KR20000042743A - Method and device for heat-addition-compressing anisotropic conductive film and method for automatically operating - Google Patents

Abstract

PURPOSE: A method and a device for heat-additive-compressing an anisotropic conductive film and a method for automatically operating are provided to temporarily compress the anisotropic conductive film from an anisotropic conductive film tape on a TMA(thin film micromirror array actuated) for connecting the lead portion of a TCP(tape carrier package) to the lead portion of each TMA. CONSTITUTION: A TMA(1) disk is inputted to a correct location of an Xy theta table(35) for being fixed by using a vacuum adsorbing instrument(35'). An anisotropic conductive film(18) is attached on the X11 location of the TMA from the compressing location of a compressing head(22). Then, an upper protecting film(19') is peeled off from the anisotropic conductive film for moving the X12 location of the TMA to a compressing location by using the table. Moreover, the attachment and the peeling off are operated at the X12 location of the TMA. The Y1 location of the TMA is moved to the compressing location by using the table for operating the attachment and the peeling off again. Thus, the X21, the X22, and the Y2 locations of the TMA are moved to the compressing location for operating the attachment and the peeling off.

Description

Pressure bonding method of anisotropic conductive film, apparatus and automatic operation control method

The present invention relates to a pressure-adhesive method of the anisotropic conductive film, a device and an automatic operation control method, and more particularly, from anisotropic conductive film tape to connect the lead portion of the tape carrier package (TCP) to the lead portion of each TMA. The present invention relates to a pressure-adhering method of anisotropic conductive films for pressing and bonding only anisotropic conductive films to a TMA, an apparatus thereof, and an automatic operation control method.

1 shows an example of a tape carrier package as a plan view, and FIG. 2 shows a structure of an anisotropic conductive film tape for mounting a tape carrier package on a TMA as a cross-sectional view.

In FIG. 1, the TCP 10 has a thin film micromirror array actuated (TMA) 1 or an IC chip 11 for a driving drive for an LCD, and an input lead unit for electrical connection to an external device and the TMA 1. The 16 and the output lead portion 14 are formed via the pattern portions 13 and 15, and the test pad portion 14 'is formed in the output lead portion 14.

The TCP 10 formed as described above is an anisotropic conductive film (ACF) as shown in FIG. 1 by a tape automated bonding (TAB) method at the input lead portion 16 and the output lead portion 14. By 18, it is mounted in the same element as TMA1.

The structure of the anisotropic conductive film tape 19 is shown in FIG.

In Fig. 2, the anisotropic conductive film tape 19 has a transparent upper protective film 19 'and a white lower protective film 19 " attached to the upper and lower portions of the anisotropic conductive film 18. The anisotropic conductive film tape thus constructed is attached. The upper passivation film 19 'and the lower passivation film 19 "are removed from 19, and only the anisotropic conductive film 18 is cut by the hand gripper to a predetermined length to the lead portion 1' of the TMA 1. After pressing, the lid 14 of the TCP 10 is pressed to be mounted.

However, as described above, the upper passivation film 19 'and the lower passivation film 19 "are removed from the anisotropic conductive film tape 19, and only the anisotropic conductive film 18 is cut by a hand gripper to a predetermined length to make a TMA ( The process of compressing the lead portion 1 'of 1) has a problem that it is cumbersome and the productivity is lowered. Also, the process of automating with the existing tape feeder and cutting device is the upper protective film 19' and the lower protective film 19 After peeling off the " and cutting the anisotropic conductive film 18 by the cutting device, a separate device for transferring the cut anisotropic conductive film 18 is required, and in order to eliminate the transfer device, extra anisotropy is again after pressing. There was a problem in that the conductive film 18 had to be cut and could not be easily configured.

In addition, in the apparatus for connecting the drive driver of the conventional LCD, only one side is press-bonded, and its configuration is very complicated, and thus it is difficult to apply to the TMA 1 that requires the TCP 10 to be connected to four sides.

Accordingly, the present invention is to solve this problem, by removing the upper protective film film from the anisotropic conductive film tape and cutting only the anisotropic conductive film to press-bond the cut anisotropic conductive film to the lead portion of the TMA, It is an object of the present invention to provide a pressure-adhering method of anisotropic conductive film, and a device and an automatic operation control method thereof, which can be removed by winding a protective film and can be operated manually or automatically by using a touch screen.

1 is a plan view illustrating a state in which a tape carrier package is mounted on a TMA using an anisotropic conductive film;

2 is a cross-sectional view showing the structure of an anisotropic conductive film tape for mounting a tape carrier package on a TMA,

Figure 3a is a schematic diagram showing the configuration of the pressing device of the anisotropic conductive film according to an embodiment of the present invention, Figure 3b is a front view of a specific pressing device, Figure 3c is a side view,

Figure 4 is a process diagram showing the configuration of a pressure bonding method of the anisotropic conductive film according to another embodiment of the present invention,

5 is a configuration diagram showing the configuration of an external operation unit for operating the apparatus of the present invention;

6 is a screen configuration diagram showing a touch screen operation unit;

7 is a screen configuration diagram for editing data of a TMA;

8 is a screen configuration diagram for the teaching mode;

9 is a screen configuration diagram for manual operation;

10 is a flowchart for explaining an automatic operation control method.

<Description of the symbols for the main parts of the drawings>

1: TMA (thin film micro-mirror array actuated) 1 ': lead portion

10: TCP (tape carrier package) 11: IC chip

12: film portion 13, 15: pattern portion

14,16: lead portion 14 ': pad portion

18: Anisotropic Conductive Film (ACF) 18 ': Peeling Conductive Film

19: Anisotropic conductive film tape 19 ': Upper protective film

19 ": Lower protective film 20: Supply reel

21: lower protective film reel 22: crimping head

23: upper protective film film reel 30: supply unit

31: cutting device 32: ACF chuck

33: peeling bar 35: XYθ table

40: external control unit 50: direction keys

51, 52, 53: touch screen 60: manual control panel

In order to achieve the above object, the pressure bonding device of the anisotropic conductive film according to the embodiment of the present invention includes X11, X12 and X21, respectively, on the X1 and X2 sides of the four sides (X1, X2, Y1, Y2) of the TMA. In order to squeeze the anisotropic conductive film in the lead portion of the X22 position, only the anisotropic conductive film is prescribed from the peeling conductive film in which the lower protective film is separated from the anisotropic conductive film tape in which the lower protective film and the upper protective film overlap the upper and lower portions of the anisotropic conductive film. A pressure bonding method of anisotropic conductive film that is cut and compressed to a length, comprising: a feeding step of inserting a TMA disc at a fixed position of an XYθ table and fixing it by vacuum suction means; Attaching the anisotropic conductive film to the X11 position of the inserted TMA at the crimping position of the crimping head; Separating the upper protective film from the anisotropic conductive film; A moving step of moving the X12 position of the TMA to the crimp position by using the XYθ table; A first repeating step of repeating the attaching and detaching steps at the X12 position of the TMA; A rotation and movement step of rotating and moving the Y1 position of the TMA to the crimp position by using the XYθ table; A second repeating step of repeating the attaching and detaching steps with respect to the Y1 position of the TMA; And repeating the steps similar to the moving step and the rotating and moving step to move the X21, X22 and Y2 positions of the TMA to the crimp positions, respectively, and repeating the attaching and detaching steps at the positions. Characterized in that comprises a.

In addition, in the pressurization apparatus of the anisotropic conductive film according to another embodiment of the present invention, in order to compress the anisotropic conductive film in the lead portion of the TMA, an anisotropic conductive film tape in which the lower protective film film and the upper protective film film are stacked on the upper and lower sides of the anisotropic conductive film. A compression bonding apparatus for anisotropic conductive films for cutting and pressing only anisotropic conductive films to a predetermined length by transporting them, the apparatus comprising: a supply reel for mounting the anisotropic conductive film tape in the form of a roll to supply a guide roller; A lower protective film winding reel for peeling and winding only the lower protective film through a guide roller from the anisotropic conductive film tape supplied from the supply reel; An ACF chuck for holding the peeling film tape or the upper protective film film upstream or downstream to apply tension when the peeling film tape from which the lower protective film film has been peeled is transferred by a predetermined cutting distance; A cutting device for cutting only the anisotropic conductive film at a predetermined position from the peeling film tape from which the lower protective film film is peeled off; A pressing head configured to elevate the anisotropic conductive film cut by the cutting device to heat-compress the lead portion of the TMA; A peeling rod which is moved to separate the upper protective film film on the downstream side after being thermally compressed by the pressing head; An XYθ table for loading the TMA on top to position each lead of the TMA at a position that is compressed by the crimping head; And, the anisotropic conductive film is characterized in that it comprises a top protective film film winding reel for winding the upper protective film film, which is a scrap after being compressed by the pressing head via the guide roller.

The press-fitting apparatus is provided with a peeling film tape which is transported under the crimping head without contacting the TMA on the XYθ table, and supplied so that the anisotropic conductive film of the transferred peeling film tape contacts each lead part of the TMA. It may further include a lifting device for lifting the supply unit of the anisotropic conductive film, such as a protective film winding reel, and the pressing device can be operated by automatic or manual operation by the automatic / manual switching switch, It can also be configured to be operated by the touch screen.

In addition, the automatic operation control method of the pressing device according to another embodiment of the present invention, in the above-mentioned pressing device, the home position return step for returning the XYθ table to the home position; An operation mode selection step of selecting an operation mode as an automatic operation mode; A loading step for loading the TMA onto the XYθ table; A vacuum adsorption step for adsorbing the loaded TMA with a vacuum; A start switch detecting step for driving the loaded TMA to automatically compress the anisotropic conductive film at each pressing position of each side of the loaded TMA; An ACF chuck opening step for releasing the fixing state of the release film tape to the downstream upper protective film; A conveying step of conveying the release film tape by one pitch with an upper protective film; An ACF chuck closing step of lowering the ACF chuck so as to apply tension by fixing the release film tape or the downstream upper protective film when the pitch is transferred by one pitch; A half cutting step of cutting only the anisotropic conductive film into a predetermined length in the release film tape by a cutting device; An XYθ table shifting step of operating an XYθ table to arrange a crimp position of the anisotropic conductive film of the TMA under the anisotropic conductive film; A crimping head lowering step of lowering the crimping head to compress the cut anisotropic conductive film to the TMA moved to the lower portion thereof; A thermocompression step of applying heat for a predetermined time in the compressed state; A crimping head raising step of raising the crimping head after thermocompression; A separation step of operating a peeling bar to separate the cut and compressed anisotropic conductive film and the upper protective film; And, after confirming that the anisotropic conductive film is compressed at each of the four sides of the TMA crimp position, if not all the crimped, characterized in that it comprises a crimp completion confirmation and repeating steps to repeat the ACF chuck opening step to separation step .

In this control method, the unit lowering step of lowering the supply unit so that the anisotropic conductive film is in close contact with the TMA after the XYθ table moving step, the unit raising step of raising the supply unit before or after the separating step, and the crimping. When the crimping completion is confirmed in the completion confirmation and repetition step, the apparatus may further include an origin return step of returning the XYθ table to the origin to unload the TMA or compress the TCP.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 3a is shown as a schematic view of the configuration of the pressing device of the anisotropic conductive film according to an embodiment of the present invention, Figure 3b is a specific pressing device is shown in a front view, Figure 3c is a side view thereof. In addition, Figure 4 is shown as a process diagram the configuration of the pressure bonding method of the anisotropic conductive film according to another embodiment of the present invention.

3A to 3C, the press-fitting apparatus of the anisotropic conductive film includes a supply reel 20, a lower protective film reel 21, a pressing head 22, a cutting device 31, an ACF chuck 32, and a peeling rod 33. ), An XYθ table 35, and an upper protective film reel 23, and a plurality of guide rollers are interposed in the middle thereof, and may include a lifting device 30 ′, and a supply reel ( 20), the lower protective film winding reel 21 and the upper protective film winding reel 23 may be driven by an induction motor, but among the plurality of guide rollers, the peeling film tape after peeling of the upper protective film 19 ' The guide roller for conveying the cutting device 31 and the pressing head 22 of the 18 'is driven by a pulse motor so that the release film tape 18' is conveyed at precise intervals.

The supply reel 20 is configured to supply an anisotropic conductive film tape 19 as shown in FIG. 2 in the form of a roll and to supply it via a guide roller. The lower protective film reel 21 is provided by the supply reel. From the anisotropic conductive film tape 19 supplied from 20, only the upper protective film film 19 'is peeled and wound up via the guide roller.

The ACF chuck 32 is a release film tape 18 'to an upper passivation film 19' when the release film tape 18 'on which the lower protective film 19 &quot; is peeled off is transferred by a predetermined cutting distance. It is configured to hold the upstream and downstream to apply tension.

The cutting device 31 is configured to cut only the anisotropic conductive film 18 at a predetermined position from the release film tape 18 'from which the upper protective film film 19' is peeled off.

Crimping head 22 is a lifting device with a built-in heater to omit the anisotropic conductive film 18 cut by the cutting device 31 to the lead portion 1 'of the TMA 1 by heat. Is elevated by.

The peeling bar 33 is thermo-compressed by the crimping head 22, and is moved so that the upper protective film film 19 'may be separated downstream.

The XYθ table 35 is configured to load the TMA 1 on the top and position each lead portion 1 ′ of the TMA 1 at a position that is compressed by the crimping head 22.

The upper protective film reel 23 is configured to wind the upper protective film 19 ', which is a scrap after the anisotropic conductive film 18 is compressed by the pressing head 22, through a guide roller.

In addition, the peeling film tape 18 'is transferred under the pressing head 22 without being in contact with the TMA 1 on the XYθ table 35, and the anisotropic conduction of the transferred peeling film tape 18' is carried out. The supply unit 30 of the anisotropic conductive film 18, such as the supply reel 20 and the upper protective film winding reel 23, is lifted and lowered so that the film 18 contacts each lead portion 1 ′ of the TMA 1. It can be configured to be elevated by the device 30 '.

In addition, the pressing device may be operated by automatic operation or manual operation by an automatic / manual switching switch, and may also be operated by the touch screens 51, 52, and 53.

The pressure-adhering apparatus of the anisotropic conductive film configured as described above includes induction motors, pulse motors, and XYθ tables (35), such as the respective supply reels 20, the lower passivation film winding reel 21, and the upper passivation film winding reel 23. And the pressing head 22 to the lifting device 30 'are configured to include a control unit and a memory unit, not shown, which are configured to be controlled in the operation sequence described below as an example.

First, the pressure bonding method of the anisotropic conductive film according to an embodiment of the present invention in Figure 4, the input step (P1), the attachment step (P2), the separation step (P3), the moving step (P4) of the TMA (1) disc ) And the rotation and movement step (P5) as a basic step, including the first repetition step, the second repetition step (P6, P7) and the third repetition step anisotropic conductive film over the entire side of the TMA (1) Attachment of 18 is completed.

That is, the TMA (1) disc is put in the correct position of the XYθ table 35 in the feeding step P1 and fixed by vacuum suction means 35 ', and the pressing position of the pressing head 22 is attached in the attaching step P2. Attach the anisotropic conductive film 18 to the X11 position of the introduced TMA (1), and in the separating step (P3), the appropriate top passivation film (19 ') by means of separation means such as a peeling rod (33) anisotropic conductive film It peels from (18).

In this way, when the attachment of the anisotropic conductive film 18 to one X11 position is completed, the XYθ table 35 is moved in the movement step P4 to move the X12 position of the TMA 1 to the crimp position. In the repeating step, the attaching and detaching steps are repeated at the X12 position of the TMA (1).

Then, in the rotation and movement step P5, the Y1 position of the TMA 1 is rotated and moved to match the crimp position by using the XYθ table 35, and the Y1 position of the TMA 1 is adjusted. In the repeating step (P6, P7) is repeated the attachment step and the separation step.

Further, in the third repetition step, the steps similar to the moving step P4 and the rotating and moving step P5 are repeated to move the X21, X22 and Y2 positions of the TMA 1 to the crimp positions, respectively. By repeating the attaching and detaching steps, the anisotropic conductive film 18 is attached to the four surfaces of the TMA 1 at six positions.

5 shows a configuration of an external control unit for operating the apparatus of the present invention, and FIG. 6 shows a configuration of a touch screen operation unit.

In FIG. 5, the power switch 41 of the external control unit 40 is turned on / off to supply / block all powers of the system, and automatically initialize at initial startup of the system, that is, check each signal, automatically initialize the home position, and the like. If the initialization fails due to an error, an error is output and if the error is recovered, the initialization is attempted again. When the system is turned off, all current work is stopped.

The automatic / manual switching switch 42 is configured to switch between the automatic mode and the manual mode, and the emergency stop switch 47 stops all the operations of the system and is restored by the reset switch 45 upon release. The job stop switch 46 is configured to finish the current automatic job, return to the standby, and the start switch 43 is configured to command a start command of automatic operation.

In addition, the heat switch 44 is for heating, may be configured to attach a thermocouple to the heater to set the temperature to measure the temperature, and display the measured temperature, the heater switch 44 is a manual It is for changing and adjusting temperature by operation. In addition, although not shown, it may be configured to apply heat during a pressure and time set for varying the pressure (compression force) of the crimping head 22, time setting, and the like, and may be pressed.

In FIG. 6, the touch screen 51 may be configured to select manual operation or automatic operation. When the manual operation is selected, the operator may select 1. data edit 2. manual operation 3. model selection as a main menu. Is configured.

The data editing submenu is configured to set data items such as data editing of the TMA 1, data editing of the ACF, and offset data editing for inputting numerical data required for automatic equipment installation.

The data editing of the TMA 1 may be composed of a touch screen 52 as shown as an example in FIG. That is, it is configured to input the name of the TMA 1, the X / Y axis size, the thickness, the coordinates of the ACF crimping positions, the coordinates of the attachment reference position of the ACF, and the like. This data can be entered directly or specified by the teaching function.

ACF data editing can be configured to directly input ACF name, type, width, temperature pressure, compression time, etc. on the screen, and offset data editing also directly input offset of data name, X axis, Y axis, θ axis on the screen. do.

8 illustrates a screen configuration for explaining the teaching function.

In FIG. 8, the direction key 50 for the X-axis movement, the Y-axis movement, and the rotation of the XYθ table 35 and the touch screen 53 are formed so that the numerical values of the unit movement amount, the current position, and the designated position movement are displayed.

That is, by the touch of the direction key 50, the unit moves by a unit movement distance determined by the unit movement amount by one, the rotary switch rotates by a unit angle when pressed once, the displacement amount during movement and rotation is added to or subtracted from the current position coordinates. The unit movement amount X / Y, θ may be configured as shown in FIG. 8 so as to set the movement distance / angle amount according to one press of the direction key 50.

The movement of the designated position moves to the absolute movement amount by pressing the movement switch by the distance set by the value. When the movement is executed in this way, the current coordinate is changed.

6, the TMA 1 and the anisotropic conductive film 18 may be stored in ten combinations of M0 to M9, and one of the models may be set and applied to automatic operation / manual operation.

9 illustrates a screen configuration for manual operation, and FIG. 10 illustrates an automatic operation control method as a flowchart.

In Fig. 9, the servo power ON / OFF switch 63 is for turning on / off the power of the servo system and is used for debugging equipment.

The half cut switch 65 is for cutting about half, and is normally configured such that the cutting device 31 is lowered / raised once by the lifting cylinder.

The vacuum switch 66, when the TMA 1 is loaded on the XYθ table 35 via the fixing jig by the vacuum suction means 35 '(shown in FIG. 4), is sucked with vacuum and released. The press head switch 68 is configured to move the press head 22 by using a lifting cylinder. The thermo press switch is not shown, but the heater of the press head 22 is heated. It can be configured to.

The ACF supply M / T switch 61 is configured to operate its drive M / T to release the ACF 19 from the supply reel 20, and the protective film M / T 上 / down switches 69 and 64 are The protective film winding reel 23 and the lower protective film reel 21 is configured to operate.

The peeling switch 70 is configured to move the peeling rod 33 to the left and right to separate the upper protective film film 19 'from the ACF, and the ACF chuck switch 62 operates the ACF chuck 32 to transfer the film. It is configured to clamp to apply tension to the release film tape 18 ′ in use.

ACF unit switch 67 is configured to lower the supply unit 30 to the ACF attachment position of the TMA (1) in the state in which the ACF maintains tension and is cut, and then rises after press-fitting, the direction key 50 is as described above. same.

The press-fitting device of the anisotropic conductive film can be manually operated by the touch screen 53 configured as described above, and the model of the manually input TMA 1 and the anisotropic conductive film 18 and its bonding position and offset are provided. The anisotropic conductive film 18 is pressed against the TMA 1 by heat due to data or the like.

In the autonomous driving method shown in FIG. 10, when the autonomous driving mode is selected and the start switch 43 (shown in FIG. 5) is started, the XYθ table 35 returns to the home position in the home position return step S12, and the operation mode. Is selected as the automatic operation mode (step S13).

Thereafter, a loading step S14 is performed to load the TMA 1 on the XYθ table 35, instructing to suck the loaded TMA 1 in vacuum in step S15, and detecting the start switch. In operation S16, the operation of the start switch 43 is sensed to automatically squeeze the anisotropic conductive film 18 to the loaded TMA 1 at each crimping position of each side, and automatic operation is started.

In step S17, an ACF chuck opening step for releasing the fixing state of the upstream release film tape 18 'to the downstream upper passivation film 19' is performed, and in step S18, the release film tape 18 'is top passivated. The conveying step is performed to convey the film 19 'by one pitch.

When conveyed by one pitch in the transfer step, the ACF chuck 32 is lowered to fix the release film tape 18 ′ to the downstream upper protective film 19 ′ in the ACF chuck closing step S19 to apply tension. In the half cutting step S20, only the anisotropic conductive film 18 is cut to a predetermined length in the release film tape 18 ′ by the cutting device 31.

Thereafter, in step S21, the XYθ table 35 is operated to arrange the crimp position of the anisotropic conductive film 18 of the TMA 1 below the anisotropic conductive film 18, and the cut in step S22. The compression head 22 is lowered to compress the anisotropic conductive film 18 to the TMA 1 moved below.

In the crimped state, heat is applied for a predetermined time to perform the thermocompression step S23, and the compression head 22 is raised after the thermocompression step (step S24).

In order to separate the cut and crimped anisotropic conductive film 18 and the upper protective film film 19 ', the peeling bar 33 is operated in the separating step S25, and each anisotropic in each of the four pressing positions of the TMA 1 is pressed. When the conductive film 18 is compressed and not fully compressed, the ACF chuck opening step S17 to separation step S25 are repeated (step S26).

In addition, after the XYθ table moving step (S21), the anisotropic conductive film 18 may further include a unit descending step of lowering the supply unit 30 so as to come into close contact with the TMA (1), in this case, It includes a step of raising the unit to raise the supply unit 30 before or after the separation step (S25), and when the crimping completion is confirmed in the step S26, unloading the TMA (1) or TCP (10) ), The home position return step (S27) of returning the XYθ table 35 to the home position may be performed again.

In this way, the automatic operation control method of the pressure bonding device of the anisotropic conductive film is configured and operated so that the anisotropic conductive film 18 is automatically transported from the anisotropic conductive film tape 19 while being cut and subjected to heat and pressure at each pressing position. In this case, the anisotropic conductive film 18 may be automatically compressed in response to the manual input of data, thereby eliminating the compression failure when the TCP 10 is pressed. In addition, manual operation by manual selection also becomes possible.

According to the constitution and operation of the pressure-adhesive bonding method of the anisotropic conductive film according to the embodiments of the present invention described above, the apparatus and the automatic operation control method, the anisotropy continuously transferred to the lead portion 1 'of the TMA (1) Since only the anisotropic conductive film 18 can be cut and pressed from the conductive film tape 19, productivity and precision can be improved.

Claims (6)

Anisotropic conductive films 18 on the lead portions 1 'of the X11, X12, X21, X22 and Y1, Y2 positions on the X1 and X2 sides of the four sides (X1, X2, Y1, Y2) of the TMA (1), respectively. The lower protective film film 19 " is peeled off from the anisotropic conductive film tape 19 in which the lower protective film 19 &quot; and the upper protective film 19 " In the pressure bonding method of the anisotropic conductive film in which only the anisotropic conductive film 18 is cut from the peeling conductive film 18 'to a predetermined length and pressed. An input step (P1) of inserting a TMA (1) disc at the correct position of the XYθ table 35 and fixing it with the vacuum suction means 35 '; An attaching step (P2) of attaching the anisotropic conductive film 18 to the X11 position of the inserted TMA 1 at the crimping position of the crimping head 22; Separating the upper protective film film 19 'from the anisotropic conductive film 18 (P3); A movement step (P4) of moving the X12 position of the TMA (1) to the crimp position using the XYθ table (35); A first repeating step of repeating the attaching and detaching steps at the X12 position of the TMA (1); A rotation and movement step (P5) for rotating and moving the Y1 position of the TMA (1) to the crimp position by using the XYθ table 35; A second repeating step (P6, P7) of repeating the attaching and detaching steps with respect to the Y1 position of the TMA (1); And, By repeating the steps similar to the moving step P4 and the rotating and moving step P5, the X21, X22 and Y2 positions of the TMA 1 are moved to the crimping positions, respectively. Pressure bonding method of the anisotropic conductive film, characterized in that it comprises a third repeating step carried out repeatedly. Anisotropic in which the lower passivation film 19 "and the upper passivation film 19 'are overlapped with the anisotropic conducting film 18 to compress the anisotropic conducting film 18 to the lead portion 1' of the TMA 1. In the compression bonding apparatus of the anisotropic conductive film which transfers the conductive film tape 19 and cuts and compresses only the anisotropic conductive film 18 to a predetermined length: A supply reel 20 for mounting the anisotropic conductive film tape 19 in the form of a roll and supplying it through a guide roller; A lower passivation film winding reel 21 for peeling and winding only the lower passivation film 19 "from the anisotropic conductive film tape 19 supplied from the supply reel 20 via a guide roller; When the peeling film tape 18 'from which the lower protective film 19 &quot; is peeled off is transferred by a predetermined cutting distance, the peeling film tape 18' is gripped from upstream to downstream to apply tension. ); A cutting device 31 for cutting only the anisotropic conductive film 18 at a predetermined position from the release film tape 18 'from which the upper protective film film 19' is peeled off; A compression head 22 for elevating the anisotropic conductive film 18 cut by the cutting device 31 by heat to the lead portion 1 'of the TMA 1; A peeling rod 33 which is thermally compressed by the pressing head 22 and then moved to separate the upper protective film film 19 'from the compressed anisotropic conductive film 18; An XYθ table (35) for loading the TMA (1) thereon and placing each lead portion (1 ') of the TMA (1) at a position compressed by the crimping head (22); And And an upper protective film reel 23 for winding the upper protective film 19 ', which is an upper protective film after the anisotropic conductive film 18 is compressed by the pressing head 22, through a guide roller. Pressure bonding device of the anisotropic conductive film, characterized in that. 3. The peeling film tape 18 'is transferred from the bottom of the crimping head 22 without being in contact with the TMA 1 on the XYθ table 35. Supply unit of the anisotropic conductive film 18 such as the supply reel 20 and the upper protective film reel 23, so that the anisotropic conductive film 18 of the &lt; RTI ID = 0.0 &gt; (18) &lt; / RTI &gt; Pressure-adhesion device of the anisotropic conductive film, characterized in that it further comprises a lifting device (30 ') for lifting 30. According to claim 2 or 3, wherein the pressing device can be operated by automatic or manual operation by the automatic / manual changeover switch, it can also be operated by the touch screen (51, 52, 53) Pressing device of anisotropic conductive film characterized in that. Mounting the anisotropic conductive film tape 19 in the form of a roll through the supply reel 20 for supplying through the guide roller, and through the guide roller from the anisotropic conductive film tape 19 supplied from the supply reel 20 When the lower protective film reel 21 for peeling and winding only the lower protective film 19 "and the release film tape 18 'from which the lower protective film 19" is peeled off are transported by a predetermined cutting distance. An ACF chuck 32 for holding the peeling film tape 18 'to the upper protective film film 19' upstream and downstream to apply tension, and a peeling film tape 18 to which the lower protective film film 19 "is peeled off. A cutting device 31 for cutting only the anisotropic conductive film 18 at a predetermined position from '), and the anisotropic conductive film 18 cut by the cutting device 31 includes a lead portion 1' of the TMA 1. ) The pressing head 22 which is raised and lowered to be pressed by heat, and the pressure of the pressing head 22 After attaching, the TMA (the peeling rod 33) which moves to separate the upper protective film film 19 'from the downstream side, and the TMA (1) is loaded on the upper portion and the TMA ( XYθ table 35 for positioning each lead portion 1 'of 1), and an upper protective film film 19' which is a scrap after the anisotropic conductive film 18 is pressed by the pressing head 22. In the automatic operation control method of the pressure bonding device of the anisotropic conductive film comprising an upper protective film film winding reel (23) for winding through a roller: An origin return step S12 for returning the XYθ table 35 to the origin; An operation mode selection step (S13) in which the operation mode is selected as the automatic operation mode; A loading step S14 for loading the TMA 1 on the XYθ table 35; A vacuum adsorption step (S15) for adsorbing the loaded TMA (1) with a vacuum; A start switch detecting step (S16) for driving to automatically compress the anisotropic conductive film 18 at each of the pressing positions of the sides of the loaded TMA 1; An ACF chuck opening step (S17) for releasing the fixed state upstream or downstream of the release film tape 18 '; A transfer step (S18) for transferring the release film tape 18 'by one pitch together with the upper protective film 19'; An ACF chuck closing step (S19) of lowering the ACF chuck 32 so as to apply tension by fixing the upstream or downstream release film tape 18 to the upper protective film film 19 'when conveyed by one pitch; Half cutting step (S20) of cutting only the anisotropic conductive film 18 of the release film tape (18 ') by a cutting device 31 to a predetermined length; An XYθ table moving step (S21) for operating the XYθ table 35 to arrange the crimp position of the anisotropic conductive film 18 of the TMA 1 below the anisotropic conductive film 18; A crimping head lowering step (S22) for lowering the crimping head 22 to compress the cut anisotropic conductive film 18 to the TMA 1 moved to the lower portion thereof; A thermal compression step (S23) of applying heat for a predetermined time in the compressed state; A compression head raising step (S24) of raising the compression head 22 after the thermal compression; A separation step (S25) of operating the peeling bar 33 to separate the cut and compressed anisotropic conductive film 18 and the upper protective film film 19 '; And, Confirm that the anisotropic conductive film 18 is compressed at each of the four side compression positions of the TMA 1, and when the anisotropic conductive film 18 is not fully compressed, the ACF chuck opening step (S17) to the separation step (S25) are repeated and confirmed. Automatic operation control method of the pressing device of the anisotropic conductive film, characterized in that it comprises a step (S26). The unit lowering step of lowering the supply unit 30 such that the anisotropic conductive film 18 is in close contact with the TMA 1 after the XYθ table moving step S21, and the separating step S25. In order to unload the TMA 1 or to squeeze the TCP 10 when the crimping completion is confirmed in the ascending step of raising the supply unit 30 and the crimp completion confirmation and repeating step S26 before or after. And an origin return step (S27) for returning the XYθ table 35 to the origin.