JPS57143831A - Process of semiconductor wafer - Google Patents

Process of semiconductor wafer

Info

Publication number
JPS57143831A
JPS57143831A JP3020481A JP3020481A JPS57143831A JP S57143831 A JPS57143831 A JP S57143831A JP 3020481 A JP3020481 A JP 3020481A JP 3020481 A JP3020481 A JP 3020481A JP S57143831 A JPS57143831 A JP S57143831A
Authority
JP
Japan
Prior art keywords
etching
wafer
semiconductor wafer
wheel
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3020481A
Other languages
Japanese (ja)
Inventor
Hachiro Hiratsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3020481A priority Critical patent/JPS57143831A/en
Publication of JPS57143831A publication Critical patent/JPS57143831A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To shorten semiconductor wafer process and reduce cutting margin, by chamfering a semiconductor wafer chemically. CONSTITUTION:A silicon wafer 1 is supported by a rotational supporter 2. It is rotated by pressing vertically to an ethylene tetrafluoride fiber 7 of a rotational etching wheel 3. The lower side of etching wheel 3 is soaked in etching reagent 5 filling an etching reagent tank 4 while rotating. New etching reagent is supplied within the ethylene tetrafluoride fiber 7. The wafer is given etching reaction at the time of contacting with the wafer surrounding. As a result, the wafer surrounding becomes a chamfered wafer having the same shape as an etching wheel groove. This chemical chamfering process omits the whole surface etching after processing.
JP3020481A 1981-03-03 1981-03-03 Process of semiconductor wafer Pending JPS57143831A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3020481A JPS57143831A (en) 1981-03-03 1981-03-03 Process of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3020481A JPS57143831A (en) 1981-03-03 1981-03-03 Process of semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS57143831A true JPS57143831A (en) 1982-09-06

Family

ID=12297202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3020481A Pending JPS57143831A (en) 1981-03-03 1981-03-03 Process of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS57143831A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0368334A2 (en) * 1988-11-11 1990-05-16 Kabushiki Kaisha Toshiba Etching apparatus and method of using the same
JPH02142527U (en) * 1989-04-29 1990-12-04

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0368334A2 (en) * 1988-11-11 1990-05-16 Kabushiki Kaisha Toshiba Etching apparatus and method of using the same
JPH02142527U (en) * 1989-04-29 1990-12-04

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