JP2003066479A - Press-contacting method of tape automatic bonding component to liquid crystal panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a press-contacting method of a tape automatic bonding (TAB) component to a liquid crystal panel, in which the occurrence of an exposed part of a lead electrode is prevented without requiring an additional process by setting the width of an anisotropic conductive film (ACF) tape used for press-contact mounting of the TAB part with a liquid glass substrate to be wide and covering the lead electrode of the TAB part with the ACF tape. SOLUTION: In the case that the TAB part 5a or 5b is press-fitted by using ACF tape 10 to the liquid glass substrates 2, 3 of the liquid crystal panel 1, the width of the ACF tape is set wide to reach a solder resist part 9 of the TAB part 5a or 5b and when the TAB part 5a or 5b is press-fitted to the liquid crystal glass substrates 2, 3, the ACF tape 10 is pasted to cover the exposed part of the lead electrode 6 of the TAB part 5a or 5b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for crimping a TAB component to a liquid crystal panel, and more particularly to a glass substrate forming the liquid crystal panel, the TAB component being a liquid crystal driving IC being an anisotropic conductive film ACF tape. The present invention relates to a crimping method for crimping.

[0002]

2. Description of the Related Art In a manufacturing process of a liquid crystal panel, a liquid crystal driving IC is mounted around a liquid crystal panel formed by facing two first and second liquid crystal glass substrates. As this liquid crystal driving IC, a tape automated bonding component (hereinafter referred to as a TAB component) is generally used.

First, a liquid crystal panel 1 on which TAB parts are mounted
As shown in FIG. 7 and FIG.
The second liquid crystal glass substrates 2 and 3 are made to face each other, and these are adhered to each other with a predetermined space into which liquid crystal can be injected later.

A wiring pattern is formed on each of the facing surfaces of the first and second liquid crystal glass substrates 2 and 3, and an electrode 4 connected to the wiring pattern is led out to each edge.

In such a liquid crystal panel 1, as shown in FIG.
As shown in FIG. 3, the electrode 4 is led out to two parallel sides of the first liquid crystal glass substrate 2, the electrode 4 is led out to one side of the second liquid crystal glass substrate 3, and the first liquid crystal glass The TAB component 5a is provided on the portion of the substrate 2 where the electrode 4 is led out.
The TAB component 5b (for example, the gate side) is mounted on the portion (for example, the source side) where the electrode 4 of the second liquid crystal glass substrate 3 is led out.

Next, the TAB parts 5a and 5b are shown in FIG.
As shown in FIG. 3, the semiconductor element 8 is inner lead bonded to a thin cine film-shaped film carrier 7 having a predetermined circuit pattern on one surface side and a lead electrode 6 for leading the circuit pattern to an edge portion, and the circuit is formed by inner lead bonding. It is manufactured by protecting the surface of the pattern with a solder resist 9 and punching the film carrier 7 into a shape as shown in FIG.

To mount the TAB components 5a and 5b on the first and second liquid crystal glass substrates 2 and 3 of the liquid crystal panel 1, for example, an anisotropic conductive film (hereinafter referred to as ACF tape) 10 is used. To be The ACF tape 10 is a tape-shaped adhesive material in which conductive particles are mixed in a thermosetting or thermoplastic resin film, and one surface side is protected by a release paper 11.

Conventionally, this ACF tape 10 is previously attached to the TAB components 5a, 5b side or the first and second liquid crystal glass substrates 2, 3 side. In this case, this ACF
The tape 10 is attached with its longitudinal direction crossing the lead electrodes 6 of the TAB components 5a and 5b.

When connecting the TAB components 5a and 5b to the first and second liquid crystal glass substrates 2 and 3, first, T
The lead electrodes 6 of the AB components 5a and 5b and the electrodes 4 of the wiring pattern formed on the edges of the liquid crystal glass substrates 2 and 3 are positioned so as to face each other, and the TAB component 5 is used.
By pressing a and 5b against the first and second liquid crystal glass substrates 2 and 3 via the ACF tape 10,
Depending on the adhesive force of the tape 10, the TAB parts 5a, 5b
Is temporarily pressure-bonded to the first and second liquid crystal glass substrates 2 and 3.

Then, using a thermocompression bonding tool, the TAB
The lead electrodes 6 of the components 5a and 5b are pressed and heated against the first and second liquid crystal glass substrates 2 and 3. As a result, the ACF tape 10 is cured and the lead electrode 6
The wiring patterns of the first and second liquid crystal glass substrates 2 and 3 are electrically and mechanically joined.

The TAB components 5a and 5b are subjected to the ACF tape attaching process, the temporary pressure bonding process and the final pressure bonding process, so that the first and second liquid crystal glass substrates 2,
3 respectively.

Liquid crystal glass substrates 2, 3 of the liquid crystal panel 1
An outer lead bonding apparatus (hereinafter referred to as an OLB apparatus) 12 as shown in FIG. 6 has been generally used in order to pressure-bond and mount the TAB components 5a and 5b.

This OLB device 12 is composed of an ACF tape 10
ACF tape sticking unit 13 for sticking to the first and second liquid crystal glass substrates 2 and 3 of the liquid crystal panel 1.
Then, the temporary pressure bonding unit 1 for pressing the TAB components 5a and 5b against the portion where the ACF tape 10 is stuck and temporarily pressure bonding
4 and the TAB components 5a and 5b that have been temporarily pressure-bonded to the liquid crystal glass substrates 2 and 3 via the ACF tape 10 by pressure and heating to perform the pressure-bonding.

In addition, if necessary, the ACF tape 10 is attached to the TAB parts 5a and 5b in the repair (repair) or the like.
When the ACF tape is attached, another ACF tape attaching unit 16 is prepared.

FIGS. 7 and 9 show a conventional example in which the TAB components 5a and 5b are mounted by pressure bonding on the liquid crystal glass substrates 2 and 3 of the liquid crystal panel 1 using the OLB device 12.

In FIG. 1, the electrodes 4 of the wiring pattern and the lead electrodes 6 of the circuit pattern of the TAB components 5a and 5b provided on the liquid crystal glass substrates 2 and 3 of the liquid crystal panel 1 are AC.
It is connected through the F tape 10.

Conventionally, the ACF tape 10 has a width corresponding to the overlapping amount of the liquid crystal glass substrates 2 and 3 and the TAB components 5a and 5b. Therefore, as is apparent from FIG. 7, a bare portion 6a is formed on the outside of the liquid crystal glass substrates 2 and 3 in a part of the lead electrode 6 of the TAB components 5a and 5b that are pressure-bonded and mounted.

As described above, if the lead electrode 6 has a bare portion 6a, the bare portion 6a causes wire breakage or corrosion, which increases the rate of defective products.

[0019]

Therefore, conventionally, the exposed portion 6a of the lead electrode 6 is protected by coating the exposed portion 6a with a silicone resin or the like and then curing it by UV irradiation. .

However, such a method requires a separate coating step of silicon resin or the like for protecting the lead electrodes 6, resulting in not only an increase in cost but also a decrease in efficiency.

Further, as can be seen from FIG. 9, the length of the ACF tape 10 used in the conventional pressure-bonding mounting method is one continuous long one along each edge of the liquid crystal glass substrates 2 and 3. Are using. Therefore, the TAB parts 5a and 5b
The ACF tape 10 is also attached between the gaps between the TAB components 5a and 5b.
The tape 10 becomes an unnecessary part.

Therefore, the ACF in the conventional crimp mounting method is used.
The use of the tape 10 is uneconomical because it is attached to an unnecessary portion, and the crimping tool does not come into direct contact with the exposed portion of the ACF tape 10 during the process of temporary pressure bonding and main pressure bonding. It is necessary to perform processing (for example, sandwiching a fluororesin sheet) so that the pressure bonding tool does not come into contact with the exposed portion of the ACF tape 10, and there is a problem in that these processing are troublesome.

Further, FIG. 10 shows another ACF described in FIG.
Using the tape attaching unit 16, the TAB component 5a,
The ACF tape 10 cut into a size corresponding to the length of 5b is not the liquid crystal glass substrates 2 and 3, but the TAB component 5
It shows a state of pasting from a and 5b.

Conventionally, the dimensionally cut ACF tape 10 is
Only the special case at the time of repair is pasted on the AB parts 5a and 5b. In this case, the conventional ACF pasting unit 13 cannot be used, and therefore, the dedicated AC
The F-tape attaching unit 16 is required.

Therefore, an object of the present invention is to set a wide width of an ACF tape used for pressure bonding mounting of a liquid crystal glass substrate and a TAB component, and cover the lead electrode of the TAB component with this ACF tape, thereby requiring a separate process. Eliminates the occurrence of exposed lead electrode parts
By cutting the length of the F-tape to the length of the TAB part and using it, cost reduction and efficiency improvement can be achieved, and the cost and space saving of the crimping process can be achieved. It is to provide a crimping method for TAB components.

[0026]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention is to crimp a TAB component onto a liquid crystal panel of a liquid crystal panel using an ACF tape. In the method, said ACF
The width of the tape is set wide enough to reach the solder resist part of the TAB component, and when the TAB component is pressure-bonded and mounted on the liquid crystal glass substrate, the ACF tape is used to cover the exposed portion of the lead electrode of the TAB component. It adopts a structure in which it is extended to the solder resist portion and pasted.

By thus covering the exposed portion of the lead electrode of the TAB component with the wide ACF tape, the problem due to the exposed portion of the lead electrode can be solved without requiring a separate processing step. It can be performed only by the crimping and mounting process of the TAB component on the liquid crystal glass substrate.

For crimping and mounting the TAB component on the liquid crystal glass substrate with the ACF tape, the ACF tape cut to the length of the TAB component is placed on the table, and the A
The CF tape is placed on the lower side, the TAB component is pressed from above and the ACF tape is attached, and then the TAB component is pressure-bonded and mounted on the liquid crystal glass substrate of the liquid crystal panel with the ACF tape.

The table is installed near an appropriate position of the temporary press-bonding unit, and the ACF tape cut from the cutting / feeding mechanism of the ACF tape to the length dimension of the TAB component is placed on the table. , TAB components punched from a sheet or reel are fed through a TAB component supply mechanism,
It should be attached to the ACF tape placed on the table.

The pasting work can be performed by using the temporary crimping tool of the temporary crimping unit. In this way, the TAB with the ACF tape attached
Next, the component is aligned with the liquid crystal glass substrate of the liquid crystal panel transferred to the predetermined position of the temporary pressure bonding unit, and then temporarily pressed by the temporary pressure bonding tool.

Further, an ACF tape sized to the length of the TAB part is placed on the table, and the TAB is placed on the table.
By attaching the components, even a wide ACF tape can be reliably attached without causing attachment failure, and unnecessary ACF tapes are not attached between the TAB components of the liquid crystal glass substrate. .

[0032]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view showing a crimping device for carrying out the method of the present invention, and FIG. 2 is a vertical sectional side view taken along the arrow II-II in FIG.

As shown in FIGS. 1 and 2, the temporary pressure bonding unit 14
ACF tape 10 and TAB parts 5a, 5
Install an index table 21 for pasting b, and place A at the outer peripheral position of this index table 21.
A cutting and feeding mechanism 22 for the CF tape 10 is provided, and a TAB component feeding mechanism 23 is arranged at a position opposite to the temporary pressure bonding unit 14 with the index table 21 interposed therebetween.

Here, the TAB parts 5a and 5b are a tape carrier package (TCP), a flexible printed circuit board (FPC), and a chip-on flexible circuit board (CO).
F) etc. are included.

The temporary pressure bonding unit 14 is the liquid crystal panel 1
The temporary pressure bonding table 24 for adsorbing and holding
(Horizontal), Z (vertical), and θ (rotation) can be moved. In the main pressure bonding unit 15, the main pressure bonding table 25 that sucks and holds the liquid crystal panel 1 can move in the same manner as the temporary pressure bonding table 24. A crimping tool 26 for main crimping is arranged on the side of the main crimping table 25.

The index table 21 is formed in a disk shape, and is arranged at a lateral position of the temporary pressure bonding unit 14 so as to be intermittently rotated in a horizontal state. , Crimping tool 27
Is provided to be movable up and down.

Around the index table 21, a TAB component supply position a at a position facing the TAB component supply mechanism 23 and an ACF tape attachment position b.
And the provisional pressure bonding position c and the defective product discharge position d are set at equal intervals of 90 °, the TAB component supply position a faces the TAB component activating / feeding mechanism 23, and
The temporary crimping position c faces the temporary crimping unit 14, and the AC
A cutting and feeding mechanism 22 for the ACF tape 10 is arranged at the F tape attaching position b.

At the temporary pressure bonding position c, the pressure bonding tool 27 descends and the ACF tape 10 is used to move the TAB components 5a and 5b.
A support base 28 for receiving the lower surfaces of the liquid crystal glass substrates 2 and 3 when temporarily pressing b onto the liquid crystal glass substrates 2 and 3 of the liquid crystal panel 1.
Are arranged, and the index table 21 is intermittently rotated by the arrangement intervals of the positions a to d in a state where each crimping tool 27 is stopped at any of the positions a to d.

The crimping tool 27 has a heat source (constant heater) as shown in FIG.
The structure is such that the components 5a and 5b are preheated and adsorbed and held.

Here, the cutting and feeding mechanism of the ACF tape 10 is, as shown in FIG.
The length is the same as the AB parts 5a and 5b, and the width is TAB.
The parts 5a and 5b are cut into a wide width that reaches the solder resist portion 9.

FIG. 3 shows the structure of the cutting / feeding mechanism 22 for the ACF tape 10. The position of the ACF tape adhering position b is in the middle of the horizontal running portion of the ACF tape 10 which is pulled out from the feeding reel toward the take-up reel. A vertically movable backup base (table) 29 that supports the lower surface of the ACF tape, and a fixed-position guide roller 30 that supports the lower surface of the ACF tape 10 on the entry side of the ACF tape 10 with respect to the backup base 29.
With respect to the backup base 29, a pair of peeling rollers 31a and 31b located on the upper and lower sides of the release paper 11 on the exit side of the ACF tape 10 and movable vertically and horizontally, and with respect to the fixed position guide roller 30. Located on the upper side of the ACF tape 10 on the output side, the ACF tape 10 is placed on the lower cradle 3
It is formed with a vertically movable cutter 33 that cuts with 2,
The crimping tool 27 stopped at the ACF tape attaching position b of the index table 21 is the ACF tape 10
It will be located directly above the backup base 29 with the pinch in between.

A cutting and feeding mechanism 22 for the ACF tape 10
Then, in order to attach the TAB components 5a and 5b and the ACF tape 10, as shown in FIG. 3A, at the ACF tape attaching position b, the crimping tool 2 in the raised position is used.
7 adsorbs the TAB parts 5a and 5b on the lower surface thereof, the pair of peeling rollers 31a and 31b are in the retracted position, and the cutter 33 of the ACF tape 10 causes the TAB parts 5a and 5b to move.
3B with a length corresponding to the width of the TAB components 5a, 5b, which reaches the solder resist portion 9 and is cut wide, stops immediately below the crimping tool 27.
, Press down the crimping tool 27 to remove the ACF tape 1
The TAB parts 5a and 5b are attached to the No. 0 so as to be pressed from above. At this time, the ACF tape 10 is raised by the backup base 29, and the TAB component 5 is
You may press and stick to a and 5b.

Next, as shown in FIG. 3C, the backup base 29 is lowered, the peeling roller 31a is lowered, and the TAB parts 5a, 5a are moved forward just below the pressure bonding tool 27.
The release paper 11 of the ACF tape 10 to which 5b is attached is removed by moving the release rollers 31a and 31b.
Only 0 is attached to the TAB parts 5a and 5b. And
When peeling off the release paper 11, the peeling rollers 31a, 31
Since b moves by pushing upward the ACF tape 10 attached to the TAB components 5a and 5b, the TAB components 5a and 5b adsorbed by the pressure bonding tool 27 should fall from the pressure bonding tool 27. There is no. After that, the pressure bonding tool 27 is moved to the temporary pressure bonding position c shown on the right side of FIG. 2 by the rotation of the index table 21.

The TAB component supply mechanism 23 includes a supply unit 34 for the source side TAB component 5a and a gate side TAB component 5a.
In the supply section 34 of the source-side TAB component 5a, the film carrier 7 having the source-side TAB components mounted at regular intervals is wound around a reel 36, and the film carrier 7 pulled out from the reel 36. Is formed while the punching member 37 is arranged during the movement of the film, and the index table 38 is arranged below the punching member 37. The film carrier 7 is drawn out from the reel 36, and is fed to the electrode 6 of the sensing and source side TAB part 5a. Cleaning is performed automatically by removing the kimono using an adhesive tape.

The punching member 37 is, as shown in FIG.
The die 39 for receiving the lower surface of the film carrier 7 and the punch 40 which is located above the film carrier 7 and moves up and down. The punch 40 is a source side TA for the die 39.
After the B part 5a is positioned, it descends and TAB is performed with the die 39.
The part 5a is punched out.

The index table 38 is formed in a disk shape, and is arranged at a position on the lower side of the die 39 so as to rotate intermittently in a horizontal state.
8 on the upper surface of the TAB part, and on the upper surface of the TAB component 5a
Is provided for adsorbing and holding.

Around the index table 38, the receiving position e of the TAB component 5a and the TAB
The take-out position f of the component 5a is set so as to sandwich the axis, and the receiving position e of the TAB component 5a is set to the die 39.
Of the TAB component 5a and the take-out position f of the TAB component 5a are arranged so as to be close to the TAB component supply position a of the index table 21 where the TAB component 5a and the ACF tape 10 are attached. In the state where both support portions 41 are stopped at either of the positions e and f, they are intermittently rotated every 180 ° which is the arrangement interval between the positions e and f.

Further, the supply unit 3 of the gate side TAB component 5b
5 has the same structure as the supply unit 34 of the source side TAB component 5a described above, and therefore, the same parts as those of the supply unit 34 of the gate side TAB component 5a will be denoted by the same reference numerals and will not be described.

Next, a method of crimping the TAB component to the liquid crystal panel will be described with reference to FIGS.

Source side TAB of TAB component supply mechanism 23
At the punching position e of the supply unit 34 of the component 5a and the supply unit 35 of the gate side TAB component 5b, as shown in FIG. 2, the TAB component 5a or 5b punched by the punch 40 and the die 39 has respective index tables. Three
It is received by the support portion 41 of No. 8 and is sent to the TAB component take-out position f by the rotation of the index table 38.

Either one of the TAB parts 5a or 5b at the take-out position f of both index tables 38 is index table 2 by an appropriate transfer means such as a suction type.
1 is supplied to the lower surface of the crimping tool 27 that stops at the TAB component supply position a, and the crimping tool 27 is the TAB component 5
Adsorb and hold a or 5b while preheating,
The B part 5a or 5b is transferred to the ACF tape attaching position b by the rotation of the index table 21.

As shown in FIGS. 3A to 3C, an ACF tape cutting / supplying mechanism 22 is arranged at the ACF tape attaching position b, and is cut by the ACF tape cutting / supplying mechanism 22. The ACF tape 10 is peeled off from the release paper 11 and the ACF tape 10 placed on the backup base 29 is turned down.
The B component 5a or 5b is pressed and adhered, whereby the ACF tape 10 is adhered to the lower surface of the TAB component 5a or 5b, and then the ACF tape 10 is adhered to the lower surface by the rotation of the index table 21. The crimping tool 27 holding the component 5a or 5b by suction moves to the temporary crimping position c facing the temporary crimping unit 14.

In the temporary pressure-bonding unit 14, the temporary pressure-bonding table 24 holding the liquid crystal panel 1 at a fixed position is moved, and the TAB component bonding positions of the liquid crystal glass substrates 2 and 3 of the liquid crystal panel 1 are moved to the temporary pressure bonding position c. Crimping tool to stop 27
Is positioned so as to face directly below, and in this state, the crimping tool 27 extends to lower the TAB part 5a or 5b,
The TAB component 5a or 5b is temporarily pressure-bonded onto the liquid crystal glass substrate 2 or 3 with the ACF tape 10.

Here, FIG. 8 shows a state in which the ACF tape 10 is pasted onto the liquid crystal glass substrate 2 or 3 of the liquid crystal panel 1 from the upper side by using the ACF tape pasting unit 13 shown in FIG. It is a thing. ACF tape 1
The liquid crystal panel 1 to which 0 is attached is then transferred to the temporary pressure bonding unit 14.

As described above, in the conventional ACF tape attaching unit 13, the ACF tape 10 is attached to the liquid crystal glass substrate 2.
Alternatively, as shown in FIG. 4, since it is configured to be pasted on the upper side of the A, the wide width A adopted by the present invention is used.
When the CF tape 10 is attached, one side of the ACF tape 10 protrudes from the liquid crystal glass substrate 2 or 3 as shown by a chain double-dashed line in FIG. Therefore, the conventional ACF tape sticking unit 13 cannot carry out the method of the present invention.

On the other hand, according to the present invention, as shown in FIG. 5, the ACF cut to the length of the TAB part 5a or 5b is used.
The tape 10 is placed on the backup base 29 (table), the placed ACF tape 10 is placed downward, and the TAB component 5a or 5b is pressed onto the tape 10 to attach the ACF tape 10, and then the TAB component. 5a or 5b
By adopting a method in which the ACF tape 10 is pressure-bonded and mounted on the liquid crystal glass substrate 2 or 3 of the liquid crystal panel 1, the wide ACF tape 10 is used and the liquid crystal glass substrate 2 or 3 is used.
When the TAB component 5a or 5b is pressure-bonded to the
The lead electrode 6 of the TAB component 5a or 5b with the F tape 10
It is possible to extend the ACF tape 10 up to the solder resist portion 9 and attach it so as to cover the exposed portion 6a.

As described above, when the TAB components 5a and 5b are sequentially provisionally pressure-bonded to the peripheral portions of both liquid crystal glass substrates 2 or 3, the liquid crystal panel 1 is then subjected to the main pressure-bonding table 25 of the main pressure-bonding unit 15. The TAB components 5a and 5b are transferred to the upper side and the TAB components 5a and 5b are finally pressure-bonded by the movement of the main-pressure bonding table 25 and the pressure-bonding tool 26.

[0059]

As described above, according to the present invention, the AC
Since the width of the F tape is set to be wide enough to reach the solder resist portion of the TAB component, and when the TAB component is pressure-bonded and mounted on the liquid crystal glass substrate, the exposed portion of the lead electrode of the TAB component is covered by the ACF tape. A coating process of silicon resin or the like for protecting the lead electrodes is not required, and the cost can be reduced.

Further, the ACF tape cut to the length dimension of the TAB component is placed on the table, and the TAB component is attached to the ACF tape on the table. It is installed at an appropriate position in the vicinity, and the pasting work is performed by using the crimping tool of the temporary crimping unit to perform the ACF tape pasting unit in the conventional OLB device and the ACF tape at the time of repair.
This eliminates the need for a separate unit for attaching the CF tape, thereby reducing the cost and space of the crimping process.

Further, the dimensioned ACF tape is placed on the table, and the TAB parts are attached to the ACF tape from above, so that even if the ACF tape is wide, the attachment failure may occur. There is no need to attach the ACF tape to the liquid crystal glass substrate of the liquid crystal panel, and the ACF tape is not wasted.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of an apparatus for crimping a TAB component to a liquid crystal panel according to the present invention.

FIG. 2 is a side view taken along the arrow II-II in FIG.

3A to 3C are ACFs in a crimping device.
Side view showing in sequence the process of attaching the TAB parts of the tape cutting and supplying mechanism and the ACF tape

FIG. 4 is an enlarged vertical cross-sectional view showing a crimped state of a TAB component to a liquid crystal panel of the present invention.

FIG. 5 (A) is an explanatory view showing a step of attaching the ACF tape to the TAB component of the present invention, and FIG. 5 (B) is a vertical sectional view of the same attached state.

FIG. 6 is a plan view showing a conventional OLB device.

FIG. 7 is a vertical cross-sectional view showing a temporary pressure bonding state of a TAB component to a liquid crystal panel by a temporary pressure bonding unit of a conventional OLB device.

FIG. 8 is a vertical sectional view showing a state in which an ACF tape is attached to a liquid crystal panel by an ACF tape attaching unit of a conventional OLB device.

FIG. 9 is a plan view showing a mounting state of TAB parts on a conventional liquid crystal panel.

FIG. 10 is a longitudinal sectional view showing a state in which an ACF tape attaching unit separately prepared for a conventional OLB device attaches an ACF tape to a TAB component.

[Explanation of symbols]

21 index table 22 TAB parts supply mechanism 23 TAB parts supply mechanism 24 Temporary crimping table 25-piece crimping table 26 Crimping tool 27 Crimping tool 28 Support 29 Backup base 30 Fixed position guide roller 31 Peeling roller 32 cradle 33 cutter 34 Supply Department 35 Supply Department 36 reels 37 Punching member 38 index table 39 die 40 punch 41 Support

Claims (2)

[Claims] 1. ACF on a liquid crystal glass substrate of a liquid crystal panel
In a method of crimping a TAB component to a liquid crystal panel in which a TAB component is pressure-bonded using a tape, the width of the ACF tape is set to a wide width reaching a solder resist portion of the TAB component, and the TAB component is crimped to a liquid crystal glass substrate. A method for crimping a TAB component to a liquid crystal panel, characterized in that, when mounting, the ACF tape is extended and attached to a solder resist portion so that the exposed portion of the lead electrode of the TAB component is covered with this ACF tape. 2. ACF on a liquid crystal glass substrate of a liquid crystal panel
In the crimping method of crimping and mounting a TAB component on a liquid crystal panel using a tape, the ACF tape cut to the length of the TAB component is placed on a table, and the placed ACF tape is placed downward, The TAB to the liquid crystal panel according to claim 1, wherein the TAB component is pressed from above and the ACF tape is attached, and then the TAB component is pressure-bonded and mounted on the liquid crystal glass substrate of the liquid crystal panel with the ACF tape. How to crimp parts.