JPS55130839A - Uniform etching method of article - Google Patents

Uniform etching method of article

Info

Publication number
JPS55130839A
JPS55130839A JP3625479A JP3625479A JPS55130839A JP S55130839 A JPS55130839 A JP S55130839A JP 3625479 A JP3625479 A JP 3625479A JP 3625479 A JP3625479 A JP 3625479A JP S55130839 A JPS55130839 A JP S55130839A
Authority
JP
Japan
Prior art keywords
etching
hole
ultrasonic wave
article
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3625479A
Other languages
English (en)
Inventor
Atsushi Nakayama
Mamoru Mizuhashi
Takeshi Harano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP3625479A priority Critical patent/JPS55130839A/ja
Publication of JPS55130839A publication Critical patent/JPS55130839A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Surface Treatment Of Glass (AREA)
JP3625479A 1979-03-29 1979-03-29 Uniform etching method of article Pending JPS55130839A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3625479A JPS55130839A (en) 1979-03-29 1979-03-29 Uniform etching method of article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3625479A JPS55130839A (en) 1979-03-29 1979-03-29 Uniform etching method of article

Publications (1)

Publication Number Publication Date
JPS55130839A true JPS55130839A (en) 1980-10-11

Family

ID=12464629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3625479A Pending JPS55130839A (en) 1979-03-29 1979-03-29 Uniform etching method of article

Country Status (1)

Country Link
JP (1) JPS55130839A (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7132034B2 (en) * 1998-03-16 2006-11-07 Lg.Philips Lcd Co., Ltd. Apparatus for etching a glass substrate
JP2007175813A (ja) * 2005-12-27 2007-07-12 Seiko Epson Corp 凹部付き部材の製造方法、凹部付き部材、レンズ基板、透過型スクリーンおよびリア型プロジェクタ
JP2013506616A (ja) * 2009-10-01 2013-02-28 ローレンス リバモア ナショナル セキュリティー， エルエルシー シリカレンズを全体的に処理して光損傷を低減する方法
JP2016534017A (ja) * 2013-08-29 2016-11-04 コーニング インコーポレイテッド ガラス基板にバイアホールを形成する方法
US10756003B2 (en) 2016-06-29 2020-08-25 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
US11062986B2 (en) 2017-05-25 2021-07-13 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7132034B2 (en) * 1998-03-16 2006-11-07 Lg.Philips Lcd Co., Ltd. Apparatus for etching a glass substrate
JP2007175813A (ja) * 2005-12-27 2007-07-12 Seiko Epson Corp 凹部付き部材の製造方法、凹部付き部材、レンズ基板、透過型スクリーンおよびリア型プロジェクタ
JP2013506616A (ja) * 2009-10-01 2013-02-28 ローレンス リバモア ナショナル セキュリティー， エルエルシー シリカレンズを全体的に処理して光損傷を低減する方法
KR101431928B1 (ko) * 2009-10-01 2014-08-19 로렌스 리버모어 내쇼날 시큐리티, 엘엘시 광 손상을 감소시키기 위해 실리카 광학 소자를 전체적으로 처리하는 방법
JP2016534017A (ja) * 2013-08-29 2016-11-04 コーニング インコーポレイテッド ガラス基板にバイアホールを形成する方法
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
US10756003B2 (en) 2016-06-29 2020-08-25 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes
US11062986B2 (en) 2017-05-25 2021-07-13 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11972993B2 (en) 2017-05-25 2024-04-30 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness

Similar Documents

Publication Publication Date Title
JPS5271871A (en) Washing apparatus
JPS55130839A (en) Uniform etching method of article
JPS55153338A (en) Surface treatment of semiconductor substrate
DE3063956D1 (en) Process for the chemical etching of silicon substrates
JPS56138921A (en) Method of formation for impurity introduction layer
JPS5617021A (en) Surface treatment of substrate
JPS5595327A (en) Reactive sputter-etching
JPS5610368A (en) Method and device for immersion coating
JPS522275A (en) Device of forming semiconductor substrates
JPS5645031A (en) Etching method
JPS5590439A (en) Removal of glass latent flaw
JPS5495398A (en) Method of treating porcelain molding surface
JPS54139172A (en) Device to remove gas contained in insulating oil
JPS55124232A (en) Application method of substrate treatment solution and the device therefor
JPS5550626A (en) Surface treatment of thin plate
JPS644082A (en) Manufacture of oscillatory type transducer
JPS5753199A (en) Diaphragm for speaker
JPS5716170A (en) Etching method of etching anisotropic wafer
JPS5647571A (en) Etching liquid for mo
JPS5643725A (en) Etching device
JPS5477574A (en) Plasma treating apparatus
JPS5268886A (en) Surface treatment method of powder
JPS55164075A (en) Removal of silver from plastic base material
JPS57143831A (en) Process of semiconductor wafer
JPS5675576A (en) Plasma surface treating apparatus