子上に結像する。
【００１３】
集積回路４はその電極パッド４１（もしくは電極パッド上に形成されているスタッドバンプ）が実装用端子部５１に接続される状態で接着剤９によって立体回路基板１に固定されたもので、鏡筒１の被装着部１４の端部内周面に位置する外部接続用の端子部５２を介して映像信号を外部に出力する。
【００１４】
ここにおいて、立体回路基板１の外部接続用端子部５２を接続する相手は、ばね弾性を有して端子部５２にそのばね弾性で接触する端子８０を外側面に備えているコネクター８であり、該コネクター８に立体回路基板１を差し込めば、端子８０が端子部５２に接触して電気的配線５を通じて集積回路４に接続されるものとなっている。
【００１５】
図中８２は上記接触状態を維持するための固定部材であり、立体回路基板１との係合部を備える該固定部材８２を立体回路基板１に被せてコネクター８に連結（図示例では螺合連結）することで、コネクター８に対する立体回路基板１の固定を行う。固定部材８２を外せば、コネクター８に対して立体回路基板１を図中上方へ抜き取ることができるものであり、たとえば異なるレンズ２あるいは異なる集積回路４１を備えた他の立体回路基板１への交換を容易に行うことができる。
【００１６】
コネクター８の端子８０が接触接続される外部接続用端子部５２を全体として筒状をなしている立体回路基板１の内周面に配置しているのは、コネクター８に接続していない状態においても端子部５２が外部に露出せず、このために端子部５２が損傷してしまうことによる接続信頼性の低下を抑えることができるからである。
【００１７】
なお、コネクター８と立体回路基板１との間には、その装着の向きを端子８０と外部接続用端子部５２とが接続されることになる方向に規定する位置決め突部８６と対応する位置決め凹部１８とを設けてある。位置決めのための構造は図示例のようなピン状の突部８６とこれに対応する凹部１８とに限るものではない。
【００１８】
また、図示例の筒状の立体回路基板１は、内寸法を一端側から他端側にかけて順次大きくしているが、これはレンズ２や光学絞り７、フィルター３といった光学部品と、集積回路４とを、図２に示すように、立体回路基板１の一端側からすべて組み付けることができるようにしているためである。
【００１９】
コネクター８の端子８０と外部接続用端子部５２との接触圧の確保は、端子８０が有するばね性を利用するのではなく、図３に示すように、立体回路基板１側の端子部５２の背後に低弾性率の樹脂成形部である弾性層１９を一体に形成しておけば、該弾性層１９の弾性を利用して接触圧の確保を行うことができる。特に図４に示すように、弾性層１９（立体回路基板１そのものであってもよい）に一端が外部に開放された中空部３０を設けておけば、より確実な弾性を確保することができ、接点接触圧の安定確保を行うことができる。
【００２０】
また、図３及び図４に示すものでは、実装用端子部５１の背後にも弾性層１６を設けることで、集積回路４と実装用端子部５１との接触の安定化を図っている。
【００２１】
【発明の効果】
以上のように本発明においては、実装用端子部と外部接続用の端子部とを備えている立体回路基板と、光電気的素子を備えて立体回路基板の実装用端子部に実装接続された集積回路とからなり、立体回路基板の上記外部接続用端子部を接続相手の端子に対して着脱自在なコネクター端子部として形成しているために、立体回路基板に各部品を装着するだけでよく、少ない部品点数ですむと同時に精度を容易に確保することができるものであって、小型で生産性がよく、製造コストを低減させることができるほか、立体回路基板をコネクター対応のものとしているために、その交換が必要な場合には、容易に応ずることができるものである。しかもコネクター端子部である外部接続用端子部は筒状となっている立体回路基板の内面側に設けているために、その外部接続用端子部の保護を立体回路基板で行うことができる。
【００２２】
ここでの立体回路基板には光学部品が装着される鏡筒として形成されているとともに、集積回路は光電気的素子として固体撮像素子を備えたものとすることで、撮像装置を構成することができ、異なるレンズを備えたものを用意しておけば、コネクターによる接続に際して異なるものを接続することで、交換レンズ方式をとることができ、さらには異なる固体撮像素子の集積回路を備えたものを用意しておくことで、用途に応じてモノクロ撮像やカラー撮像に応ずることができたり、解像度や画素数の変更に応ずることができる。
【００２３】
集積回路は筒状となっている立体回路基板の内部に納められて立体回路基板の内面側に設けられている実装用端子に接触接続されていると、集積回路の筒状の立体回路基板での保持を容易に行うことができる。
【００２４】
また、外部接続用端子部に接続される端子を備えた接続相手との間で位置決めを行う位置決め部を立体回路基板が備えたものとすることで、位置決めを行うことができると同時に、位置決め固定のための部品点数や部品加工を削減することができる。
【００２５】
立体回路基板はその一端側から他端側にかけて順次内寸法が大きくなっている筒状となっていると、立体回路基板への部品組み付けをすべて一方から行うことができて生産性が向上する。
【００２６】
また、立体回路基板の実装用端子部及び外部接続用端子部の背後に低弾性係数の低弾性層を配したものや、立体回路基板における外部接続用端子部の背後に位置する部分に開放された中空部を備えたものを用いると、コネクター接続の寸法や位置ばらつき等に対して安定した接点接触圧を確保することができて高い接触信頼性を得ることができる。
【図面の簡単な説明】
【図１】本発明の実施の形態の一例の断面図である。
【図２】同上の分解断面図である。
【図３】他例の断面図である。
【図４】さらに他例の断面図である。
【符号の説明】
１立体回路基板
４集積回路
５１実装用端子部
５２外部接続用端子部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an opto-electrical device such as an imaging device provided with a solid-state imaging device and a light receiving / emitting member provided with a light receiving / emitting device.
[0002]
[Prior art]
Imaging devices for home video cameras and electronic still cameras, or imaging devices that can be incorporated into notebook computers, mobile phones, etc., are composed of solid-state image sensors and components such as wiring boards, lens barrels, lenses, and filters. Particularly, miniaturized imaging devices include those disclosed in Japanese Patent Laid-Open Nos. 10-41492, 10-227962, 10-321827, and 11-146284. However, in these, the above-described components are assembled to constitute an image pickup apparatus, and the image pickup apparatus is fixedly connected to an apparatus to which the image pickup apparatus is attached using soldering or conductive paste.
[0003]
[Problems to be solved by the invention]
In the imaging device, the positional relationship between the optical components such as lenses and filters and the solid-state imaging device must be maintained with high accuracy, but the solid-state imaging device, wiring board, lens barrel, lens, filter, mounting member, etc. Since the above-described assembled structure has a large number of components, high accuracy is required for each component accuracy and assembly accuracy, and the cost is high due to the large number of manufacturing processes and component costs. Further, even if the imaging device needs to be replaced, it takes time and effort to perform the replacement by removing the connection by soldering or conductive paste.
[0004]
The present invention has been made in view of the above points, and an object of the present invention is to provide an opto-electrical device in which costs are reduced by reducing the number of parts and replacement is facilitated.
[0005]
[Means for Solving the Problems]
Accordingly, the present invention provides a three-dimensional circuit board having a mounting terminal portion and a terminal portion for external connection, an integrated circuit having a photoelectric element and mounted and connected to the mounting terminal portion of the three-dimensional circuit board. The external connection terminal portion of the three-dimensional circuit board is formed as a connector terminal portion that is detachable with respect to a connection partner terminal, and the external connection is a connector terminal portion. The terminal portion for use is characterized in that it is provided on the inner surface side of the cylindrical circuit board . By using a three-dimensional circuit board, the number of parts is reduced, and at the same time, the three-dimensional circuit board is made compatible with a connector, thereby facilitating mounting and replacement.
[0006]
The three-dimensional circuit board here is formed as a lens barrel on which an optical component is mounted, and an integrated circuit can be suitably used that has a solid-state image sensor as a photoelectric element. Of course, the element may be a light receiving element, a light emitting element, or the like, or may be one that does not include an optical component. .
[0007]
It is preferable that the integrated circuit is housed in a cylindrical circuit board that is cylindrical and is contact-connected to a mounting terminal provided on the inner surface side of the circuit board .
[0008]
Moreover, what the 3D circuit board equipped with the positioning part which positions with the other party provided with the terminal connected to the terminal part for external connection can be used suitably.
[0009]
The three-dimensional circuit board is preferably in the form of a cylinder whose inner dimensions are sequentially increased from one end side to the other end side.
[0010]
A low elastic modulus low elastic layer placed behind the mounting terminal portion and external connection terminal portion of the 3D circuit board, or a hollow open to the portion of the 3D circuit board located behind the external connection terminal portion You may use what was provided with the part.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail based on an example of an embodiment. The photoelectric device according to the present invention is a circuit by performing laser processing on a copper thin film formed by a copper sputtering method on an injection molded product. A three-dimensional circuit called MID (Molded Interconnect Device) having a three-dimensional electrical wiring formed by separating a necessary part and an unnecessary part and plating only a necessary part as a circuit by electroplating. The three-dimensional circuit board 1 in the illustrated example is mainly composed of the board 1, and one end of a cylindrical part 10 having a mounted part 12 on which an optical component such as a lens 2, an optical diaphragm 7, and a filter 3 is mounted on the inner peripheral side thereof. In addition, a cylindrical injection molding provided with a mounted portion 14 to which a solid-state imaging device or an integrated circuit 4 including the solid-state imaging device is mounted in a rectangular frame shape. The mounting portion 14 is formed by plating with a mounting terminal portion 51 whose one end is connected to the integrated circuit 4 and a three-dimensional electrical wiring 5 whose other end is a terminal portion 52 for external connection. ing.
[0012]
Here, the lens 2 is for forming an image on a solid-state imaging device, and the filter 3 is a low-pass filter such as an infrared cut filter or a crystal filter. The solid-state imaging device of the integrated circuit 4 may be of any form such as a CCD or CMOS, and may include a peripheral circuit for arithmetic processing of its output. The light incident from the outside is condensed through the lens 2 and forms an image on the solid-state imaging device as the integrated circuit 4 through the filter 3.
[0013]
The integrated circuit 4 is an electrode pad 41 (or a stud bump formed on the electrode pad) fixed to the three-dimensional circuit board 1 by an adhesive 9 in a state where the electrode pad 41 (or a stud bump formed on the electrode pad) is connected to the mounting terminal portion 51. The video signal is output to the outside through the terminal portion 52 for external connection located on the inner peripheral surface of the end portion of the one mounted portion 14.
[0014]
Here, the counterpart to which the external connection terminal portion 52 of the three-dimensional circuit board 1 is connected is a connector 8 that has spring elasticity and has a terminal 80 on the outer surface that contacts the terminal portion 52 with the spring elasticity. When the three-dimensional circuit board 1 is inserted into the connector 8, the terminal 80 comes into contact with the terminal portion 52 and is connected to the integrated circuit 4 through the electrical wiring 5.
[0015]
In the figure, reference numeral 82 denotes a fixing member for maintaining the contact state. The fixing member 82 having an engaging portion with the three-dimensional circuit board 1 is put on the three-dimensional circuit board 1 and connected to the connector 8 (in the illustrated example, screwed). By connecting), the three-dimensional circuit board 1 is fixed to the connector 8. If the fixing member 82 is removed, the three-dimensional circuit board 1 can be extracted upward in the drawing with respect to the connector 8. For example, replacement with another three-dimensional circuit board 1 having a different lens 2 or a different integrated circuit 41 is possible. Can be easily performed.
[0016]
The external connection terminal portion 52 to which the terminal 80 of the connector 8 is contact-connected is disposed on the inner peripheral surface of the three-dimensional circuit board 1 having a tubular shape as a whole in a state where it is not connected to the connector 8. This is because the terminal portion 52 is not exposed to the outside, so that it is possible to suppress a decrease in connection reliability due to the terminal portion 52 being damaged .
[0017]
In addition, between the connector 8 and the three-dimensional circuit board 1, the positioning recessed part corresponding to the positioning protrusion 86 which prescribes | regulates the direction of the mounting | wearing in the direction where the terminal 80 and the external connection terminal part 52 will be connected. 18 is provided. The structure for positioning is not limited to the pin-shaped protrusion 86 and the corresponding recess 18 as shown in the drawing.
[0018]
Further, the cylindrical three-dimensional circuit board 1 in the illustrated example has the internal dimensions sequentially increased from one end side to the other end side. This is because, as shown in FIG. 2, the three-dimensional circuit board 1 can be assembled from one end side.
[0019]
Ensuring the contact pressure between the terminal 80 of the connector 8 and the terminal portion 52 for external connection does not use the spring property of the terminal 80, but instead of the terminal portion 52 on the side of the three-dimensional circuit board 1 as shown in FIG. If the elastic layer 19 that is a resin molded portion having a low elastic modulus is integrally formed behind, the contact pressure can be secured by utilizing the elasticity of the elastic layer 19. In particular, as shown in FIG. 4, if the elastic layer 19 (which may be the three-dimensional circuit board 1 itself) is provided with a hollow portion 30 having one end opened to the outside, more reliable elasticity can be secured. It is possible to ensure stable contact contact pressure.
[0020]
3 and 4, the elastic layer 16 is also provided behind the mounting terminal portion 51 to stabilize the contact between the integrated circuit 4 and the mounting terminal portion 51.
[0021]
【The invention's effect】
As described above, in the present invention, a three-dimensional circuit board having a mounting terminal portion and a terminal portion for external connection, and a photoelectric element are mounted and connected to the mounting terminal portion of the three-dimensional circuit board. Since the external connection terminal portion of the three-dimensional circuit board is formed as a connector terminal portion that can be attached to and detached from the connection partner terminal, it is only necessary to mount each component on the three-dimensional circuit board. Because it requires only a small number of parts and can easily ensure accuracy, it is compact and highly productive, can reduce manufacturing costs, and the 3D circuit board is compatible with connectors. If the replacement is necessary, it can be easily met. In addition, since the external connection terminal portion, which is a connector terminal portion, is provided on the inner surface side of the cylindrical circuit board, the external connection terminal section can be protected by the circuit board.
[0022]
The three-dimensional circuit board here is formed as a lens barrel on which an optical component is mounted, and the integrated circuit includes a solid-state image sensor as a photoelectric element, so that an imaging apparatus can be configured. If you have a lens with a different lens, you can use an interchangeable lens system by connecting different ones with a connector. By preparing it, it is possible to respond to monochrome imaging or color imaging according to the application, or to change the resolution and the number of pixels.
[0023]
When the integrated circuit is housed in a cylindrical circuit board having a cylindrical shape and is contact-connected to a mounting terminal provided on the inner surface side of the three-dimensional circuit board, the integrated circuit is a cylindrical circuit board of the integrated circuit. Can be easily held .
[0024]
In addition, positioning can be performed at the same time as the molded circuit board is provided with a positioning part for positioning with a connection partner provided with a terminal connected to the terminal part for external connection. Therefore, the number of parts and parts processing can be reduced.
[0025]
If the three-dimensional circuit board has a cylindrical shape whose inner dimensions are sequentially increased from one end side to the other end side, all parts can be assembled to the three-dimensional circuit board from one side, and productivity is improved.
[0026]
Also, it is open to the part located on the back side of the external connection terminal part of the 3D circuit board or the one that has a low elastic modulus low elastic layer behind the mounting terminal part and external connection terminal part of the 3D circuit board. If a hollow portion is used, a stable contact contact pressure can be secured against variations in connector connection dimensions, position, etc., and high contact reliability can be obtained.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an example of an embodiment of the present invention.
FIG. 2 is an exploded sectional view of the above.
FIG. 3 is a cross-sectional view of another example.
FIG. 4 is a cross-sectional view of still another example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 3D circuit board 4 Integrated circuit 51 Terminal part 52 for mounting 52 Terminal part for external connection

Claims

Photoelectric equipment comprising a three-dimensional circuit board having a mounting terminal portion and a terminal portion for external connection, and an integrated circuit having a photoelectric element mounted and connected to the mounting terminal portion of the three-dimensional circuit board. The external connection terminal portion of the three-dimensional circuit board is formed as a connector terminal portion that is detachable with respect to a connection partner terminal, and the external connection terminal portion that is a connector terminal portion is cylindrical. An opto-electrical device provided on the inner surface side of the three-dimensional circuit board .

2. The photoelectric device according to claim 1, wherein the three-dimensional circuit board is formed as a lens barrel on which an optical component is mounted, and the integrated circuit is provided with a solid-state imaging device as a photoelectric device. .

3. The integrated circuit according to claim 1, wherein the integrated circuit is housed in a cylindrical circuit board and is contact-connected to a mounting terminal provided on the inner surface side of the circuit board . Photoelectric equipment.

The three-dimensional circuit board includes a positioning unit that performs positioning with a connection partner including a terminal connected to the external connection terminal unit, according to any one of claims 1 to 3. Photoelectric equipment.

5. The photoelectric device according to claim 1, wherein the three-dimensional circuit board has a cylindrical shape whose inner dimensions are sequentially increased from one end side to the other end side thereof.

6. The optoelectric device according to claim 1, wherein a low elastic layer having a low elastic modulus is disposed behind the mounting terminal portion and the external connection terminal portion of the three-dimensional circuit board. Equipment.

The photoelectric device according to any one of claims 1 to 6, further comprising a hollow portion in which a portion of the three-dimensional circuit board located behind the external connection terminal portion is opened.