JP2921315B2 - Adhesion method of conductive film - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of attaching a conductive film for attaching a driver lead to an electrode of a display panel such as a liquid crystal panel.

[0002]

2. Description of the Related Art As a driver for a display panel such as a liquid crystal panel, a TAB (Tape Automated B
Electronic components manufactured by the bonding method are often used. As a method for connecting the driver and the electrode of the display panel, a method of bonding the driver to the electrode of the display panel using an anisotropic conductive film is known.

In general, a process of attaching a conductive film to an electrode of a display panel includes a first process of drawing a conductive film wound around a supply reel below a transfer head by a drawer unit, and a first process. A second process in which the drawn conductive film is vacuum-adsorbed to the lower surface of the transfer head and cut to a predetermined length by a cutter, and the transfer head is lowered onto the display panel to be vacuum-adsorbed to the transfer head. A third process of attaching the conductive film to the electrodes of the display panel, and a fourth process of lowering the thermocompression bonding head to press the conductive film against the electrodes and bonding the conductive film to the electrodes. Conventionally, however, the second process is started when the first process is completed, the third process is started when the second process is completed, and the fourth process is started when the third process is completed. It starts Seth had become the fourth process begins completes the first process again.

[0004]

However, in the method of waiting for the completion of the previous process and starting the next process as in the above-mentioned conventional method, the whole process requires an extremely long time, and the work efficiency is reduced. There was a problem that did not go up.

Accordingly, an object of the present invention is to provide a method for attaching a conductive film, which can greatly reduce the tact time required for the entire process.

[0006]

Means for Solving the Problems] The present invention To this end, group
Positioning table device for positioning plate and supply reel
A drawer unit that draws out the conductive film wound around
Cutter that cuts the conductive film to a predetermined length and positioning
Supply above the substrate positioned on the table device
Adsorb the conductive film drawn from the reel and place it on the substrate electrode
The transfer head to be attached and the transfer head
And a thermocompression head for thermocompression bonding the conductive film to the substrate electrode.
A method for attaching a conductive film using the obtained conductive film attaching apparatus.
The conductive film wound around the supply reel into the drawer unit.
A first process of drawing further below the transfer head;
Transfer the conductive film drawn in the first process to the transfer head.
Vacuum suction on the underside of the
A second process of cutting into lengths, and
The transfer head is lowered onto the plate and
A third process of attaching a conductive film to the electrodes of the substrate;
Lower the thermocompression bonding head and press the conductive film against the electrode.
And a fourth process for thermocompression bonding the conductive film to the electrode.
And a scan, during the execution of the fourth process, the first
~ At least one of the third processes
It was made to overlap and run.

[0007]

In the first to fourth processes, the fourth process, that is, the process of bonding the conductive film to the electrode of the substrate by the thermocompression bonding head requires the longest time. So during the fourth process, by performing overlapping the other processes, can decrease cutting the time required for other processes, it can be shortened tact time required for the entire process by a large margin.

[0008]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is an overall perspective view of an apparatus for attaching a conductive film. Reference numeral 1 denotes a base on which a cover box 2 is installed. A support wall 3 stands upright inside the cover box 2, and a supply reel 4 and a take-up reel 5 are pivotally supported on the front surface of the support wall 3. The supply reel 4 and the take-up reel 5 are driven by a motor (not shown) to rotate. A conductive tape 6 is wound around the supply reel 4. As shown in FIG. 2, the conductive film tape 6 has an upper separator 6b adhered to an upper surface of an adhesive conductive film 6a, and a lower separator 6c adhered to a lower surface. Then, the lower separator 6c is peeled off from the conductive film 6a and wound on the take-up reel 5. 7 is a guide roller.

In FIG. 1, a bracket 11 is attached to a right front portion of the support wall 3. A cylinder 12 is installed downward on the bracket 11, and the cylinder 1
An upper block 13 is connected to the second rod. A lower block 14 is provided below the upper block 13, and the conductive film tape 6 includes the upper block 13 and the lower block 1.
The line 4 is sent to the right in the figure. The upper block 13 and the lower block 14 are clamp units, and clamp the conductive film tape 6 so that the conductive film tape 6 does not move when the conductive film tape 6 is cut by a cutter (described later).

On the base 1, a table device 20 for positioning the display panel 15 is installed. The table device 20 includes an X table 2 driven by a motor 21.
2, a Y table 24 driven by a motor 23, and a turntable 25. The display panel 15 is moved in the X direction, the Y direction, and the θ direction (horizontal rotation direction). The electrode 16 formed on the edge of the display panel 15 is aligned with a transfer head (described later) or a thermocompression bonding head (described later).

In FIGS. 1 and 3, reference numeral 31 denotes a Z table installed in the cover box 2. The Z table 31 is held in an X table 32 and a Y table 33. The X table 32 and the Y table 33 include ball screws 34 and 35, nuts 36 and 37 with which the ball screws 34 and 35 are screwed, and motors 38 and 39 for rotating the ball screws 34 and 35, respectively. When the 39 is driven, the Z table 31 moves horizontally in the X and Y directions. 41 is a guide rail, and 42 is a slider.

A bracket 44 is provided on the front surface of the Z table 31.
Is provided. The motor 4 is mounted on the bracket 44.
The transfer head 47 is connected to the rotating shaft 46 of the motor 45. The motor 45 rotates the transfer head 47 horizontally. A motor 48 is provided on the Z table 31. Inside the Z table 31, a ball screw 4 which is driven by the motor 48 and rotates.
9 are provided vertically. A nut 50 screwed to the ball screw 49 is provided on the back surface of the bracket 44. 52 is a guide rail in the Z direction, and 51 is a slider fitted to the guide rail 52. Therefore, the motor 48
Is driven, the transfer head 47 moves up and down. When the X table 32 and the Y table 33 are driven, the transfer head 47 moves horizontally in the X direction and the Y direction. In FIG.
Reference numeral 53 denotes a suction tube connected to the transfer head 47, which is connected to a suction device (not shown). The vacuum suction of the tube 53 causes the conductive film 6a to be formed on the lower surface of the transfer head 47. Vacuum suction.

In FIG. 1, a bracket 61 is provided on the right side of the cover box 2. A cylinder 62 is mounted on the bracket 61, and a thermocompression bonding head 64 is connected to a rod 63 of the cylinder 62. The thermocompression bonding head 64 has a built-in heater. In FIG. 1, reference numeral 71 denotes a drawing unit of the conductive film tape 6. The drawer unit 71 includes a clamper 72 that clamps the tip of the conductive tape 6, and is horizontally moved in the X direction by a moving unit (not shown). Reference numerals 73 and 74 denote vertical cutters provided on the side portions of the upper block 13 and the lower block 14, respectively. Reference numeral 81 denotes a monitor television provided on the front surface of the cover box 2, and reference numeral 82 denotes a keyboard. Supply
The conductive film tape 6 wound on the reel 4 is a drawer unit.
71, it is located above the display panel 15 as a substrate.
The transfer head 47 is pulled out below the transfer head 47
The upper separator 6b of this conductive film tape 6 is vacuum-adsorbed,
The cutters 73 and 74 are provided with the conductive film 6 a and the upper separator 6.
b is cut to a predetermined length.

This sticking apparatus is constructed as described above. Next, the operation will be described with reference to the operation diagram of FIG. 4 and the time chart of FIG. In FIG. 5, the vertical line indicates the first process, the diagonal line indicates the second process, the horizontal line indicates the third process, the reverse diagonal line indicates the fourth process, and the shaded line indicates the fifth process. I have.

First, as shown in FIG. 4 (a), the drawer unit 71 of the conductive film tape 6 moves to the left, and the clamper 72 clamps the leading end of the conductive film 6a and the upper separator 6b. Prior to this, the lower separator 6c circulates along the lower block 14 so that the conductive film 6a
And is wound up on a take-up reel 5 (FIG. 1).

Next, as shown in FIG. 4B, the drawer unit 71 moves to the right, and the transfer head 47 is lowered by driving the motor 48, and the upper separator 6b is vacuum-adsorbed on the lower surface thereof. I do. At the same time, the cylinder 12
The upper block 13 is lowered by projecting the rod 12a, and after the conductive film tape 6 is clamped and fixed by the upper block 13 and the lower block 14, the cutters 73 and
4 operates vertically to cut the conductive film 6a and the upper separator 6b to a predetermined length.

Next, as shown in FIG.
After releasing the clamped state by 2 and retracting the drawer unit 71 to the right, the transfer head 47 is raised. Next, as shown in FIG. 4D, the transfer head 47 moves onto a predetermined electrode 16 of the display panel 15 and descends there, thereby pressing the conductive film 6a against the electrode 16 and attaching it.
In this embodiment, the positioning of the transfer head 47 and the display panel 15 in the XYθ directions is performed by driving the X table 32 and the Y table 33.

As shown in FIG. 4D, while the transfer head 47 is pressing the conductive film 6a and the electrodes 16 of the display panel 15, the drawer unit 71 moves to the left as shown. Then, the state returns to the state shown in FIG. 4A, and the distal end portions of the conductive film 6a and the upper separator 6b are clamped. Prior to this, the clamped state of the conductive film tape 6 is released by retracting the rod 16 of the cylinder 12 to raise the upper block 13.

Next, as shown in FIG. 4 (e), the transfer head 47 moves above the upper separator 6b and sucks it by vacuum, and the upper block 13 descends to clamp the conductive film tape 6. Then, the conductive film 6a and the upper separator 6b are cut as in the case of FIG. At this time, the thermocompression bonding head 6
After landing on the upper separator 6b, the conductive film 6a is thermocompression-bonded to the electrode 16 of the display panel 15, and then rises and returns to the original position. The alignment between the thermocompression bonding head 64 and the conductive film 6a transferred on the display panel 15 is performed by the table device 20.
It is performed by Thereafter, the operation returns to the state shown in FIG. 4C, and the operations shown in FIGS. 4D and 4E are repeated as described above.

As described above, the conductive film 6a is adhered to the electrode 16 of the display panel 15. After that, the upper separator 6b is peeled off from the conductive film 6d by means (not shown), and the exposed conductive film 6a is removed. The leads of the driver are bonded thereon.

As is apparent from the time chart of FIG. 5, the thermocompression bonding operation of the thermocompression head 64 takes the longest time. Therefore, in the present method, during execution of the first thermocompression bonding operation by the thermocompression bonding head 64, a part of the drawing operation of the drawing unit 71, the retreat operation, the clamping operation of the clamp units 13 and 14, the cutter operation, A cutting operation by 73 and 74 and a vacuum suction / transfer operation by the transfer head 47 are performed. In addition, since the display panel 15 cannot be moved during the thermocompression bonding, the table device 20 operates while the thermocompression head 64 is not operating. As described above, by performing another operation while overlapping the thermocompression bonding operation of the thermocompression bonding head 64, the overall tact time can be greatly reduced and the working efficiency can be improved.

[0023]

As described above, according to the method for attaching a conductive film of the present invention, the conductive film is thermocompression-bonded to a substrate such as a display panel.
At the time of sticking, during the fourth process, that is , during the thermocompression bonding operation of the thermocompression bonding head , the first to third processes are performed.
Since at least one of the other processes is executed in an overlapping manner, the overall takt time can be greatly reduced, and the working efficiency can be significantly increased.

[Brief description of the drawings]

FIG. 1 is a perspective view of an apparatus for attaching a conductive film according to an embodiment of the present invention.

FIG. 2 is a sectional view of a conductive film tape according to one embodiment of the present invention.

FIG. 3 is a partial sectional view of an apparatus for attaching a conductive film according to an embodiment of the present invention.

FIG. 4 (a) is an explanatory view of a method of attaching a conductive film according to one embodiment of the present invention. (B) is an explanatory view of a method of attaching a conductive film according to one embodiment of the present invention. Explanatory drawing of a method for attaching a conductive film according to one embodiment (d) Illustration of a method for attaching a conductive film according to one embodiment of the present invention (e) Adhesion of a conductive film according to one embodiment of the present invention Illustration of the method

FIG. 5 is a time chart of a conductive film sticking operation according to one embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 4 supply reel 6 conductive film tape 6a conductive film 15 display panel 16 electrode 47 transfer head 64 thermocompression head 71 drawer unit

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 3/32 H05K 3/34 H05K 1/16 H05K 1/18 B32B 31/04 G02F 1/1345 H01J 9 / 20

Claims (1)

(57) [Claims] 1. A positioning table device for positioning a substrate.
And a drawer unit that draws out the conductive film wound on the supply reel.
And a cutter for cutting the drawn conductive film to a predetermined length
And the substrate positioned on the positioning table
Adsorb the conductive film drawn from the supply reel
A transfer head to be attached to the substrate electrode and a transfer head
Thermal pressure for thermocompression bonding the conductive film attached to the board to the electrode on the board
Of a conductive film using a conductive film attaching apparatus having a deposition head
A sticking method , wherein a first process of drawing a conductive film wound around a supply reel below a transfer head by a drawer unit; and a transfer head of the conductive film drawn in the first process. A second process in which the lower surface of the substrate is vacuum-sucked and cut to a predetermined length by a cutter, and the transfer head is lowered onto the substrate , and the conductive film vacuum-sucked to the transfer head is applied to an electrode of the substrate . a third process of attaching to, lowers the thermal bonding head pressed against the conductive layer on the electrode, and a fourth process of hot pressing wearing this conductive film to the electrode, the fourth process During execution of at least one of the first to third processes.
A method for attaching a conductive film, wherein