JPH0672624A - Film peeling-off device - Google Patents

Abstract

PURPOSE:To peel off a film without any damage by peeling off the edge of a layered film through an adhesive tape in peeling off a layered film from a board to which the layered film is affixed, and clamping the edge with a peeling arm for separation of films. CONSTITUTION:A separate unit 4 is lowered to a board 1 side which is vacuum- stuck to a substrate fixing base 3, and at the same time, the substrate protective plate 18 of a temporary clamper 19 is inserted from the substrate edge part to make the top end of the substrate protecting plate collide with the edge part of the layered film 2. With this constitution, a tape affixing head 10 where an adhesive tape 12 which can be automatically wound up is pressed onto the edge of the layered film 2 of the substrate 1 according to the expanding action of an air cylinder 11 to make the adhesive surface of the adhesive tape 12 adhere to the layered film 2. Next, a unit 4 is lifted, the layered film 2 is peeled off partially from the substrate 1 through the adhesive tape 12. Then the film 2 is clamped by the peeling clamper 9 in place of the adhesive tape 12, thus separating the layered film 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film peeling device for peeling only a base film of a laminated film from a substrate to which the laminated film is attached.

[0002]

2. Description of the Related Art A number of film peeling apparatuses of this kind have been proposed in the past, and representative ones thereof are Japanese Patent Laid-Open Nos. 59-174677 and 62-50835.
The former Japanese Patent Laid-Open No. 59-1
No. 74677 discloses that an adhesive tape is pressure-bonded to the surface of an adhesive protective film attached to the surface of a thin plate-like article, and the protective film is peeled from the thin plate-like article by the adhesive force of the adhesive tape, The peeled protective film is wound around the bobbin together with the adhesive tape. In the latter one disclosed in Japanese Patent Laid-Open No. 62-50835, a thin film is caused by a thin film raising means that causes a part of the thin film attached to a substrate, and a fluid is sprayed between the thin film and the substrate. The thin film is peeled off in the direction guided by the peeling thin film guide member, and the peeled thin film is discharged.

[0003]

However, the method of peeling via an adhesive tape disclosed in Japanese Patent Laid-Open No. 174677/1984 consumes a large amount of the adhesive tape because it is continuously peeled off with the adhesive tape. In addition, it is difficult to roll the peeled film neatly on the bobbin without causing wrinkles, which makes it immediately bulky and requires a replacement process in a short time, which also affects the substrate price. In addition, even in the case of recycling a release cover film, which has recently been required for resource saving, there is a problem that it is difficult to recycle the adhesive cover film and the cover film in a mixed state.

Japanese Unexamined Patent Publication (Kokai) No. 62-50835 discloses a method in which compressed air is blown from a nozzle after the initial peeling of a film to peel the film. However, dust generated in the surrounding environment by blowing compressed air. There was a problem that the film was wound up and adhered to the photosensitive layer on the substrate, resulting in a defect.

It is an object of the present invention to provide a film peeling apparatus which solves the above-mentioned problems and can recycle a cover film at a low cost and obtain a transfer substrate having a low defect.

[0006]

The object of the present invention is to:
In a film peeling device for peeling only a base film from a substrate having a laminated film provided with a photosensitive layer on a base film, the substrate is fixed and an adhesive tape is pressed against the end of the base film, and then the adhesive tape is attached. Partly peel off the photosensitive layer and the base film on the pull-up substrate, hold the base film, separate the adhesive tape from the base film, and then move the base film by sandwiching it with a peeling arm to move the base film to the photosensitive layer. It was achieved by a film peeling device characterized by peeling from the film.

In the peeling apparatus of the present invention, after the adhesive tape is pressed against the end of the laminated base film on the substrate, the adhesive tape is pulled up to partially separate the photosensitive layer and the base film, and the base film is held. Since the adhesive tape was separated from the base film, and then the base film was moved by sandwiching it with the peeling arm to completely peel the base film from the photosensitive layer, consumption of the adhesive tape was small,
Since the adhesive tape cover film is separated, the peeling cover film can be easily recycled and collected, and the dust can be peeled off cleanly without adhering to the photosensitive layer on the substrate to form a defect.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIG.
FIG. 1 is a schematic structural diagram of a film peeling apparatus of the present invention,
(A) is a side view of the apparatus, and (B) is a front view of the apparatus. The schematic structure of the device is a substrate fixing base 3 fixed to the device skeleton 8,
It is roughly classified into a peeling arm unit including a peeling fixed arm 6, a peeling rotating arm 7, and a peeling clamper 9 which are installed via a separate unit 4 and a single-axis robot 5.

The substrate 1 to which the laminated film 2 is attached is fixed to the substrate fixing base 3 by vacuum suction of the film with the film facing upward. When used as an automatic line device, the substrate transferred from the previous process device on the transfer conveyor is stopped and fixed on the fixed stage, and after the peeling process, the fixation is released and the next process device is transferred to the transfer conveyor. It gets on board and transported. As a substrate fixing method, there is also a method of mechanically clamping a portion where the laminated film is not attached.

The separate unit 4 includes an adhesive tape 12
A sticking head 10 for pressing the substrate 1 onto the substrate 1, an air cylinder 11 for driving it up and down, and an adhesive tape 12.
And an adhesive tape collecting reel 13 for collecting the adhesive tape. This separate unit 4 has an upper position 4c, a middle position 4b, and a lower position 4a.
And the vertical direction with respect to the direction perpendicular to the peeling direction of the peeling base film.

In the peeling arm unit, the peeling fixing arm reciprocates between the forward moving position 6a and the backward moving position 6b by the single-axis robot 5 moving back and forth in the peeling direction. The peeling rotation arm 7 is adapted to rotate upward from the horizontal position at a right angle.

FIG. 2 shows a detailed view of the tip portion of the separate unit 4. A spring and a pin are connected between the sticking head 10 having elasticity and the air cylinder 11, as shown in FIG. The sticking head 10 is passed through the hole formed in the middle of the separator guide 17 to the air cylinder 1.
When 1 moves in and out, the separator guide 17 is projected and retracted downward. Further, the board protection plate 18 is inserted from the board edge direction and abuts on the edge of the laminated film to insert the board protection plate 18a.
It works to stop at. In addition, temporary clamper 19
The rotation hits the separator guide 17 so that the release base film can be sandwiched therebetween.

FIG. 3 is an explanatory view showing the operation of the film peeling apparatus of the present invention. In FIG. 3A, the substrate 1 to which the laminated film 2 is attached is vacuum-adsorbed and fixed to the substrate fixing base 3. The separate unit is located at the middle position 4b in FIG.
At the same time, the substrate protection plate 18 is inserted from the substrate edge portion and the leading end thereof abuts against the laminated film end and stops at the substrate protection plate insertion position. Next, the tape application head 10 in which the adhesive surface of the adhesive tape 12 that is automatically supplied continuously from unwinding to winding is set to the outside, pushes the air cylinder 11 onto the end of the laminated film 2 on the substrate 1 to cause the spring. 15 is compressed and pressed so as to rotate around the pin 16 as a fulcrum. In that state, the adhesive tape 12 is adhered to the laminated film 2 and the surface of the substrate protection plate 18 and held for a while.

Next, in FIG. 3 (b), the separator unit moves up from the lower position 4a in FIG. 1 to the middle position 4b together with the adhesive tape 12. At that time, when the entire separator unit is lifted, the tape sticking head 10 is lifted so that the rotation returns with the pin 16 as a fulcrum.
The surface of the substrate protective plate 18 of the adhesive tape 12 is peeled off first,
The laminated film 2 is stuck to the adhesive tape 12 from the end thereof and peeling progresses, so that the laminated film 2 is partially peeled from the substrate 1.

Next, referring to FIG. 3C, the substrate protection plate 18
Is retracted to its original position, the temporary clamper 19 rotates, and the film 2 is sandwiched between the temporary clamper 19 and the separator guide 17 to be temporarily fixed.

Next, as shown in FIG. 3D, the air cylinder 11 is retracted, and the tape application head 10 is raised to the separator guide 17 to separate the adhesive tape 12 from the film 12.

Next, in FIG. 3 (e), the peeling clamper 9 clamps the film 2, the temporary clamper 19 removes the clamp, and the separator unit is in the middle position 4 in FIG.
Ascend from b to the upper position 4c.

Next, as shown in FIG. 1, a peeling clamper 9
With the film 2 clamped, the peeling rotation arm 7 rotates upward about the fulcrum, and the peeling fixing arm 6 moves from the forward position 6a to the backward position 6b to completely peel the film 2 from the substrate. After that, the peeling clamper 9 is opened, and the film 2 is dropped and accumulated in the waste film box. The substrate for which the peeling has been completed is released from the substrate fixing table 3 and the process proceeds to the next step.

FIG. 4 is an explanatory view showing the structure of the substrate to which the laminated film used in the present invention is attached. The laminated film 2 attached to the substrate 1 is composed of a base film 20, an intermediate layer 21, and a photosensitive layer 22. Peeling in the present invention means peeling the base film 20 of the laminated film 2 from the intermediate layer 21, which is generally the same as peeling the film attached to the substrate.

[0020]

According to the present invention, after fixing the substrate and pressing the adhesive tape to the end of the base film to bring them into close contact, the adhesive tape is pulled to separate the photosensitive layer and the base film, and the base film is sandwiched and held by the robot. After that, the adhesive tape is separated from the base film, and then the base film is completely peeled off from the photosensitive layer by the robot, so that the cover film can be recycled at a low cost and a low-defect photosensitive layer transfer substrate can be obtained. There is an effect that you can.

[Brief description of drawings]

FIG. 1 is a schematic structural view of a film peeling apparatus of the present invention, (A) is a side view of the apparatus, and (B) is a front view of the apparatus.

FIG. 2 shows a detailed view of a tip portion of a separate unit 4.

FIG. 3 is an explanatory view showing the operation of the film peeling device of the present invention.

FIG. 4 is an explanatory view showing the structure of a substrate to which a laminated film used in the present invention is attached.

[Explanation of symbols]

 1 substrate 2 laminated film 3 substrate fixing table 4 separate unit 4a separate unit lower position 4b separate unit middle position 4c separate unit upper position 5 single axis robot 6 peeling fixing arm 6a peeling fixing arm advance position 6b peeling fixing arm retracting position 7 peeling rotation Arm 8 Device frame 9 Peeling clamper 10 Tape sticking head 11 Air cylinder 12 Adhesive tape 13 Adhesive tape recovery reel 14 Adhesive tape supply reel 15 Spring 16 pin 17 Separator guide 18 Substrate protection plate 18a Substrate protection plate insertion position 19 Temporary clamper 20 Base film 21 Intermediate layer 22 Photosensitive layer

Claims (1)

[Claims] 1. In a film peeling device for peeling only a base film from a substrate having a laminated film having a photosensitive layer provided on a base film, after fixing the substrate and pressing an adhesive tape to the end of the base film. , The adhesive tape is pulled up, the photosensitive layer on the substrate and the base film are partly peeled off, the adhesive tape is separated from the base film after holding the base film, and then the base film is sandwiched by a peeling arm to move. A film peeling device for peeling a base film from a photosensitive layer.