JPS644082A - Manufacture of oscillatory type transducer - Google Patents
Manufacture of oscillatory type transducerInfo
- Publication number
- JPS644082A JPS644082A JP15907387A JP15907387A JPS644082A JP S644082 A JPS644082 A JP S644082A JP 15907387 A JP15907387 A JP 15907387A JP 15907387 A JP15907387 A JP 15907387A JP S644082 A JPS644082 A JP S644082A
- Authority
- JP
- Japan
- Prior art keywords
- film
- substrate
- type transducer
- oscillatory
- stuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
PURPOSE:To manufacture an oscillatory type transducer good in its accuracy, by forming a gap correspondence part and a shell correspondence part on a substrate to be unified with oscillatory beams and then removing the gap correspondence part by an etching method. CONSTITUTION:A silicon oxide film 201 is formed on a substrate 1. Required portions 202 of the film 201 are removed to form an (n) diffusion layer 203 which corresponds to oscillatory beams 3 and 4. Next a recessed part 204 is formed in the substrate 1. Silicon oxide is stuck as a film 205 on a surface of the substrate 1, and on the periphery of the diffusion layer 203 the silicon oxide is stuck in the form of a film 206 corresponding to a gap part 25. Next a part of the film 205 and the film 6 are removed. A film 207 corresponding to a shell 5 is stuck on the films 205 and 206. A fluid injection port 208 is formed in the film 207. HF is poured from the injection port 208 so that the films 205 and 206 are removed by an etching method. Next the injection port 208 is closed. Hence an oscillatory type transducer can be obtained so that oscillation beams and the shell part are formed to be unified with the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15907387A JPH0628320B2 (en) | 1987-06-26 | 1987-06-26 | Vibration transducer manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15907387A JPH0628320B2 (en) | 1987-06-26 | 1987-06-26 | Vibration transducer manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS644082A true JPS644082A (en) | 1989-01-09 |
JPH0628320B2 JPH0628320B2 (en) | 1994-04-13 |
Family
ID=15685627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15907387A Expired - Fee Related JPH0628320B2 (en) | 1987-06-26 | 1987-06-26 | Vibration transducer manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0628320B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04192370A (en) * | 1990-11-26 | 1992-07-10 | Nissan Motor Co Ltd | Semiconductor acceleration sensor |
US5161066A (en) * | 1989-12-25 | 1992-11-03 | Asahi Kogaku Kogyo Kabushiki Kaisha | Engaging mechanism of roller and guide groove in optical element |
JPH07114289B2 (en) * | 1989-02-16 | 1995-12-06 | ウイスコンシン アラムニ リサーチ ファンデーション | Formation of microstructure by removing liquid by freezing and sublimation |
JP2006526509A (en) * | 2003-06-04 | 2006-11-24 | ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | Micro electromechanical device and sealing method and manufacturing method thereof |
-
1987
- 1987-06-26 JP JP15907387A patent/JPH0628320B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07114289B2 (en) * | 1989-02-16 | 1995-12-06 | ウイスコンシン アラムニ リサーチ ファンデーション | Formation of microstructure by removing liquid by freezing and sublimation |
US5161066A (en) * | 1989-12-25 | 1992-11-03 | Asahi Kogaku Kogyo Kabushiki Kaisha | Engaging mechanism of roller and guide groove in optical element |
JPH04192370A (en) * | 1990-11-26 | 1992-07-10 | Nissan Motor Co Ltd | Semiconductor acceleration sensor |
JP2006526509A (en) * | 2003-06-04 | 2006-11-24 | ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | Micro electromechanical device and sealing method and manufacturing method thereof |
JP2011245620A (en) * | 2003-06-04 | 2011-12-08 | Robert Bosch Gmbh | Micro electromechanical system, and method for encapsulating and fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0628320B2 (en) | 1994-04-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |