JPH06268022A - Device for attaching conductive film - Google Patents
Device for attaching conductive filmInfo
- Publication number
- JPH06268022A JPH06268022A JP5194893A JP5194893A JPH06268022A JP H06268022 A JPH06268022 A JP H06268022A JP 5194893 A JP5194893 A JP 5194893A JP 5194893 A JP5194893 A JP 5194893A JP H06268022 A JPH06268022 A JP H06268022A
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- tape
- fixed block
- reel
- suction head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液晶パネルなどの表示
パネルにドライバＩＣをＴＡＢ実装法により接着するた
めの導電膜を表示パネルの電極に貼着するための導電膜
の貼着装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive film sticking device for sticking a conductive film for bonding a driver IC to a display panel such as a liquid crystal panel by a TAB mounting method to an electrode of the display panel. Is.
【０００２】[0002]
【従来の技術】液晶パネルなどの表示パネルのドライバ
ＩＣとしては、ＴＡＢ（Ｔａｐｅ Ａｕｔｏｍａｔｅｄ
Ｂｏｎｄｉｎｇ）法により製造された電子部品が多用
されている。またドライバと表示パネルの接着方法とし
て、異方性の導電膜を使用する方法が知られている。図
４（ａ）（ｂ）（ｃ）は、ＴＡＢ法により製造されたド
ライバＩＣを表示パネルに接着するため、従来の導電膜
の貼着装置の動作を示す正面図である。図４（ａ）にお
いて、４は導電膜テープであって、テープ状の導電膜１
と上層間テープ２と下層間テープ３を積層した３層構造
となっている。導電膜１は、導電性の金属粒子が混入さ
れたエポキシ系の合成樹脂などにより形成されている
が、表示パネルに貼着できるように粘着性を有している
ので、供給リール（図外）に巻回している際に、導電膜
１同士が貼着するのを防止するために、上層間テープ２
と下層間テープ３が積層されている。2. Description of the Related Art As a driver IC for a display panel such as a liquid crystal panel, a TAB (Tape Automated) is used.
Electronic components manufactured by the Bonding method are widely used. As a method for adhering the driver and the display panel, a method using an anisotropic conductive film is known. FIGS. 4A, 4B, and 4C are front views showing the operation of the conventional conductive film sticking apparatus for sticking the driver IC manufactured by the TAB method to the display panel. In FIG. 4A, 4 is a conductive film tape, which is a tape-shaped conductive film 1
It has a three-layer structure in which the upper interlayer tape 2 and the lower interlayer tape 3 are laminated. The conductive film 1 is formed of an epoxy-based synthetic resin mixed with conductive metal particles, but has adhesiveness so that it can be attached to a display panel, so that the supply reel (not shown) In order to prevent the conductive films 1 from sticking to each other during winding,
And the lower interlayer tape 3 are laminated.
【０００３】１５は吸着ヘッドであって、導電膜１の上
面に貼着された上層間テープ２を真空吸着してピックア
ップし、導電膜１を表示パネル（図外）の所定の電極に
貼着する。１６は吸着ヘッド１５に形成された吸引孔、
３４は吸引用のチューブである。５は導電膜１の引き出
し手段であって、図示しない移動手段により吸着ヘッド
１５の下方を水平移動し、クランパ６により導電膜１と
上層間テープ２の先端部をクランプして吸着ヘッド１５
の下方へ引き出す。７は固定ブロックであって、導電膜
１の導出路の下方に配設されている。８は導電膜１を固
定ブロック７の上面に押え付ける押え手段であって、押
えブロック９と、この押えブロック９を上下動作させる
シリンダ１０から成っている。１１は固定ブロック７お
よび押え手段８と、吸着ヘッド１５の間に設けられたカ
ッター、１２，１３は導電膜テープ４や下層間テープ３
のガイドローラである。Reference numeral 15 denotes a suction head, which vacuum-sucks and picks up the upper interlayer tape 2 attached to the upper surface of the conductive film 1, and attaches the conductive film 1 to a predetermined electrode of a display panel (not shown). To do. 16 is a suction hole formed in the suction head 15,
Reference numeral 34 is a suction tube. Denoted at 5 is a means for pulling out the conductive film 1. The moving means (not shown) horizontally moves the suction head 15 below and the clamper 6 clamps the leading ends of the conductive film 1 and the upper interlayer tape 2 to suck the suction head 15.
Pull out below. A fixed block 7 is arranged below the lead-out path of the conductive film 1. A pressing means 8 holds the conductive film 1 on the upper surface of the fixed block 7, and includes a pressing block 9 and a cylinder 10 for vertically moving the pressing block 9. 11 is a cutter provided between the fixed block 7 and the pressing means 8 and the suction head 15, and 12 and 13 are the conductive film tape 4 and the lower interlayer tape 3.
Is a guide roller.
【０００４】次にこの導電膜の貼着装置の動作を説明す
る。図４（ａ）に示すように、導電膜１と上層間テープ
２の先端部を引き出し手段５のクランパ６によりクラン
プする。導電膜１と上層間テープ２と下層間テープ３
は、３層構造の導電膜テープ４として供給リールから一
緒に導出されたものであるが、その途中において下層間
テープ３はガイドローラ１３を周回しながら導電膜１か
ら剥離される。Next, the operation of the sticking device for the conductive film will be described. As shown in FIG. 4A, the tip ends of the conductive film 1 and the upper interlayer tape 2 are clamped by the clamper 6 of the drawing means 5. Conductive film 1, upper interlayer tape 2, lower interlayer tape 3
Is drawn out from the supply reel together as a conductive film tape 3 having a three-layer structure, and the lower interlayer tape 3 is separated from the conductive film 1 while orbiting the guide roller 13 in the middle thereof.
【０００５】次に図４（ｂ）に示すように引き出し手段
５は右方へ移動し、導電膜１と上層間テープ２を吸着ヘ
ッド１５の下方へ引き出すとともに、吸着ヘッド１５は
下降してその下面に上層間テープ２を真空吸着する。こ
のとき、導電膜１から剥離した下層間テープ３は巻取り
リールに巻取られる。Next, as shown in FIG. 4 (b), the pull-out means 5 moves to the right, pulls out the conductive film 1 and the upper interlayer tape 2 below the suction head 15, and the suction head 15 descends. The upper interlayer tape 2 is vacuum-adsorbed on the lower surface. At this time, the lower interlayer tape 3 separated from the conductive film 1 is wound on the winding reel.
【０００６】次に図４（ｃ）に示すように、シリンダ１
０のロッド１４が突出して押えブロック９は下降し、導
電膜１と上層間テープ２を固定ブロック７の上面に押え
付けたうえで、カッター１１が上下動作をして導電膜１
と上層間テープ２を所定長さに切断する。次に引き出し
手段５のクランパ６のクランプ状態を解除するととも
に、吸着ヘッド１５は上下動作をして、導電膜１が貼着
された上層間テープ２をピックアップし、次に吸着ヘッ
ド１５と表示パネルを相対的に水平方向や回転方向に移
動させて導電膜１と表示パネルの電極を位置合わせした
うえで、導電膜１を表示パネルの電極に貼着する。その
後、上層間テープ２は導電膜１から剥ぎ取られ、むき出
しになった導電膜１上にドライバＩＣが接着される。Next, as shown in FIG. 4 (c), the cylinder 1
The rod 14 of 0 projects and the pressing block 9 descends to press the conductive film 1 and the upper interlayer tape 2 on the upper surface of the fixed block 7, and the cutter 11 moves up and down to move the conductive film 1
And the upper interlayer tape 2 is cut into a predetermined length. Next, the clamped state of the clamper 6 of the pull-out means 5 is released, and the suction head 15 moves up and down to pick up the upper interlayer tape 2 to which the conductive film 1 is attached, and then the suction head 15 and the display panel. Is relatively moved in the horizontal direction and the rotating direction to align the conductive film 1 and the electrode of the display panel, and then the conductive film 1 is attached to the electrode of the display panel. After that, the upper interlayer tape 2 is peeled off from the conductive film 1, and the driver IC is bonded onto the exposed conductive film 1.
【０００７】[0007]
【発明が解決しようとする課題】固定ブロック７と押え
手段８は、カッター１１により導電膜１と上層間テープ
２を切断する際に、これらがふらつくのを阻止して確実
に切断するために設けられたものである。ところが上記
従来のものは、下層間テープ３が剥離されてむき出しに
なった導電膜１を固定ブロック７の上面に沿わせ、押え
ブロック９により固定ブロック７の上面に押え付けるよ
うになっていたため、導電膜１が固定ブロック７の上面
にかなり強く貼着し、その結果、引き出し手段５による
引き出しに支障をきたしやすい問題点や、固定ブロック
７の上面に導電膜１の貼着物が付着しやすく、したがっ
て固定ブロック７の上面を適宜クリーニングして付着し
た貼着物を除去しなければならないため保守管理に手間
を要するなどの問題点があった。The fixing block 7 and the pressing means 8 are provided to prevent the wobbling of the conductive film 1 and the upper interlayer tape 2 when they are cut by the cutter 11 and to surely cut them. It has been done. However, in the above-mentioned conventional device, the conductive film 1 exposed by peeling off the lower interlayer tape 3 is arranged along the upper surface of the fixed block 7 and is pressed by the pressing block 9 onto the upper surface of the fixed block 7. The conductive film 1 adheres to the upper surface of the fixed block 7 fairly strongly, and as a result, there is a problem that the extraction means 5 tends to interfere with the drawing, and the adhered material of the conductive film 1 easily adheres to the upper surface of the fixed block 7, Therefore, the upper surface of the fixed block 7 has to be appropriately cleaned to remove the adhered adhered matter, which causes a problem that maintenance is troublesome.
【０００８】そこで本発明は、上記従来手段の問題点を
解消し、導電膜が固定ブロックに貼着するのを解消でき
る導電膜の貼着装置を提供することを目的とする。Therefore, an object of the present invention is to provide a sticking device for a conductive film which solves the problems of the above-mentioned conventional means and can prevent the conductive film from sticking to a fixed block.
【０００９】[0009]
【課題を解決するための手段】このために本発明は、導
電膜と一緒に供給リールから導出された下層間テープ
を、導電膜と一緒に固定ブロックの上面に沿わせた後、
固定ブロックの下方へ迂回させることにより導電膜から
剥離させ、巻取りリールに巻取るようにしている。To this end, the present invention provides a method in which a lower interlayer tape led out from a supply reel together with a conductive film is placed along the upper surface of a fixed block together with the conductive film.
By detouring below the fixed block, it is peeled off from the conductive film and wound on a winding reel.
【００１０】[0010]
【作用】上記構成によれば、押え手段により導電膜を固
定ブロックに押え付ける際には、下層間テープが導電膜
と固定ブロックの間に存在するため、導電膜が固定ブロ
ックの上面に貼着することはなく、したがって引き出し
手段により導電膜をスムーズに引き出すことができる。According to the above construction, when the conductive film is pressed onto the fixed block by the pressing means, the lower interlayer tape is present between the conductive film and the fixed block, so that the conductive film is attached to the upper surface of the fixed block. Therefore, the conductive film can be smoothly drawn out by the drawing means.
【００１１】[0011]
【実施例】次に、図面を参照しながら本発明の実施例を
説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１２】図１は導電膜の貼着装置の斜視図である。
図４に示す従来のものと同一構成部品には同一符号を付
すことにより、その説明は省略する。２１は位置決め部
であって、表示パネル２２が載置されている。表示パネ
ル２２の側端部には導電膜１を貼着する電極２３が形成
されている。FIG. 1 is a perspective view of a sticking device for a conductive film.
The same components as those of the conventional one shown in FIG. 4 are designated by the same reference numerals, and the description thereof will be omitted. Reference numeral 21 is a positioning portion on which a display panel 22 is placed. An electrode 23 to which the conductive film 1 is attached is formed on a side end portion of the display panel 22.
【００１３】位置決め部２１の上方には立壁２４が設け
られており、その前面には以下に述べる部品が組み付け
られている。２５は供給リールであって、上述した導電
膜１、上層間テープ２、下層間テープ３の３層構造の導
電膜テープ４が巻回されている。この導電膜テープ４は
ガイドローラ１２に沿って導出される。供給リール２５
の下方には巻取りリール２６が設けられており、導電膜
１から剥離した下層間テープ３を巻取る。２７は立壁２
４の背面に設けられた巻取りリール２６の駆動用モータ
である。A standing wall 24 is provided above the positioning portion 21, and the following parts are assembled on the front surface thereof. Reference numeral 25 denotes a supply reel around which the conductive film 1 having the three-layer structure of the conductive film 1, the upper interlayer tape 2 and the lower interlayer tape 3 is wound. The conductive film tape 4 is led out along the guide roller 12. Supply reel 25
A take-up reel 26 is provided below the film, and winds the lower interlayer tape 3 separated from the conductive film 1. 27 is a standing wall 2
4 is a drive motor for the take-up reel 26 provided on the back surface of the No. 4 reel.
【００１４】立壁２４の右側にはブラケット３１が装着
されており、このブラケット３１上にシリンダ３２が載
置されている。シリンダ３２のロッド３３には吸着ヘッ
ド１５が結合されており、ロッド３３が突出すると吸着
ヘッド１５は下降し、ロッド３３が引き込むと吸着ヘッ
ド１５は上昇する。３４は吸着ヘッド１５に連結された
チューブであって、吸引装置（図外）に接続されてお
り、このチューブ３４で吸着ヘッド１５の内部を真空吸
引することにより、吸着ヘッド１５の下面に上層間テー
プ２を真空吸着する。A bracket 31 is mounted on the right side of the standing wall 24, and a cylinder 32 is mounted on the bracket 31. The suction head 15 is coupled to the rod 33 of the cylinder 32. When the rod 33 projects, the suction head 15 moves down, and when the rod 33 retracts, the suction head 15 moves up. Reference numeral 34 denotes a tube connected to the suction head 15, which is connected to a suction device (not shown). By vacuum suctioning the inside of the suction head 15 with this tube 34, the upper layer is attached to the lower surface of the suction head 15. The tape 2 is vacuum-adsorbed.
【００１５】ガイドローラ１２よりも下流の導電膜テー
プ４の水平な導出路の上方にはブラケット３５が配設さ
れており、このブラケット３５に押え手段８のシリンダ
１０が載置されている。導電膜テープ４の導出路の下方
には固定ブロック４１が設けられており、またその上方
にはシリンダ１０のロッド１４に結合された押えブロッ
ク９が位置している。A bracket 35 is disposed above the horizontal lead-out path of the conductive film tape 4 downstream of the guide roller 12, and the cylinder 10 of the pressing means 8 is mounted on the bracket 35. A fixed block 41 is provided below the lead-out path of the conductive film tape 4, and a holding block 9 connected to the rod 14 of the cylinder 10 is located above the fixed block 41.
【００１６】図２は固定ブロック４１の斜視図である。
この固定ブロック４１は略箱形であって、その右側下部
の切欠部内にはガイドローラ４２が軸着されている。４
３は固定ブロック４１の止めビスである。図示するよう
に、導電膜テープ４は３層構造のままで固定ブロック４
１の上面に沿うように導出され、下層間テープ３のみが
固定ブロック４１の右肩部に沿いながら導電膜１から剥
離した後、固定ブロック４１の下方へ迂回して巻取りリ
ール２６に巻取られる。すなわちこの固定ブロック４１
は、導電膜テープ４の固定手段と、下層間テープ３を導
電膜１から剥離するための剥離手段を兼務している。FIG. 2 is a perspective view of the fixed block 41.
The fixed block 41 has a substantially box shape, and a guide roller 42 is axially mounted in a cutout portion on the lower right side thereof. Four
Reference numeral 3 is a fixing screw for the fixed block 41. As shown in the figure, the conductive film tape 4 remains the three-layer structure and the fixed block 4
1 is removed along the upper surface of the fixed block 41, and only the lower interlayer tape 3 is peeled off from the conductive film 1 along the right shoulder of the fixed block 41, and then detoured below the fixed block 41 and wound on the take-up reel 26. To be That is, this fixed block 41
Also serves as a fixing means for the conductive film tape 4 and a peeling means for peeling the lower interlayer tape 3 from the conductive film 1.
【００１７】この導電膜の貼着装置は上記のような構成
より成り、次に図３（ａ）（ｂ）（ｃ）を参照しながら
動作を説明する。The conductive film sticking device has the above-mentioned structure, and the operation will be described with reference to FIGS. 3 (a), 3 (b) and 3 (c).
【００１８】図３（ａ）に示すように、導電膜１と上層
間テープ２の先端部を引き出し手段５のクランパ６によ
りクランプする。次に図３（ｂ）に示すように、引き出
し手段５は右方へ移動し、導電膜１と上層間テープ２を
吸着ヘッド１５の下方へ引き出す。このとき、モータ２
７は駆動して巻取りリール２６は回転し、導電膜１から
剥離された下層間テープ３を巻取る。As shown in FIG. 3A, the tips of the conductive film 1 and the upper interlayer tape 2 are clamped by the clamper 6 of the drawing means 5. Next, as shown in FIG. 3B, the pull-out means 5 moves to the right and pulls out the conductive film 1 and the upper interlayer tape 2 below the suction head 15. At this time, the motor 2
7 is driven to rotate the take-up reel 26, and the lower interlayer tape 3 separated from the conductive film 1 is taken up.
【００１９】次にシリンダ３２のロッド３３は突出し、
吸着ヘッド１５は下降してその下面に上層間テープ２を
真空吸着する。次に図３（ｃ）に示すように、シリンダ
１０のロッド１４が突出して押えブロック９は下降し、
導電膜テープ４を固定ブロック４１の上面に押え付けた
うえで、カッター１１が上下動作をして導電膜１と上層
間テープ２を所定長さに切断する。次に引き出し手段５
のクランパ６のクランプ状態を解除したうえで、吸着ヘ
ッド１５は、その下面に真空吸着した導電膜１と上層間
テープ２をピックアップし、導電膜１と表示パネル２２
の電極２３の位置合わせをしたうえで、導電膜１を電極
２３上に貼着する。Next, the rod 33 of the cylinder 32 projects,
The suction head 15 descends and vacuum-sucks the upper interlayer tape 2 on its lower surface. Next, as shown in FIG. 3 (c), the rod 14 of the cylinder 10 projects and the pressing block 9 descends.
After pressing the conductive film tape 4 on the upper surface of the fixed block 41, the cutter 11 moves up and down to cut the conductive film 1 and the upper interlayer tape 2 into a predetermined length. Next, withdrawal means 5
After the clamper 6 is released from the clamped state, the suction head 15 picks up the conductive film 1 and the upper interlayer tape 2 that are vacuum-sucked on the lower surface thereof, and the conductive film 1 and the display panel 22.
After the electrode 23 is aligned, the conductive film 1 is attached to the electrode 23.
【００２０】上記動作において、押えブロック９で導電
膜テープ４を固定ブロック４１の上面に押え付ける際に
は、下層間テープ３が導電膜１と固定ブロック４１の間
に存在するので、押えブロック９で押え付けても導電膜
１が固定ブロック４１に貼着されることはなく、したが
って引き出し手段５による導電膜１と上層間テープ２の
引き出しをスムーズに行える。In the above operation, when the conductive block 4 is pressed on the upper surface of the fixed block 41 by the pressing block 9, the lower interlayer tape 3 is present between the conductive film 1 and the fixed block 41, so that the pressing block 9 is pressed. The conductive film 1 is not stuck to the fixed block 41 even if the conductive film 1 is pressed by, so that the conductive film 1 and the upper interlayer tape 2 can be smoothly drawn by the drawing means 5.
【００２１】なお、導電膜１と表示パネル２２の電極２
３を位置合わせするために、吸着ヘッド１５と表示パネ
ル２２を相対的に水平方向や回転方向に移動させるため
の移動手段、引き出し手段５を吸着ヘッド１５の下方を
水平移動させる移動手段、クランパ６の開閉動作を行わ
せるための駆動手段などの公知手段は、図面が煩雑にな
るので説明を省略している。Incidentally, the conductive film 1 and the electrode 2 of the display panel 22.
3, the suction head 15 and the display panel 22 are moved relative to each other in the horizontal and rotational directions, the pull-out means 5 is moved horizontally below the suction head 15, and the clamper 6 is used. Description of publicly known means such as driving means for performing the opening / closing operation is omitted because the drawing becomes complicated.
【００２２】[0022]
【発明の効果】以上説明したように本発明の導電膜の貼
着装置によれば、押え手段により導電膜を固定ブロック
に押え付ける際には、下層間テープが導電膜と固定ブロ
ックの間に存在するため、導電膜が固定ブロックの上面
に貼着することはなく、したがって引き出し手段により
導電膜をスムーズに引き出すことができ、また固定ブロ
ックの上面に導電膜の貼着物が付着することがないの
で、固定ブロックの上面のクリーニングも不要になる。As described above, according to the conductive film sticking apparatus of the present invention, when the conductive film is pressed onto the fixed block by the pressing means, the lower interlayer tape is placed between the conductive film and the fixed block. Since the conductive film does not exist, the conductive film does not adhere to the upper surface of the fixed block, and therefore the conductive film can be smoothly drawn out by the extraction means, and the adhered object of the conductive film does not adhere to the upper surface of the fixed block. Therefore, it is not necessary to clean the upper surface of the fixed block.
【図１】本発明の一実施例の導電膜の貼着装置の斜視図FIG. 1 is a perspective view of a conductive film attaching apparatus according to an embodiment of the present invention.
【図２】本発明の一実施例の導電膜の貼着装置の固定ブ
ロックの斜視図FIG. 2 is a perspective view of a fixing block of a conductive film attaching apparatus according to an embodiment of the present invention.
【図３】（ａ）本発明の一実施例の導電膜の貼着装置に
よる導電膜の貼着中の要部正面図 （ｂ）本発明の一実施例の導電膜の貼着装置による導電
膜の貼着中の要部正面図 （ｃ）本発明の一実施例の導電膜の貼着装置による導電
膜の貼着中の要部正面図FIG. 3A is a front view of a main part of the conductive film sticking apparatus according to the embodiment of the present invention during sticking of the conductive film. FIG. 3B is a conductive view of the conductive film sticking apparatus according to the embodiment of the present invention. (C) Front view of main part during sticking of film (c) Front view of main part during sticking of conductive film by sticking device for conductive film of one embodiment of the present invention
【図４】（ａ）従来の導電膜の貼着装置による導電膜の
貼着中の要部正面図 （ｂ）従来の導電膜の貼着装置による導電膜の貼着中の
要部正面図 （ｃ）従来の導電膜の貼着装置による導電膜の貼着中の
要部正面図FIG. 4 (a) is a front view of a main part of a conventional conductive film sticking device during sticking of a conductive film. FIG. 4 (b) is a front view of a main part of a conventional conductive film sticking device during sticking of a conductive film. (C) A front view of the main part of the conventional conductive film sticking device during sticking of the conductive film
１ 導電膜 ３ 下層間テープ ４ 導電膜テープ ５ 引き出し手段 ８ 押え手段 １１ カッター（切断手段） １５ 吸着ヘッド ２１ 位置決め部 ２２ 表示パネル ２５ 供給リール ２６ 巻取りリール ４１ 固定ブロック DESCRIPTION OF SYMBOLS 1 conductive film 3 lower layer tape 4 conductive film tape 5 drawing means 8 holding means 11 cutter (cutting means) 15 suction head 21 positioning part 22 display panel 25 supply reel 26 take-up reel 41 fixed block
Claims (1)
プ状の導電膜および下層間テープが巻回された供給リー
ルと、この下層間テープを巻取る巻取りリールと、前記
供給リールから導出された前記導電膜を下面に吸着する
吸着ヘッドと、この吸着ヘッドを前記表示パネルに対し
て上下動作を行わせる上下動手段と、前記導電膜を引き
出す引き出し手段と、前記導電膜の導出路に設けられて
この導電膜を切断する切断手段と、前記供給リールと前
記切断手段の間の前記導電膜の導出路の下方に設けられ
た導電膜の固定ブロックと、この固定ブロックの上方に
設けられて上下動作を行うことにより導電膜を固定ブロ
ックの上面に押え付ける押え手段とを備え、前記導電膜
と前記下層間テープをこの固定ブロックの上面に沿わ
せ、更に前記下層間テープをこの固定ブロックの下方へ
迂回させることにより前記導電膜から剥離して、前記巻
取りリールに巻取るようにしたことを特徴とする導電膜
の貼着装置。1. A positioning unit for mounting a display panel, a supply reel on which a tape-shaped conductive film and a lower interlayer tape are wound, a take-up reel for winding the lower interlayer tape, and a lead-out reel derived from the supply reel. A suction head for sucking the conductive film on the lower surface, a vertical moving means for moving the suction head up and down with respect to the display panel, a drawing means for drawing the conductive film, and a lead-out path for the conductive film. A cutting means is provided to cut the conductive film, a fixed block of the conductive film is provided below the lead-out path of the conductive film between the supply reel and the cutting means, and is provided above the fixed block. And holding means for holding the conductive film on the upper surface of the fixed block by performing vertical movements to move the conductive film and the lower interlayer tape along the upper surface of the fixed block. Peeled from the conductive layer by diverting-loop downward of the fixing block, sticking apparatus of the conductive film, which has to take up on the take-up reel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05194893A JP3151995B2 (en) | 1993-03-12 | 1993-03-12 | Apparatus for sticking conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05194893A JP3151995B2 (en) | 1993-03-12 | 1993-03-12 | Apparatus for sticking conductive film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06268022A true JPH06268022A (en) | 1994-09-22 |
| JP3151995B2 JP3151995B2 (en) | 2001-04-03 |
Family
ID=12901105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05194893A Expired - Fee Related JP3151995B2 (en) | 1993-03-12 | 1993-03-12 | Apparatus for sticking conductive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3151995B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000042743A (en) * | 1998-12-26 | 2000-07-15 | 전주범 | Method and device for heat-addition-compressing anisotropic conductive film and method for automatically operating |
| JP2005173310A (en) * | 2003-12-12 | 2005-06-30 | Matsushita Electric Ind Co Ltd | Adhesive tape affixing system and adhesive tape affixing method |
| US7050138B1 (en) | 1995-03-10 | 2006-05-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a display device having a driver circuit attached to a display substrate |
| JP2008016651A (en) * | 2006-07-06 | 2008-01-24 | Dainippon Printing Co Ltd | Component built-in wiring board and its manufacturing method |
| KR100827823B1 (en) * | 2006-09-19 | 2008-05-07 | 주식회사 싸이텍 | Adhesion Apparatus and Method of Gasket |
-
1993
- 1993-03-12 JP JP05194893A patent/JP3151995B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7050138B1 (en) | 1995-03-10 | 2006-05-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a display device having a driver circuit attached to a display substrate |
| US7446843B2 (en) | 1995-03-10 | 2008-11-04 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of fabricating the same |
| US8013972B2 (en) | 1995-03-10 | 2011-09-06 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of fabricating the same |
| US8547516B2 (en) | 1995-03-10 | 2013-10-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of fabricating the same |
| KR20000042743A (en) * | 1998-12-26 | 2000-07-15 | 전주범 | Method and device for heat-addition-compressing anisotropic conductive film and method for automatically operating |
| JP2005173310A (en) * | 2003-12-12 | 2005-06-30 | Matsushita Electric Ind Co Ltd | Adhesive tape affixing system and adhesive tape affixing method |
| JP2008016651A (en) * | 2006-07-06 | 2008-01-24 | Dainippon Printing Co Ltd | Component built-in wiring board and its manufacturing method |
| KR100827823B1 (en) * | 2006-09-19 | 2008-05-07 | 주식회사 싸이텍 | Adhesion Apparatus and Method of Gasket |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3151995B2 (en) | 2001-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5173708B2 (en) | Electronic component mounting apparatus and mounting method | |
| JPH06268022A (en) | Device for attaching conductive film | |
| JP5173709B2 (en) | Electronic component mounting apparatus and mounting method | |
| JP3149679B2 (en) | Cassette for storing anisotropic conductive tape and sticking device for anisotropic conductive tape | |
| JP3075005B2 (en) | Method for attaching conductive film and apparatus for attaching conductive film | |
| JP3324393B2 (en) | Anisotropic conductive tape sticking device | |
| JP2004250153A (en) | Adhesion method and adhesion device for sheet-like film | |
| JP4941841B2 (en) | Adhesive tape sticking device and sticking method | |
| JP2010080875A (en) | Punching device, and apparatus and method for mounting electronic component | |
| JP5336153B2 (en) | Electronic component mounting apparatus and mounting method | |
| JPH09199543A (en) | Mounting device of chip | |
| JP2921315B2 (en) | Adhesion method of conductive film | |
| JPH06263330A (en) | Supply reel for conductive film tape | |
| JPH0672624A (en) | Film peeling-off device | |
| JP2011181838A (en) | Apparatus and method for sticking adhesive tape | |
| JP3409560B2 (en) | Anisotropic conductive tape sticking device | |
| JP2004091192A (en) | Tape residual quantity detecting mechanism, tape member sticking device loaded with the mechanism and tape member sticking method | |
| JP3063436B2 (en) | Apparatus for sticking conductive film | |
| JPH06163643A (en) | Conductive film sticking device | |
| JP2976752B2 (en) | Apparatus and method for separating anisotropic conductive tape | |
| JPH09220763A (en) | Apparatus and method for bonding anisotropic conductive tape | |
| JP2833372B2 (en) | Wire bonding equipment | |
| JP2002234649A (en) | Sheet sticking device | |
| JPH06244530A (en) | Compression-bonding apparatus for conductive adhesive film | |
| JPH0646811Y2 (en) | Tab pasting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 7 Free format text: PAYMENT UNTIL: 20080126 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 8 Free format text: PAYMENT UNTIL: 20090126 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090126 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100126 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 10 Free format text: PAYMENT UNTIL: 20110126 |
|
| LAPS | Cancellation because of no payment of annual fees |