JP4941841B2 - Adhesive tape sticking device and sticking method - Google Patents

Description

  The present invention relates to an attaching apparatus and an attaching method for attaching an adhesive tape for connecting (mounting) a TCP (Tape Carrier Package) as an electronic component to a liquid crystal display panel as a substrate.

  For example, in the manufacturing process of flat panel displays such as liquid crystal display panels and plasma display panels, electronic components such as TCP (Tape Carrier Package) are placed on the upper surface of the side of a glass substrate. There exists the process of sticking through the adhesive tape which consists of.

  Before the electronic component is attached to the upper surface of the side portion of the substrate, the adhesive tape cut to a predetermined length is attached to the upper surface of the side portion of the substrate. Adhesive tapes are affixed to a release tape, which is wound around a supply reel.

  When attaching an electronic component to the upper surface of the side portion of the substrate with an adhesive tape, first, of the release tape and the adhesive tape fed out from the supply reel, only the adhesive tape is cut into a predetermined length with a cutter. The cutting length of the adhesive tape at this time is set to a length over the entire length of a range in which a plurality of electronic components are mounted on the upper surface of the side portion of the substrate.

  Next, by feeding the adhesive tape together with the release tape by a feeding mechanism such as a chuck, the portion cut to a predetermined length of the adhesive tape is positioned with respect to the upper surface of the side part of the substrate placed on the table, and then cut. The pressure-sensitive adhesive tape is pressed and stuck to the substrate. After sticking, the release tape is peeled off from the adhesive tape, and a plurality of electronic components are stuck and mounted on the adhesive tape attached to the substrate at predetermined intervals.

  Incidentally, a plurality of electronic components are provided at predetermined intervals on the side of the substrate. Therefore, if the adhesive tape is provided over the entire length of the upper surface of the side portion of the substrate, the portion located between the adjacent electronic components of the adhesive tape is wasted, which may increase the production cost, as well as the adjacent electronic components Since the adhesive tape is exposed in the area between the two, dust may adhere to the exposed area, which may be undesirable.

  Therefore, recently, it has been practiced to cut the adhesive tape into approximately the same length as the width dimension of the electronic component and stick it to the side portion of the substrate. In that case, the adhesive tape fed out from the supply reel is cut into a length substantially the same as the width dimension of the electronic component together with the release tape, and adhered to the side portion of the substrate at a predetermined interval.

  Thereafter, the release tape is peeled off from the adhesive tape, and an electronic component is mounted on the adhesive tape. Patent Document 1 discloses such an adhesive tape attaching apparatus.

When the release tape is peeled off from the adhesive tape attached to the substrate, in Patent Document 1, an adhesive peeling tape is circulated on a roller provided in the peeling unit, and this peeling tape is placed on the upper surface of the adhesive tape. The said peeling unit is moved along an adhesive tape, making it stick and wind up to the end of the sticking release tape. Thereby, the release tape is peeled off from the adhesive tape.
JP-A-9-6251

  By the way, when the pressure-sensitive adhesive tape and the release tape are cut to the same length, the edge portions of the release tape and the pressure-sensitive adhesive tape may be strongly adhered to each other due to pressure at the time of cutting. In such a state, the end of the release tape is difficult to peel off from the end of the adhesive tape even if the release tape is attached to the release tape from the adhesive tape attached to the substrate. In such a case, the release tape may not be peeled off from the adhesive tape, or the release tape is not peeled off from the adhesive tape, and the end of the adhesive tape is swollen from the substrate. In such a case, the electronic component cannot be reliably mounted.

  The present invention provides an adhesive tape sticking device and a sticking method that can reliably peel the release tape from the adhesive tape when the adhesive tape is cut together with the release tape and stuck to the substrate. There is to do.

This invention is a pressure-sensitive adhesive tape sticking device that cuts a pressure-sensitive adhesive tape attached to a release tape into a predetermined length and sticks it to a side portion of a substrate,
A supply reel in which the adhesive tape is wound together with the release tape;
Of the release tape and the adhesive tape fed out from the supply reel, a removal part obtained by partially cutting and removing only the adhesive tape is provided at a predetermined interval, and the adhesive tape is provided with a predetermined length by the pair of the removal parts. A cutting and removing mechanism that divides into
A release tape cutting mechanism for cutting the release tape in a state protruding from at least one of both ends of the pressure-sensitive adhesive tape divided into a predetermined length at a portion corresponding to the removal portion;
An adhesive comprising: an adhesive means for adhering the adhesive tape cut to a predetermined length together with the release tape cut by the release tape cutting mechanism to a side portion of the substrate. In the tape applicator.

A feed mechanism for pinching the tip of the release tape to which the adhesive tape is attached and pulling out the release tape from the supply reel with the surface to which the adhesive tape is attached facing down;
When the part corresponding to the removal portion of the release tape that has been pulled out and positioned by the feed mechanism is cut by the release tape cutting mechanism, the part is cut by the release tape cutting mechanism of the release tape. And holding means for adsorbing and holding the upper surface of the upstream portion of the portion.

  The sticking means preferably holds the upper surface of the release tape by suction when the release tape is cut by the release tape cutting mechanism.

  From the adhesive tape cut to a predetermined length and adhered to the side of the substrate together with the release tape, the end of the release tape protruding from the end of the adhesive tape is sandwiched from the adhesive tape It is preferable that a peeling means for peeling is provided.

The peeling means includes a clamping part in which a pair of clamping claws are provided so as to be openable and closable, and an arm body that is connected to a rotating shaft that is provided at one end and is rotationally driven at the other end.
The end of the release tape protruding from the end of the adhesive tape is clamped by the pair of clamping claws, and the arm body is rotated in a direction in which one end is separated from the upper surface of the substrate, whereby the release tape is moved to the adhesive tape. It is preferable to peel off from.

This invention is a method of attaching an adhesive tape that cuts an adhesive tape attached to a release tape into a predetermined length and attaches it to a side portion of a substrate,
Providing a removal portion obtained by partially cutting and removing the adhesive tape from the release tape at a predetermined interval, and cutting the adhesive tape into a predetermined length by a pair of removal portions;
Projecting the release tape from the end of the pressure-sensitive adhesive tape cut into a predetermined length at a portion corresponding to the removal portion, and cutting the tape;
A step of attaching the adhesive tape, which has been cut to a predetermined length by a pair of removal parts, together with the cut release tape, to the side part of the substrate. It is in.

  If the adhesive tape is attached to the side portion of the substrate together with the release tape, the end of the release tape protruding from the end of the adhesive tape is clamped to remove the release tape from the adhesive tape. Peeling is preferable.

  According to this invention, the end of the release tape is protruded from the end of the adhesive tape cut to a predetermined length, the release tape is cut, and the adhesive tape is attached to the substrate. Therefore, since the release tape can be peeled off from the adhesive tape by sandwiching the end of the release tape protruding from the end of the adhesive tape attached to the substrate, the release tape is peeled off reliably and easily. It becomes possible.

An embodiment of the present invention will be described below with reference to the drawings.
The adhesive tape sticking apparatus shown in FIG. The supply reel 1 is wound with a release tape 2 and a double-sided adhesive tape 3 made of an anisotropic conductive member attached to one surface of the release tape. It is fed out from the supply reel 1 with the tape 3 facing downward.

  The upper surface of the release tape 2 fed out from the supply reel 1 runs along the flat lower surface of the block-shaped holding member 5 constituting the holding means. The holding member 5 is formed with a plurality of suction holes 6 opened on the lower surface at predetermined intervals over the entire length of the lower surface. Each suction hole 6 communicates with a suction pump 8 via a suction pipe 7.

  Therefore, when the suction pump 8 is operated, a suction force is generated on the lower surface of the holding member 5, so that the portion that runs along the lower surface of the holding member 5 of the release tape 2 is sucked and held by the suction force. It has become.

  On the lower surface of the holding member 5, the adhesive tape 3 attached to the lower surface of the release tape 2 is partially removed by the cutting and removing mechanism 11. Thereby, the removal part 3a is formed in the adhesive tape 3 by predetermined spacing so that it may mention later.

  That is, the cutting and removing mechanism 11 includes a cutting portion 14 that forms a pair of cutting lines 3b (shown in FIGS. 2A and 2B) at a predetermined interval on the adhesive tape 3, and the cutting portion 14 causes the above-described cutting portion 14 to By removing a portion between the pair of cutting lines 3b formed on the adhesive tape 3 from the release tape 2, a peeling portion 15 is provided which uses the portion as the removal portion 3a.

  The cutting portion 14 has a first vertical drive cylinder 16 disposed with its axis perpendicular to the lower end of the holding member 5 located on the supply reel 1 side. At the upper end of the rod 16a of the first vertical drive cylinder 16, a pedestal 17 is provided with the upper surface horizontal. A pair of blades 18 are erected on the upper surface of the pedestal 17 at predetermined intervals along the running direction of the tapes 2 and 3. As shown in FIG. 2A, the distance between the pair of blades 18 is d.

  When the first vertical drive cylinder 16 is actuated and the pair of blades 18 are driven in the upward direction with the upper surface of the release tape 2 being sucked and held on the lower surface of the holding member 5, the pair of blades 18 is driven in the upward direction. A pair of cutting lines 3b is formed at a distance d corresponding to the pair of blades 18 on the adhesive tape 3 adhered to the lower surface of the release tape 2 by the blades 18. At this time, the blade 18 cuts only the adhesive tape 3 along the cutting line 3b and does not cut the release tape 2.

  The peeling portion 15 is disposed opposite to the holding member 5 on the downstream side of the cutting portion 14 in the running direction of the tapes 2 and 3. The peeling portion 15 includes a second vertical drive cylinder 21 arranged with the axis line vertical. A base plate 22 is attached to the rod 21a of the second vertical drive cylinder 21 with the plate surface vertical.

  A peeling head 23 is provided at the upper end of the base plate 22 so that the upper surface protrudes from the upper end of the base plate 22. The width dimension of the peeling head 23 is set to be equal to or less than the distance between the pair of blades 18 of the cutting portion 14.

The base plate 22 is provided with a supply reel 25 around which a peeling adhesive tape 24 is wound. The peeling adhesive tape 24 runs along the upper surface of the peeling head 23 and is wound around a take-up reel 26. It is like that. The take-up reel 26 is rotated by a motor (not shown) to take up the peeling adhesive tape 24 at a predetermined timing and a length corresponding to the width dimension of the peeling head 23.
The base plate 22 is provided with a plurality of guide rollers 27 for guiding the peeling adhesive tape 24.

  From the supply reel 1, the release tape 2 to which the adhesive tape 3 is adhered is intermittently fed out at a predetermined pitch indicated by P in FIG. The pitch P coincides with the distance between the center lines of the cutting portion 14 and the peeling portion 15.

  Thereby, the part between the pair of cutting lines 3b formed on the adhesive tape 3 by the pair of blades 18 of the cutting portion 14 is moved by the feeding mechanism 29 at a pitch P when the release tape 2 is conveyed at the pitch P. It positions so that it may oppose above the peeling head 23 of the peeling part 15. FIG.

  In this state, when the base plate 22 is driven in the upward direction by the second vertical drive cylinder 21 of the peeling portion 15, the upper surface of the peeling head 23 of the peeling adhesive tape 24 provided on the base plate 22 is applied. As shown in FIG. 2 (b), the positioned portion is in pressure contact with the portion between the pair of cutting lines 3 b formed on the adhesive tape 3.

  Next, when the base plate 22 is driven in the downward direction, the portion between the pair of cutting lines 3b of the adhesive tape 3 is removed to form the removal portion 3a as shown in FIG. 2 (c). become.

  If the removal part 3a whose length dimension is d is formed in the said adhesive tape 3 by the space | interval of the pitch P, the said adhesive tape 3 is predetermined length, ie, shown in FIG. 1, by a pair of removal part 3a adjacent by the pitch P. Thus, it is divided by the length of (P−d), which is shorter than the pitch P by the length d of the removal portion 3a.

  As shown in FIG. 5, the length (Pd) of the adhesive tape 3 divided by a pair of adjacent removal portions 3a is an electronic device such as TCP attached to a substrate W such as a flat panel display. It is set to be equal to the width dimension of the part E.

  The feeding mechanism 29 corresponds to the removal portion 3a where the adhesive tape 3 is partially removed, which is located at the leading end of the release tape 2 fed from the supply reel 1, that is, the leading end of the release tape 2 in the feeding direction. A chuck portion 31 for holding the portion to be held. The chuck portion 31 is provided with a pair of clamping claws 33 on a base portion 32 so as to be opened and closed by an opening / closing cylinder 34.

  The base 32 is connected to a rod 35a of a feed cylinder 35 arranged with its axis line horizontal. The rod 35a is reciprocated at the same distance as the pitch P.

Therefore, after the rod 35a of the feed cylinder 35 is driven in the protruding direction and the tip of the release tape 2 is clamped by the pair of clamping claws 33 of the chuck portion 31, the rod 35a is driven in the backward direction. The release tape 2 can be fed at a pitch P.
When the release tape 2 is fed by the feeding mechanism 29, the adsorbed state of the release tape 2 by the holding member 5 is released.

  A release tape cutting mechanism is configured between the feed mechanism 29 and the peeling portion 15 at a position spaced from the center line of the peeling portion 15 in the transport direction of the release tape 2 by the pitch P. A pair of upper and lower cutting blades 37 are provided with the tapes 2 and 3 sandwiched therebetween. The pair of cutting blades 37 are integrally driven in a contact / separation direction by a drive source 38 such as a drive cylinder.

  When the release tape 3 is intermittently conveyed at the pitch P by the feeding mechanism 29, the intermediate portion of the removal portion 3a from which the adhesive tape 3 is partially removed by the peeling portion 15 is opposed to the cutting blade 37. Positioned. In this state, when the drive source 38 is operated and the pair of cutting blades 37 are driven in the approaching direction, the removal portion 3a of the release tape 2 is cut at the center in the length direction.

  At this time, the upper surface of the part of the release tape 2 upstream of the cutting blade 37 in the feeding direction is sucked and held by the holding member 5. Therefore, even if the release tape 2 is cut by the removing portion 3a, the upstream portion of the cut portion is held without sagging downward.

  When the release tape 2 is cut by the cutting blade 37, the upper surface of the portion located downstream of the cutting blade 37 in the feeding direction is sucked and held by the suction head 41 constituting the sticking means. The suction head 41 can be driven in the X, Y, and Z directions by an X / Y / Z drive source 42.

  The suction head 41 is formed with a plurality of suction holes 41a that open to the lower surface. A suction pump (not shown) is connected to the suction hole 41a. Thereby, a suction force is generated in the suction hole 41a.

  A pressure-sensitive adhesive tape 3 cut to a predetermined length is attached to the lower surface of the release tape 2 cut at a pitch P by the cutting blade 37. As shown in FIG. 6A, the cut length (Pd) of the adhesive tape 3 is shorter by d than the release tape 2 cut by the length of the pitch P. Therefore, both ends of the cut release tape 2 protrude from the both ends of the adhesive tape 3 cut at a length of (Pd) by a length of d / 2.

  When the release tape 2 with the adhesive tape 3 attached to the lower surface is cut by the cutting blade 37 while being sucked by the suction head 41, the suction head 41 is placed on the upper surface of the mounting table 43 as shown in FIG. Is positioned above the side portion of the substrate W supplied and held. The mounting table 43 is disposed on the side of the release tape 2 that is fed from the supply reel 1, and includes an X table 43a, a Y table 43b, and a Z table 43c that are respectively driven by a drive source (not shown). The table unit 40 is provided on the upper end surface of the Z table 43c.

  When the suction head 41 is positioned above the side of the substrate W, the suction head 41 descends and attaches the adhesive tape 3 attached to the lower surface of the release tape 2 to the upper surface of the side of the substrate W. Adhere to. At this time, the lower surface of the side of the substrate W protruding outward from the outer peripheral edge of the mounting table 43 is held by the backup tool 45.

  When the adhesive tape 3 is attached to the substrate W, the suction head 41 is driven in the upward direction after the suction force attracting the release tape 2 is released, and the release tape 2 pulled out by the feeding mechanism 29 is used. Returning upward, the above-described operation is repeated.

  The feeding mechanism 29 pitches the release tape 2 from the supply reel 1 while the adhesive tape 3 having the suction head 41 cut to a predetermined length is adhered to the substrate W together with the release tape 2. Pay out with P length.

  In this way, a plurality of adhesive tapes 3 cut to a predetermined length as shown in FIG. 5 are attached to the upper surface of the side portion of the substrate W together with the release tape 2 at predetermined intervals. The release tape 3 is peeled off from the adhesive tape 3 attached to the substrate W by the peeling means 51 arranged on the side of the mounting table 43.

  The said peeling means 51 has the clamping part 52, as shown to Fig.3 (a)-(c). The sandwiching portion 52 is provided with a pair of sandwiching claws 53 formed by bending a thin strip-shaped metal plate into a crank shape, for example, so that the tip portion can be positioned in the vertical direction and can be opened and closed. The clamping portion 52 is attached to one end of the arm body 54. The other end of the arm body 54 is attached to the rotation shaft 56 of the drive source 55 and is driven to rotate in the direction indicated by the arrow in FIG.

  When the arm body 54 is in a horizontal state, the ends of the pair of clamping claws 53 are horizontal at the same height as the upper surface of the side part to which the adhesive tape 3 of the substrate W is attached as shown in FIG. Is positioned. Therefore, each time the adhesive tape 3 is adhered to the upper surface of the side portion of the substrate W by the suction head 41, the substrate W is mounted at a predetermined pitch in the direction along the longitudinal direction of the side portion by the mounting table 43, that is, the adhesive tape. 3 is driven at a pitch corresponding to the sticking interval 3, the tip of the nail 53 located on the lower side enters the lower surface of the end of the release tape 2 protruding from the end of the adhesive tape 3.

  When the tip of the nail claw 53 positioned on the lower side enters the lower surface of the end of the release tape 2, the pair of nail 53 is driven in the closing direction to hold one end of the release tape 2. Next, the drive source 55 is actuated to drive the arm body 54 from the horizontal state in a direction in which one end provided with the clamping claws 53 is raised as indicated by an arrow in FIG. 6B. As a result, the release tape 2 is peeled off from the adhesive tape 3 attached to the substrate W.

  In this way, when the adhesive tape 3 cut into the predetermined length by cutting the release tape 2 is attached to the substrate W together with the release tape 2, the removal portion 3a from which the adhesive tape 3 has been partially removed is provided. After forming at predetermined intervals and dividing the adhesive tape 3 by a predetermined length, the release tape 2 is cut at the central portion in the length direction of the removing portion 3a. That is, the release tape 2 is made longer than the pressure-sensitive adhesive tape 3, and the end portion of the release tape 2 projects from the end of the pressure-sensitive adhesive tape 3 and is cut.

  And after sticking the adhesive tape 3 on the side part upper surface of the board | substrate W with the release tape 2, the edge part of the release tape 2 protruded from the terminal of the longitudinal direction of the adhesive tape 3 of the arm body 54 of the peeling means 51 is shown. The release tape 2 is peeled from the adhesive tape 3 by being sandwiched between a pair of sandwiching claws 53 of a sandwiching portion 52 provided at one end and rotating the sandwiching portion 52 with the other end of the arm body 54 as a fulcrum. I did it.

  That is, the end of the release tape 2 is protruded from the end of the adhesive tape 3 and the ends of the tapes 2 and 3 are shifted, so that the ends of the adhesive tape 3 and the release tape 2 are matched with each other. Unlike the conventional case, the end of the adhesive tape 3 and the end of the release tape 2 are not strongly adhered to each other by the applied pressure at the time of cutting. In addition, since the end of the release tape 2 protrudes from the end of the adhesive tape 3, the end of the release tape 2 can be easily held by the holding claws 53 of the peeling means 51.

  Therefore, not only can the release tape 2 be easily peeled off from the adhesive tape 3 adhered to the upper surface of the side of the substrate W together with the release tape 2 by the clamping claws 53 of the peeling means 51, but also the adhesive tape at the time of peeling. Since 3 is not strongly pulled by the release tape 2, the end of the adhesive tape 3 is not swung up from the substrate W.

  The cutting part 14 and the peeling part 15 of the cutting / removing mechanism 11 are arranged at an interval of a pitch P, and a pair of cutting blades 37 of the release tape cutting mechanism are further arranged at an interval of the pitch P with respect to the peeling part 15. I made it.

  And since the release tape 2 is fed out by the length of the pitch P by the feed mechanism 29, after the release tape 2 is fed out by the feed mechanism 29, the cutting part 14, the peeling part 15 and the cutting blade 37 are The operation can be synchronized. That is, since a series of operations by the cutting part 14, the peeling part 15 and the cutting blade 37 can be performed at the same time, the tact time can be shortened.

  When the release tape 2 is cut into a predetermined length by the cutting blade 37, the upstream portion of the release tape 2 from the cutting blade 37 is adsorbed and held by the holding member 5. When the mold tape 2 is cut, the portion upstream of the cutting blade 37 of the release tape 2 is held without sagging.

  Therefore, after cutting, the tip portion of the portion held by the holding member 5 of the release tape 2 can be securely held by the chuck portion 31 of the feed mechanism 29 and can be fed out with a pitch P.

  When the release tape 2 is cut, the suction head 41 sucks and holds the portion downstream of the portion of the release tape 2 cut by the cutting blade 37. The suction head 41 is driven in the X, Y, and Z directions.

  Therefore, if the release tape 2 is cut to a predetermined length, the adhesive tape 3 that has been moved above the substrate W and adhered to the lower surface of the release tape 2 is adhered to the upper surface of the side of the substrate W. can do. In other words, the suction head 41 not only holds the cut release tape 2 by suction, but also transfers the adhesive tape 3 attached to the release tape 2 to the head dedicated for attachment without using the substrate W. Can be attached directly to.

  Since the release tape 2 adhered to the adhesive tape 3 is peeled off after the adhesive tape 3 is adhered to the substrate W, the mold release is performed immediately before the electronic component E is adhered to the substrate W. What is necessary is just to peel the tape 2 from the adhesive tape 3. FIG.

  Therefore, it is possible to prevent dust and the like from adhering to the adhesive tape 3 before adhering the electronic component E to the adhesive tape 3 adhered to the substrate W. Therefore, the electronic component E is adhered to the substrate W. Can be accurately and reliably performed.

  In the above embodiment, the release tape is cut at the center of the removal portion so that the release tape protrudes from both ends of the adhesive tape divided into a predetermined length. What is necessary is just to protrude by the predetermined length from at least one of the terminal.

  That is, it is only necessary that the end portion of the release tape can be held by the holding claws of the release means and peeled off from the adhesive tape, so that the release tape may only protrude from one end of the adhesive tape. In that case, what is necessary is just to cut | disconnect a release tape in the location corresponding to the edge part of a removal part.

The side view which shows schematic structure of the sticking apparatus which shows one embodiment of this invention. (A) is explanatory drawing when forming a pair of cutting line in an adhesive tape, (b) is explanatory drawing when a peeling head is crimped | bonded to the part of a pair of cutting line of an adhesive tape, (c) is adhesive tape Explanatory drawing when the part between a pair of cutting lines is removed. (A) is a top view of a peeling mechanism, (b) is a side view similarly, (c) is a side view which shows a pair of clamping claw of a clamping part. The block diagram of the table unit in which a board | substrate is mounted. Explanatory drawing which shows the state by which the electronic component was stuck to the board | substrate with the adhesive tape. (A) is explanatory drawing which shows the state which the edge part of the peeling tape stuck together with the adhesive tape on the board | substrate entered between a pair of clamping claws, (b) is a release tape from an adhesive tape by raising a clamping nail. Explanatory drawing of the state which peels.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Supply reel, 2 ... Release tape, 3 ... Adhesive tape, 5 ... Holding member, 11 ... Cutting removal mechanism, 14 ... Cutting part, 15 ... Peeling part, 23 ... Peeling head, 29 ... Feeding mechanism, 31 ... Chuck 37, cutting blade (release tape cutting mechanism), 41 ... suction head (sticking means), 51 ...
Peeling means, 53 ... clamping claws, 54 ... arm body.

Claims (7)

A pressure-sensitive adhesive tape sticking device that cuts a pressure-sensitive adhesive tape attached to a release tape into a predetermined length and sticks it to a side portion of a substrate,
A supply reel in which the adhesive tape is wound together with the release tape;
Of the release tape and the adhesive tape fed out from the supply reel, a removal part obtained by partially cutting and removing only the adhesive tape is provided at a predetermined interval, and the adhesive tape is provided with a predetermined length by the pair of the removal parts. A cutting and removing mechanism that divides into
A release tape cutting mechanism for cutting the release tape in a state protruding from at least one of both ends of the pressure-sensitive adhesive tape divided into a predetermined length at a portion corresponding to the removal portion;
An adhesive comprising: an adhesive means for adhering the adhesive tape cut to a predetermined length together with the release tape cut by the release tape cutting mechanism to a side portion of the substrate. Tape sticking device. A feed mechanism for pinching the tip of the release tape to which the adhesive tape is attached and pulling out the release tape from the supply reel with the surface to which the adhesive tape is attached facing down;
When the part corresponding to the removal portion of the release tape that has been pulled out and positioned by the feed mechanism is cut by the release tape cutting mechanism, the part is cut by the release tape cutting mechanism of the release tape. The adhesive tape sticking apparatus according to claim 1, further comprising: a holding unit that sucks and holds the upper surface of the portion upstream of the portion.   2. The adhesive tape sticking apparatus according to claim 1, wherein the sticking means sucks and holds the upper surface of the release tape when the release tape is cut by the release tape cutting mechanism. .   From the adhesive tape cut to a predetermined length and adhered to the side of the substrate together with the release tape, the end of the release tape protruding from the end of the adhesive tape is sandwiched from the adhesive tape The adhesive tape sticking device according to claim 1, further comprising a peeling means for peeling. The peeling means includes a clamping part in which a pair of clamping claws are provided so as to be openable and closable, and an arm body that is connected to a rotating shaft that is provided at one end and is rotationally driven at the other end.
The end of the release tape protruding from the end of the adhesive tape is clamped by the pair of clamping claws, and the arm body is rotated in a direction in which one end is separated from the upper surface of the substrate, whereby the release tape is moved to the adhesive tape. The adhesive tape sticking apparatus according to claim 4, wherein the pressure sensitive adhesive tape is peeled from the adhesive tape. It is a method of attaching an adhesive tape that cuts the adhesive tape attached to the release tape into a predetermined length and attaches it to the side of the substrate,
Providing a removal portion obtained by partially cutting and removing the adhesive tape from the release tape at a predetermined interval, and cutting the adhesive tape into a predetermined length by a pair of removal portions;
Projecting the release tape from the end of the pressure-sensitive adhesive tape cut into a predetermined length at a portion corresponding to the removal portion, and cutting the tape;
A step of attaching the adhesive tape, which has been cut to a predetermined length by a pair of removal parts, together with the cut release tape, to the side part of the substrate. .   If the adhesive tape is attached to the side portion of the substrate together with the release tape, the end of the release tape protruding from the end of the adhesive tape is clamped to remove the release tape from the adhesive tape. It peels, The sticking method of the sticking tape of Claim 6 characterized by the above-mentioned.

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