JP4724784B2 - Tape sticking device and tape sticking method - Google Patents

Description

  The present invention relates to a tape sticking apparatus and a tape sticking method for sticking an adhesive tape for adhering an electronic component to a substrate with a crimping head.

  A display panel such as a plasma panel or a liquid crystal panel used as a display of an electronic device is assembled by connecting electronic components for a driver to the edge of a glass panel serving as a display screen. In this assembling operation, an adhesive tape such as an anisotropic conductive tape is applied to cover the connection terminals formed on the edge of the glass panel (see, for example, Patent Document 1), and electronic components are mounted in advance. A driver board is bonded to the driver tape via the connector.

In the tape applying apparatus shown in this patent document example, a plurality of pressure-bonding heads are arranged in series, and adhesive tapes are simultaneously applied to a plurality of application positions set in a straight line at a constant pitch. As a result, the working efficiency can be improved as compared with the method in which the adhesive tape is individually applied to each application position, and a single adhesive tape is applied to cover all terminals for each side of the glass panel. There is an advantage that the waste of the adhesive tape generated in the method can be eliminated.
JP 2003-78239 A

  In recent years, with the increase in the screen size of a thin television, the size of the display panel used for this purpose tends to increase both vertically and horizontally. For this reason, the range where the above-mentioned adhesive tape is affixed in the assembly operation of such a large display panel also increases. However, in a display panel used as a television screen, since the number of scanning lines is constant regardless of the screen size, the number of required electronic components does not increase in proportion to the panel size.

  On the other hand, it is desirable to connect the electronic components for drivers at a uniform pitch along the edge of the panel in consideration of minimizing the connection resistance. Therefore, it is not preferable to arrange these electronic components in a concentrated manner. . For this reason, the arrangement pitch of the terminals to which the semiconductor elements are joined becomes sparse as the panel size increases, and it is necessary to affix adhesive tapes in the panel assembly operation.

  However, in the tape applicator shown in the above-mentioned patent document example, it has been difficult from the configuration of the applicator mechanism to cope with the above-mentioned uses in which the panel size and the applicator pitch are increased compared to the conventional one. Further, in the above-described apparatus, since the position of the crimping head is fixed, a plurality of types having different sticking pitches cannot be set as work targets, and the apparatus lacks multi-product compatibility. For this reason, in conventional tape affixing, either the method of affixing the adhesive tape individually for each affixing position or the method of affixing a continuous adhesive tape covering all terminals for each side is adopted. Therefore, it has been difficult to achieve both improvement in work efficiency and elimination of waste of the adhesive tape.

  Therefore, an object of the present invention is to provide a tape applying apparatus and a tape applying method that are excellent in work efficiency and can eliminate waste of an adhesive tape.

The tape applicator of the present invention is a tape applicator for cutting a tape-like adhesive layer into individual adhesive layers having a predetermined application length and applying the adhesive to a substrate at a predetermined tape application pitch, and holding the substrate. A substrate holding portion for positioning the tape, a tape supply mechanism for supplying the adhesive tape with the adhesive layer attached to one side of the base tape, and a tape application pitch equal to the pitch of the tape on the substrate above the substrate holding portion. A plurality of pressure-bonding heads, and a tape transport mechanism for transporting the adhesive tape supplied from the tape supply mechanism along a tape transport path set between the lower side of the plurality of pressure-bonding heads and the upper surface of the substrate; An elevating part that raises and lowers the plurality of pressure-bonding heads relative to the substrate holding part, and an unnecessary part by making a cut in the adhesive layer on the upstream side of the pressure-bonding head in the tape transport path By removing the, 1 / N of the tape joining pitch in the substrate the pieces adhesive layer on one side of said base tape (N is an integer of 2 or more) and a bonding layer cutting mechanism for forming each pitch .

The tape attaching method of the present invention includes a substrate holding unit that holds and positions a substrate, a tape supply mechanism that supplies an adhesive tape having a tape-like adhesive layer bonded to one side of a base tape, and an upper portion of the substrate holding unit. A plurality of pressure-bonding heads arranged at a pitch equal to a predetermined tape application pitch on the substrate, and the adhesive tape supplied from the tape supply mechanism between the lower side of the plurality of pressure-bonding heads and the upper surface of the substrate. A predetermined sticking length of the adhesive layer by a tape sticking device comprising a tape transport mechanism for transporting along a set tape transport path and an elevating unit for moving the plurality of crimping heads up and down relative to the work holding unit. A method of applying a tape, which is cut into individual adhesive layers and attached to a substrate at the tape application pitch, wherein a plurality of pressure-bonding heads are disposed above the substrate holding part. A crimping head arrangement step for arranging the adhesive layer at an equal pitch to the attaching pitch; and by cutting the adhesive layer on the upstream side of the crimping head in the tape transport path to remove unnecessary portions, An adhesive layer cutting step for forming on one surface of the base tape at a pitch of 1 / N (N is an integer of 2 or more) of the tape application pitch, and a tape for positioning the individual adhesive layers below the plurality of pressure bonding heads A positioning step, a pressure-bonding step in which the individual adhesive layer is pressure-bonded and bonded to the substrate by the pressure-bonding head by raising and lowering the elevating unit, and the tape is conveyed by 1 / N of the tape application pitch. And a tape feeding process for feeding along the path.

  According to the present invention, an unnecessary portion is removed by cutting the adhesive layer of the adhesive tape on the upstream side of the pressure-bonding head, and an individual adhesive layer having a predetermined application length is applied to one side of the base tape by 1 / of the tape application pitch. A tape forming step in which the adhesive layer is formed at every N pitch, and the individual adhesive layer is pressure-bonded to the substrate by a pressure-bonding head, and a tape feeding step in which the adhesive tape is sent along the tape transport path by 1 / N of the tape attaching pitch. By repeatedly performing the above, it is possible to apply the adhesive layer to each application position without waste by using multiple crimping heads, realizing tape application that is excellent in work efficiency and eliminates waste of the adhesive tape. Is done.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a tape applying device according to an embodiment of the present invention, FIG. 2 is a partial sectional view of a tape applying mechanism of the tape applying device according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is a block diagram showing the configuration of the control system of the tape applicator according to one embodiment of the present invention, FIG. 5, FIG. 6, FIG. 7, FIG. FIG. 9 is a process explanatory diagram of a tape attaching method according to an embodiment of the present invention.

  First, the structure of the tape applicator will be described with reference to FIGS. This tape applicator applies an anisotropic conductive agent (hereinafter abbreviated as “ACF”) as an adhesive layer used for adhering electronic components to an individual tape (individual adhesive layer) having a predetermined application length. It has a function of cutting and sticking to a substrate at a predetermined tape sticking pitch.

  In FIG. 1, a substrate holder 2 and an adhesive layer cutting mechanism 5 are disposed adjacent to each other on a base 1. The substrate holding unit 2 is configured by placing a substrate holding table 3 on an XY table 2XY. The substrate holding table 3 holds a substrate 4 to be affixed with tape. The substrate 4 is a display panel such as a liquid crystal panel, and is configured by laminating two glass panels.

  A piece of tape having a length corresponding to the size of the electronic component to be connected is attached to the edge 4a (see FIGS. 2 and 3) where one glass panel is exposed. By driving the XY table 2XY, the substrate 4 is positioned with respect to a tape applying mechanism described later. Then, the piece tape is attached to the positioned substrate 4 at a predetermined tape application pitch by a tape application mechanism described below.

  A tape sticking mechanism is disposed above the substrate holding unit 2. The tape applying mechanism has a head portion in which a plurality of pressure bonding heads (first pressure bonding head 20a, second pressure bonding head 20b, third pressure bonding head 20c, and fourth pressure bonding head 20d) are arranged in parallel on the front surface of a vertical lifting frame 11. 20, and the tape supply mechanism 12 and the tape transport mechanism 17 are arranged on the left and right sides of the head unit 20. The first pressure-bonding head 20a, the second pressure-bonding head 20b, the third pressure-bonding head 20c, and the fourth pressure-bonding head 20d have the same structure, and the pressure raising / lowering mechanism 22 and the pressure-bonding tool 23 are vertically arranged on the front surface of the vertical base plate 21. It has a structure.

  FIG. 2 shows a cross section of the tape applicator at an arbitrary position of the pressure bonding head of the head unit 20. A crimping tool 23 is vertically mounted on a base flange portion 21 a provided on the front surface of the base plate 21, and the crimping tool 23 is driven up and down by a pressing lift mechanism 22. A slider 24 fixed to the base plate 21 is slidably fitted to the guide rail 18 disposed in the horizontal direction on the front surface of the lift frame 11, and the base plate 21 moves in the horizontal direction on the front surface of the lift frame 11. It is free.

  A scale 19 is mounted in the horizontal direction on the front surface of the elevating frame 11 so that a plurality of crimping heads can be arranged at an arbitrary pitch by aligning the positions of the plurality of base plates 21 with the scales of the scale 19. It has become. Here, the plurality of pressure bonding heads are arranged at an equal pitch corresponding to the tape application pitch on the substrate 4.

  A guide groove 11 a is provided in the horizontal direction on the back surface of the elevating frame 11, and the fixing bolt 25 inserted through the upper part of the base plate 21 is disposed inside the collar member 27 interposed between the elevating frame 11 and the base plate 21. The nut member 26 is inserted into the guide groove 11a and screwed into the nut member 26. By fastening the fixing bolt 25 and the nut member 26, the base plate 21 is fixed to the elevating frame 11, and the position of each crimping head is fixed.

  The elevating frame 11 can be raised and lowered by an elevating frame drive mechanism (not shown), and by raising and lowering the elevating frame 11, the first pressure bonding head 20a, the second pressure bonding head 20b, the third pressure bonding head 20c, and the fourth pressure bonding head. The head 20 d moves up and down with respect to the substrate holding unit 2. The elevating frame 11 and the elevating frame driving mechanism 28 that elevates and lowers the elevating frame 11 are elevating parts that elevate and lower a plurality of crimping heads relative to the substrate holding part 2. Then, the pressing tool 23 is driven in a state where the first pressure-bonding head 20a, the second pressure-bonding head 20b, the third pressure-bonding head 20c, and the fourth pressure-bonding head 20d are lowered with respect to the substrate holding section 2, thereby the pressure-bonding tool 23. Is pressed against the substrate 4 held on the substrate holding table 3, whereby a tape pressing operation described later is performed.

  The tape supply mechanism 12 supplies an adhesive tape 13 having a configuration in which an ACF tape 14 as an adhesive layer is attached to one side of a base tape 13a. The tape transport mechanism 17 winds the base tape 13 a after the ACF tape 14 has been peeled off, so that the adhesive tape 13 supplied from the tape supply mechanism 12 is placed between the lower portion of the head portion 20 and the upper surface of the substrate 4. In addition, the lower ends of the guide rollers 15a and 15b are connected, and the guide rollers 15a and 15b are conveyed along a horizontal tape conveying path set in a straight line.

  The adhesive tape 13 supplied from the tape supply mechanism 12 reaches the lower surface side of the backup unit 16 through the guide roller 15a. Here, by cutting off only the ACF tape 14 of the adhesive tape 13 and removing unnecessary portions, an individual tape 14a having a length corresponding to the electronic component to be bonded (see FIG. 3) is obtained as a base tape. It is formed on the lower surface of 13a. These individual tapes 14a are moved together with the base tape 13a below the first pressure-bonding head 20a, the second pressure-bonding head 20b, the third pressure-bonding head 20c, and the fourth pressure-bonding head 20d of the head portion 20, respectively. As shown in FIG. 3A, a plurality of individual tapes 14a having a predetermined dimension L are attached to the edge 4a of the substrate 4 at a predetermined tape application pitch P.

  Next, the configuration and function of the adhesive layer cutting mechanism 5 will be described. The adhesive layer cutting mechanism 5 includes a horizontal moving unit 5a that moves in the XY direction by an XY table mechanism 6, and a cutting head 7 and a removal head 8 are disposed in the horizontal moving unit 5a. The cutting head 7 is provided with a cutter 7a whose blade edge is directed vertically upward and a cutter lifting mechanism (not shown) for lifting the cutter 7a. The cutter 7a is attached to the adhesive tape 13 whose upper surface is backed up by the backup unit 16. By raising and lowering, only the ACF tape 14 of the adhesive tape 13 is cut.

  The removal head 8 includes a roller 8a and a roller lifting mechanism (not shown) that lifts and lowers the roller 8a, and an adhesive tape 9 circulates on the upper surface side of the roller 8a. The adhesive tape 9 is supplied from the supply reel 10a and is taken up by the take-up reel 10b. The removal head 8 is raised with respect to the ACF tape 14 with the cuts at predetermined intervals, and the horizontal moving portion 5a is moved horizontally while the adhesive tape 9 is pressed against the ACF tape 14 by the roller 8a, and the take-up reel 10b. By causing the adhesive tape 9 to wind up, the ACF tape 14 is peeled from the base tape 13 a while being adhered to the adhesive tape 9.

  That is, in the ACF tape 14 laminated on the adhesive tape 13, a cut is made by the cutting head 7 at both end positions of a portion (see the removal portion 14b shown in FIG. 3B) that is not required in the tape application operation in advance. By removing the unnecessary portion of the ACF tape 14 with the removal head 8, an individual tape 14a to be attached to the substrate 4 is formed on the lower surface side of the base tape 13a on the upstream side of the head portion 20 of the tape transport path. can do.

  FIG. 3B shows the relationship between the tape application pitch P, the predetermined application length L of the individual tape 14a, and the removal dimension R of the removal portion 14b in the formation of the above-described individual tape 14a. The piece tapes 14a are cut out with the sticking length L from the ACF tape 14 laminated on the base tape 13a in a continuous state. Conventionally, only one piece of tape 14a is cut out from the ACF tape 14 corresponding to one tape application pitch P, and the remaining portion corresponding to (PL) is removed unused. It was abandoned.

On the other hand, in the tape sticking device of the present embodiment, when two or more individual tapes 14a can be cut out from the ACF tape 14 corresponding to one tape sticking pitch P, FIG. As shown in FIG. 2, a plurality (two in this case) of individual tapes 14a are formed. That is, by setting the dimension R of the removal portion 14b to R = (P−2L) / 2, two individual tapes 14a are formed from the ACF tape 14 corresponding to one tape application pitch P.

  In addition, since there is a practical minimum dimension Rm in the removal dimension R of the removal part 14b, if R calculated by the equation R = (P−2L) / 2 is less than Rm, two pieces The tape 14a cannot be formed, and the portion corresponding to the remaining (PL) from which one piece of tape 14a is cut out is removed as usual. Here, an example in which two pieces of tape 14a are cut out from the ACF tape 14 corresponding to one tape application pitch P has been shown. However, when L is relatively small with respect to P, an integer of 3 or more pieces are used. The piece tape 14a can also be formed.

That is, the adhesive layer cutting mechanism 5 having the above configuration is an individual adhesive layer by making a cut in the ACF tape 14 as an adhesive layer and removing unnecessary portions on the upstream side of the pressure-bonding head in the tape transport path. It has a function of forming individual tapes 14a having a predetermined length L on each side of the base tape 13a at a pitch of 1 / N (N is an integer of 2 or more) of the tape sticking pitch P.

  Next, the configuration of the control system will be described with reference to FIG. The control unit 30 controls the first pressure-bonding head 20a, the second pressure-bonding head 20b, the third pressure-bonding head 20c, the fourth pressure-bonding head 20d, the elevating frame driving mechanism 28, and the substrate holding unit 2 constituting the head unit 20 to apply the tape. In addition to controlling the operation, the tape transport mechanism 17 and the tape supply mechanism 12 are controlled to control the supply and transport operations of the adhesive tape 13. Further, the adhesive layer cutting mechanism 5 is controlled to control the operation of forming the individual tape 14a.

  The display unit 31 is a display panel, and displays a guidance screen at the time of input operation by the operation / input unit 32. In the work information storage unit 33, work information such as the above-described tape sticking pitch P, the sticking length L of the individual tape 14a, and the removal dimension R is stored. In the operation of forming the individual tape 14 a by the adhesive layer cutting mechanism 5, the work information is read from the work information storage unit 33.

  Next, a tape application method in which the ACF tape 14 is cut into individual pieces 14a having a predetermined application length by using the tape application apparatus having the above-described configuration and applied to the substrate 4 at the tape application pitch P will be described with reference to FIGS. This will be described with reference to FIGS.

  First, as shown in FIG. 5A, a plurality of pressure bonding heads (a first pressure bonding head 20a, a second pressure bonding head 20b, a third pressure bonding head 20c, and a fourth pressure bonding head 20d are taped above the substrate holding unit 2. Arrange at equal pitches (crimp head placement step) corresponding to the pasting pitch P. Next, cueing of the adhesive tape 13 is performed, that is, the tip of the ACF tape 14 laminated on the base tape 13a in the adhesive tape 13 The part is aligned with the cueing reference position 16a of the backup unit 16 (a position retroactive by the tape application pitch P from the first pressure bonding head 20a).

Next, on the upstream side of the pressure-bonding head in the tape conveyance path, the ACF tape 14 is cut to remove unnecessary portions, whereby the piece tape 14a is applied to one side of the base tape 13a and 1 / N of the tape attachment pitch. It is formed for each pitch (N is an integer of 2 or more) (adhesive layer cutting step). That is, as shown in FIG. 5B, the cutter 7a is moved up and down sequentially while being horizontally moved by the XY table mechanism 6, so that the ACF tape 14 positioned on the lower surface of the backup unit 16 is shown in FIG. The cuts for cutting out the piece tape 14a are sequentially put into four positions corresponding to both ends of the removal portion 14b.

Next, as shown in FIG. 5C, the removing operation of the removing unit 14b is performed. That is, the removal head 8 is moved, the roller 8a is pressed from the lower surface side to the position corresponding to the removal portion 14b via the adhesive tape 9, and the adhesive tape 9 is wound while the removal head 8 is moved horizontally. Thereby, the removal part 14b is adhesive-held by the adhesive tape 9, and peels from the base tape 13a. By performing this removal operation on the two removal portions 14b, as shown in FIG. 5 (d), the two individual tapes 14a have the tape application pitch P at the upstream side of the head portion 20 in the tape transport path. It is formed every 1/2 pitch.

  Thereafter, the piece tape 14a is positioned below the plurality of pressure bonding heads (tape positioning step). That is, by driving the tape transport mechanism 17 and feeding the base tape 13a by the tape application pitch P as shown in FIG. 6A, the piece tape 14a located at the head is moved to the first pressure-bonding head 20a. Adjust to position. Then, by repeating the adhesive layer cutting step (FIGS. 5A, 5B, and 5C) and the tape positioning step (FIG. 6A), as shown in FIG. The piece tape 14a is aligned with respect to each of the first pressure-bonding head 20a, the second pressure-bonding head 20b, the third pressure-bonding head 20c, and the fourth pressure-bonding head 20d. One piece tape 14a is in a standby state.

Next, a crimping process is performed in which the piece tape 14a is bonded to the substrate 4 by crimping. That is, as shown in FIG. 7A, the individual tape 14a on the lower surface of the base tape 13a is brought into contact with the upper surface of the substrate 4 by lowering the elevating frame 11. Next, as shown in FIG. 7B, the crimping tool 23 is lowered by each crimping head and brought into contact with the upper surface of the piece tape 14a. As shown in FIG. By pressing the tape 14 a against the substrate 4, a plurality of individual tapes 14 a are pasted together at the respective pasting positions. During this pressing operation, an operation for newly forming the piece tape 14a by the adhesive layer cutting mechanism 5 is executed in parallel on the upstream side of the tape transport path. That is, the adhesive layer cutting step and the crimping step are performed concurrently.

  When the pressing operation in the crimping step is completed, as shown in FIG. 8A, the crimping tool 23 is raised and the lifting frame 11 is raised in each crimping head. At this time, the base tape 13a rises together with the piece tape 14a located at the intermediate position of each crimping head. As a result, the base tape 13a is peeled off from the individual tape 14a that has already been pressure-bonded to the substrate 4, and the tape application work for the substrate 4 is completed. After completion of the work, the substrate 4 is unloaded from the substrate holding table 3, and a new substrate 4 is loaded into the substrate holding table 3.

  Next, a tape feeding process is performed. That is, the adhesive tape 13 is fed along the tape transport path by 1/2 of the tape application pitch P. As a result, as shown in FIG. 8B, the piece tape 14a at the intermediate position of each crimping head moves by P / 2 and is aligned with each crimping head.

  Thereafter, the crimping operation of attaching the piece tape 14a to the new substrate 4 is executed again. Here, the operations shown in FIGS. 8C and 9A are the same as the operations in FIGS. 7A and 7B, and thereafter, as shown in FIG. While raising the crimping tool 23 in the head, the elevating frame 11 is raised. As a result, the base tape 13a is peeled off from the individual tape 14a pressure-bonded to the substrate 4, and the tape application work for the substrate 4 is completed. Thereafter, the same operation is repeatedly performed.

As described above, in the tape applicator shown in the present embodiment, on the upstream side of the head portion in which a plurality of crimping heads are arranged at an equal pitch, the unnecessary portion is removed by cutting the adhesive layer of the adhesive tape, Individual adhesive layers having a predetermined pasting length are formed on one side of the base tape at a pitch of 1 / N of the tape pasting pitch. Then, when affixing the formed individual adhesive layer to the substrate, a crimping process for crimping the individual adhesive layer to the substrate by a crimping head, and the adhesive tape along the tape transport path by 1 / N of the tape application pitch. Repeat the tape feeding process to be sent.

  As a result, the arrangement pitch of the terminals to which the semiconductor elements are joined becomes sparse as the panel size increases, and even when the adhesive tape is affixed in the panel assembly operation, the adhesive layer is applied to each affixing position by a plurality of crimping heads. Can be pasted without waste.

  Therefore, the conventional method forced to adopt either the method of sticking the adhesive tape individually for each sticking position or the method of sticking a single adhesive tape covering all terminals for each side Compared to the above, it is possible to realize tape sticking which is excellent in work efficiency and can eliminate waste of the adhesive tape.

  In addition, since the position of each of the multiple crimping heads is variable and the arrangement pitch can be set arbitrarily, multiple types with different tape application pitches can be targeted for operation, and a tape application device with excellent multi-product compatibility has been realized. ing.

  The tape sticking device and the tape sticking method of the present invention have an effect of being excellent in work efficiency and eliminating the waste of the adhesive tape, and a field in which an adhesive tape used for electronic component adhesion is attached to a substrate by a pressure bonding head. Is available.

The front view of the tape sticking apparatus of one embodiment of this invention The fragmentary sectional view of the tape sticking mechanism of the tape sticking device of one embodiment of the present invention The top view of the board | substrate used as the object of the tape sticking apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the tape sticking apparatus of one embodiment of this invention Process explanatory drawing of the tape sticking method of one embodiment of this invention Process explanatory drawing of the tape sticking method of one embodiment of this invention Process explanatory drawing of the tape sticking method of one embodiment of this invention Process explanatory drawing of the tape sticking method of one embodiment of this invention Process explanatory drawing of the tape sticking method of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 Substrate holding part 4 Substrate 5 Adhesive layer cutting mechanism 11 Lifting frame 12 Tape supply mechanism 13 Adhesive tape 13a Base tape 14 ACF tape 14a Single piece tape 14b Removal part 17 Tape transport mechanism 20 Head part 23 Crimping tool P Tape application pitch L Application length

Claims (3)

A tape applicator that cuts a tape-like adhesive layer into individual adhesive layers of a predetermined application length and applies the tape to a substrate at a predetermined tape application pitch,
A substrate holding portion for holding and positioning the substrate; a tape supply mechanism for supplying an adhesive tape having the adhesive layer attached to one side of a base tape; and a tape application pitch on the substrate above the substrate holding portion; A plurality of pressure-bonding heads arranged at equal pitches and the adhesive tape supplied from the tape supply mechanism are conveyed along a tape conveyance path set between the lower side of the plurality of pressure-bonding heads and the upper surface of the substrate. A tape transport mechanism, an elevating unit that raises and lowers the plurality of pressure-bonding heads relative to the substrate holding unit, and cuts the unnecessary portion by cutting the adhesive layer on the upstream side of the pressure-bonding head in the tape transport path. by forming each pitch of the tape joining pitch of 1 / N (N is an integer of 2 or more) in the substrate the pieces adhesive layer on one side of the base tape Tape applying apparatus characterized by comprising an adhesive layer cutting mechanism that. A substrate holding portion for holding and positioning the substrate, a tape supply mechanism for supplying an adhesive tape having a tape-like adhesive layer bonded to one side of the base tape, and a predetermined tape affixing on the substrate above the substrate holding portion A plurality of pressure-bonding heads arranged at a pitch equal to the pitch, and the adhesive tape supplied from the tape supply mechanism along a tape conveyance path set between the lower side of the plurality of pressure-bonding heads and the upper surface of the substrate The adhesive layer is cut into individual adhesive layers having a predetermined pasting length by a tape applicator provided with a tape transport mechanism that transports the plurality of pressure-bonding heads and a lifting unit that lifts and lowers the plurality of pressure-bonding heads relative to the work holding unit. A tape application method for attaching to the substrate at the tape application pitch,
There is no need to make a cut in the adhesive layer on the upstream side of the pressure-bonding head in the tape conveyance path, and a pressure-bonding head placement step in which a plurality of pressure-bonding heads are arranged at a pitch equal to the tape application pitch above the substrate holding part. An adhesive layer cutting step in which the individual piece adhesive layer is formed on each side of the base tape at a pitch of 1 / N (N is an integer of 2 or more) by removing a portion; A tape positioning step for positioning an adhesive layer below the plurality of pressure-bonding heads, a pressure-bonding step in which the individual adhesive layer is pressure-bonded to the substrate by the pressure-bonding head by raising and lowering the elevating part, and the bonding And a tape feeding step of feeding the tape along the tape transport path by 1 / N of the tape application pitch.   3. The tape affixing method according to claim 2, wherein the adhesive layer cutting step and the pressure bonding step are executed in parallel.

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