KR200464059Y1 - Camera Module - Google Patents

Abstract

An embodiment relates to a camera module.

Camera module according to the embodiment, the lens unit; A holder coupled to the lens unit and having an IR filter mounted therein; A circuit board coupled to the lower part of the holder; And an image sensor coupled to the upper portion of the circuit board, wherein at least a portion of the lower portion of the holder coupled to the circuit board is removed to form a gap.

Holder, open

Description

Camera module {Camera module}

An embodiment relates to a camera module.

Recently, with the development of communication technology and digital information processing technology, portable terminal technology in which various functions such as information processing and arithmetic, communication, image information input and output are integrated is emerging.

Examples of the portable terminal may include a digital camera, a PDA equipped with a communication function, a mobile phone added with a digital camera function, a personal multi-media player (PMP), and the like.

Due to the development of the digital camera technology and information storage capability, the mounting of high specification digital camera module is increasingly common.

In addition, with the development of various technologies, a mega pixel image sensor is used in a digital camera module mounted on a portable terminal, etc., while the importance of additional functions such as autofocus and optical zoom is increasing. The size of the camera module continues to be miniaturized very limited.

However, one of the factors that make it difficult to downsize the camera module is the structure of the holder. That is, it is necessary to secure a space for performing a wire bonding operation under the holder, which makes it difficult to downsize the camera module.

The embodiment provides a camera module capable of miniaturizing the size of the camera module by forming a gap under the holder to secure a space for wire bonding.

Camera module according to the embodiment, the lens unit; A holder coupled to the lens unit and having an IR filter mounted therein; A circuit board coupled to the lower part of the holder; And an image sensor coupled to the upper portion of the circuit board, and removes at least a portion of a lower portion of the holder coupled to the circuit board to form a gap.

According to the camera module according to the embodiment, by removing at least a portion of the lower portion of the holder to form a gap between the circuit board and the holder, there is an effect of securing a space for the wire bonding by the gap.

In addition, by securing a space for the wire bonding, it is possible to reduce the size of the holder has the effect of miniaturizing the camera module.

Hereinafter, a camera module according to an embodiment will be described in detail with reference to the accompanying drawings.

In adding reference numerals to the components of the following drawings, the same components only have the same reference numerals as possible even if displayed on different drawings, it is determined that the gist of the present embodiment may unnecessarily obscure Detailed description of functions and configurations will be omitted.

1 is a cross-sectional view illustrating a configuration of a camera module according to an embodiment.

Referring to FIG. 1, a camera module according to an exemplary embodiment may include a holder having a printed circuit board 110, an image sensor 120, a filter unit 150, and a lens unit 160 installed therein. 140).

The image sensor 120 is bonded to the upper side of the printed circuit board (PCB) 110 by using epoxy.

The circuit board 110 performs a function of digitally processing an image signal output from the image sensor 120.

Here, the circuit board 110 may be a flexible substrate, but is not limited thereto.

The image sensor 120 forms a light image blocked by infrared rays through the filter unit 150 and converts the optical image into an electrical signal.

The image sensor 120 may include a pixel region including a plurality of pixels and a plurality of electrodes, which are input / output terminals of the pixel region.

When the adhesion of the image sensor 120 is completed, the pad of the circuit board 110 and the pad formed on the image sensor 120 are connected to each other by using a wire bonding process. The pads 120 are connected to each other using a wire 130 made of a conductive material.

Pin holes are formed in the circuit board 110 and guide pins 144 are integrally formed in the holder 140 to couple the circuit board 110 and the holder 140. Here, the filter unit 150 may be mounted in the holder 140.

The filter unit 150 may be an IR cut off filter, and the IR filter blocks infrared rays included in an optical image incident on the lens.

In an embodiment, the filter unit 150 has been described as an example provided between the lens unit 160 and the image sensor 120, but the present invention is not limited thereto. The filter unit 150 may be a front end of the lens unit 160. It is also possible to install in the structure.

When the circuit board 110 and the holder 140 are coupled to each other, the lens unit 160 is inserted into an opening formed in the upper portion of the holder 140.

The lens unit 160 may include a plurality of lenses including a convex lens and a concave lens that receive an optical image of the subject.

The holder 110 is a housing member having a stage for mounting the lens unit 160 thereon and the filter unit 150 therein, and may be formed of plastic or metal.

In an embodiment, the holder 140 removes a portion of the frame 142 of any one of the frames 141 and 142 coupled to the upper surface of the circuit board 110 from the lower part to the upper part, thereby removing the holder 140. ) And a gap 170 is formed between the circuit board 110 and the circuit board 110.

Here, a space may be secured in the lower central portion of the holder through the frames 141 and 142, and the image sensor 120 may be located in the secured space.

In addition, a portion of the frame 142 having the gap is removed to a predetermined height so as not to interfere with the wire 130 to expose the wire 130 electrically connecting the circuit board 110 and the image sensor 120.

In addition, the holder frame 142 having the gap 170 may be formed closer to the image sensor 120 side.

That is, the gap 170 is formed by forming a shorter horizontal distance d2 of the frame 142 on which the gap 170 is formed than a horizontal distance d1 of the frame 141 on which the gap 170 is not formed. ) Is formed close to the image sensor 120 side, through which the size of the holder can be reduced while securing a space for wire bonding between the image sensor 120 and the circuit board 110.

For the wire bonding operation, the distance d3 between the inner wall of the frame of the holder 140 and the pad of the circuit board should be at least 0.1 mm.

In an embodiment, by forming a gap 170 under the holder 140, the distance between the inner wall of the frame and the electrode pad of the circuit board as well as the distance d3 of the holder frame may be secured, thereby wire bonding. It is possible to effectively secure a space for performing the, the circuit board 110 can be reduced in size to the outer edge portion of the electrode pad.

For example, when manufacturing a 6.5x6.5mm camera module based on a 1 / 5-inch image sensor, there was no choice but to manufacture a camera module larger than a desired size due to the space for wire bonding.

That is, manufacturing the camera module while securing the wire bonding space has become an important problem in miniaturizing the camera module.

In an embodiment, by removing a portion of the frame below the holder to a predetermined height, a gap 170 is formed between the circuit board 110 and the holder 140 to effectively secure a space for wire bonding. The space can be reduced to reduce the size of the holder, making the camera module smaller.

In this case, an epoxy is filled in a portion where the gap 170 is formed in the holder 140 to prevent inflow of impurities such as dust.

2 and 3 are views illustrating a structure in which a holder is opened according to an embodiment.

2 and 3, a holder 140 including a frame 142 having a gap formed therein; A circuit board 110 coupled to the holder 140 and an image sensor 120 coupled to an upper portion of the circuit board 110 are included.

A predetermined coupling member 210 may be formed on an inner sidewall of the holder 140 to be coupled to the lens unit 160. The coupling member 143 may be formed by a screw line, but is not limited thereto.

In addition, a frame is formed on the lower surface of the holder 140 to be in contact with the upper surface of the circuit board 110 to secure a space in the center of the lower holder, the upper space of the circuit board 110 in the secured space An image sensor 120 coupled to the surface may be located.

In an embodiment, three of the lower frames of the frame of the holder 140 are in contact with the upper surface of the circuit board 110, and the lower of the other frame 142 is removed to a predetermined height to close the gap 170. Form.

In addition, a gap 170 may be formed in any one or more of the frames 142 formed on the four sides of the holder 140.

As the gap 170 is formed, a space for wire bonding is secured between the circuit board 110 and the image sensor 120, and the gap 170 may be formed when the holder 140 is ejected.

In addition, a wire connecting the circuit board 110 and the image sensor 120 is exposed at a portion where the gap 170 is formed, and a space for performing the wire bonding operation is secured.

In addition, a guide pin 144 for coupling with the circuit board 110 is formed at an outer side of the frame 142 on which the gap 170 is formed.

For example, a guide pin 144 is formed on a portion of the outside of the frame 142 on which the gap 170 is formed, and the frame is heightened from the bottom to the top by leaving a portion of the outside of the frame on which the guide pin 144 is formed. Is removed to form a gap 170.

That is, the guide pin 144 on the outside of the holder is coupled to the upper surface of the circuit board 110, the gap 170 is formed therebetween.

Therefore, by removing a lower portion of any one of the frame of the four sides of the frame forming a holder to a predetermined height to form a gap 170 between the circuit board 110 and the holder 140, by forming the gap 170 A space for performing wire bonding can be effectively secured, and the holder can be reduced in size by securing the space, thereby miniaturizing the camera module.

In this case, an epoxy is filled in a portion where the gap 170 is formed in the holder 140 to prevent inflow of impurities such as dust.

4 is a plan view of a circuit board used in a camera module according to an embodiment viewed from above.

Referring to FIG. 4, various passive elements and circuit patterns are formed on the circuit board 110, and a holder 140 on which the filter unit 150 and the lens unit 160 are formed is mounted on the circuit board 110. On the upper surface of the circuit board 110, an image sensor 120 for imaging the photographed image may be located.

In an embodiment, the frames 1, 2, 3, and 4 are formed on the slopes of the lower part of the holder 140, respectively, and are coupled to the outer side of the upper surface of the circuit board 110 to secure a space under the holder.

In the secured space, the image sensor 120 coupled to the upper surface of the circuit board 110 is located.

The gap 170 is formed in any one frame of each frame below the holder 140, and in the embodiment, the gap 170 is formed in the fourth frame.

In addition, although the gap is formed in only one frame in the embodiment, the gap 170 may be formed in one or more frames.

The portion where the gap 170 is formed is exposed a wire connecting the circuit board 110 and the image sensor 120 to secure a space for performing the wire bonding operation, the epoxy 170 is formed in the portion where the gap 170 is formed. epoxy) 180 to prevent the inflow of impurities such as dust.

As described above, according to the camera module according to the embodiment, there is an effect of forming a gap between the circuit board and the holder by removing at least a portion of the holder and securing a space for wire bonding by the gap.

In addition, by securing a space for the wire bonding can reduce the size of the holder has the effect of miniaturizing the camera module.

Although the above description has been made with reference to the embodiments, these are merely examples and are not intended to limit the present invention, and those of ordinary skill in the art to which the present invention pertains should not be exemplified above unless they depart from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. And differences relating to these modifications and applications will have to be construed as being included in the scope of the invention as defined in the appended claims.

1 is a cross-sectional view illustrating a configuration of a camera module according to an embodiment.

2 and 3 are perspective views showing a state in which the holder according to the embodiment is opened.

4 is a plan view viewed from above of a circuit board used in a camera module according to an embodiment;

Claims (5)

A lens unit; A holder coupled to the lens unit and having an IR filter mounted therein; A circuit board coupled to the lower part of the holder; And An image sensor coupled to the upper portion of the circuit board, The pad of the image sensor and the pad of the circuit board are each connected through a plurality of wires, A gap is formed by removing at least a portion of the lower portion of the holder coupled to the circuit board. A distance between the gapped portion of the inner wall of the holder and a wire adjacent to the gapped portion is smaller than the distance between the other portion of the inner wall of the holder and the wire adjacent to the other portion. The method of claim 1, At least one or more gaps are formed under the holder. The method of claim 1, The gap is formed in the camera module is exposed the wire that electrically connects the image sensor and the circuit board. The method of claim 1, The gap formed portion of the camera module is filled with epoxy to prevent impurities. The method of claim 1, The gap is a camera module formed when the holder is ejected.

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